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Large PCB Company for 3-Layer PCB
PCBTok produces excellent customized PCBs like the 3-Layer PCB.
Normally, this product is by special request, since PCB stack-ups occur in even numbers.
As a consistent maker of Prototype PCB and OEM PCB, we accept the 3 Layer PCB challenge.
Inquire from our sales representatives now. We will answer you promptly.
Sophisticated 3-Layer PCB Method Applied
A 3 Layer PCB is a multilayer board. This stack-up design is in some applications, like to IT, industrial control, and consumer electronics
- For high-density interconnects (HDI) 3 Layer boards, we have PCB equipment.
- Responses to queries about specialty electronics products answered fast
- Sturdy, soldering work, and, if applicable, a complimentary soldering sample.
Contact us now to avail!
One of our products is a digital PCB, sometimes known as 3 Layer PCB.
Everything you’ll ever need about this special piece is covered in this feature write-up.
3 Layer PCB By Feature
A Customized 3 Layer PCB is one on which the customer has chosen to use particular modalities. Typically, this is a result of the design of microscopic components.
Although the Digital 3 Layer PCB has many uses, commercial sectors, especially in digital commerce, prefer it. This PCB powers many e-commerce functions and transactions.
No matter if it is a rigid PCB type or a flexible (FPC) kind, our production team can complete HDI 3 Layer PCB for your timetable preference.
If the PCBs are special for some consumers due to the device’s unusual design, Embedded 3-Layer PCBs are essential. Especially true for bulk product orders.
The capacity to adapt to high-speed internet is a distinguishing feature of 5G 3 Layer PCB. Your product’s on-the-go finalized design is taken into account.
Clients who must adhere to WAP, or Wireless Application Protocol, purchase substantial quantities of Wireless PCB. The repute of this sort of PCB is good.
3 Layer PCB By Thickness & Shape (6)
It is frequently used since it is the standard measurement for PCB stack-ups is 1 ounce. The 1 oz 3 Layer PCB is expected to operate typically.
But when the device would need more interconnects, the next weigh category for PCB is considered. This means using 2 oz 3 Layer PCB.
If you require a thick copper PCB with customizable layers, such as a tri-layer PCB, our 3 oz 3 Layer PCB makes things simpler for you. Just ask us for more details.
Our experience with PCBs referred to as Smart Watch PCBs serves as an example of a round 3 Layer PCB. But we also produce different round PCBs.
Working with the PCBTok design team is sometimes required for the Custom Shape 3 Layer PCB. We have developed cutting-edge PCB with wearable designs.
Jump Cut or V-scoring 3 Layer PCBs are other names for Panelized PCBs. Because of this quality, it becomes a much more affordable piece. Surely, these fit your budget.
3 Layer PCB By Surface Finish & Color (6)
ENIG is one of the frequently chosen surface treatments. Consequently, ENIG 3 Layer PCB is growing in popularity because of its superior protective trait.
Have no doubt about it, better circuit configurations are simply possible with Double-Layer PCB Layer than with Single-sided/ Single-layer PCBs.
Lead-free HASL 3 Layer PCB ensures adherence to RoHs regulations. This surface treatment is more commonly referred to as eco-friendly.
Red 3 Layer PCB is feasible. It is a better solution for your visuals if you are tired of seeing the usual green PCB. You need to specify it beforehand.
With the help of our personalized PCB soldermask colors, Blue 3-Layer PCB could also be produced. People are interested in this PCB for IT use.
High-quality components that are applied in a variety of automotive PCB sub-parts. For instance, these green PCBs are electrical accessory gadgets for electric cars.
Successful 3 Layer PCB Products
Your business will expand with the help of PCBTok’s 3 Layer PCB.
Our PCBs are made to last—they are very effective.
We incorporate efficient heat management into your product when you order a 3 Layer PCB.
As well, our capability in making HDI, High-Speed, and High-Power 3 Layer PCBs design will make you believe in us.
We’ve worked in the PCB industry for a very long time, and not only in China.
We are your everywhere-competent 3 Layer PCB provider.
Trustworthy 3 Layer PCB Process
Consumer, medical, and even computer PCBs are now included in the application of 3 Layer PCBs.
In sum, middle-range PCBs should not be used for single-sided applications. Even those intended for a high layer count.
That is why some PCB designers land on the 3 Layer PCB design.
To help them, we use contemporary 3 Layer PCB testing techniques.
We want to ensure the highest standard PCB and PCB assembly for this special kind of 3-layer PCB.
Thrive With Our PCB Support & Capability
We use modern 3 Layer PCB testing techniques like Micro Metallographic Section Analysis and Fixture Test to ensure the highest standard PCB and PCB assemblage.
Other tests cover the automated process (AOI), the complete set of thermal tests, pus solderability tests.
Also, we want to mention that if 3 Layer PCB assembly is included, we perform chip testing. This relates to ICs, microcontrollers and all BGA kinds.
Please ask PCBTok if you need further details.
Built-in Durability: PCBTok 3 Layer PCB
As a multilayer PCB fabricator, we have no issue making your 3-Layer PCB even though it is an unique item.
We are very used to customized requests.
In fact, we have made quite a lot of special, one-of-a-kind PCBs for leading brands in the electronics industry.
We are often an OEM or EDM PCB of choice for not just 3 Layer PCB, but for RF PCBs, SSD PCBs, Drone PCBS, and more.
If you want to avail of our offers, contact us now!
3 Layer PCB Fabrication
Departing from the usual 4 Layer or 6 Layer PCB count is the special 3 layer PCB product.
We are constantly keeping in touch with new innovations.
So, if you desire a special class of PCB like this, we can always accommodate it.
Reworkability is a benefit of the customized type of PCB like this one.
You will understand how we operate after studying this page.
We encourage you to consider innovative PCB designs.
Therefore, we are not restricting PCB designers who prefer this odd option.
We offer top-notch 3 Layer PCB production methods, such as:
Material to SMT/ PTH, Solder Paste Methods, 100% Visual Inspection—
And of course, Final Assembly as well as careful packaging.
We always aim to do 3 Layer PCB right by you!
OEM & ODM 3 Layer PCB Applications
We are very attentive when making this 3 Layer PCB for industrial equipment. With us, you won’t be spending money on a low-cost PCB part.
Due to their effectiveness in regulating heat, 3 Layer PCB for Power Applications is considered by some customers as a wonderful solution.
Given that LED devices need efficient cooling, several LED 3 Layer PCB for lighting applications are desirable. Arguably, this can be done with original 3 Layer designs.
As a supplier, having on stock 3 Layer PCB for Consumer Devices would be able to satisfy consumers of digital products who constantly demand supply replenishment.
The versatile 3-Layer PCB is a type of PCB appropriate for the automotive industry. This is referring to the peripheral components, not the engine components, which require more sophisticated multilayer PCBs.
3 Layer PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) | 0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) | 7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W | 1mil Deviation of Master A/W | ||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) | 0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area | ||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
3-Layer PCB – The Ultimate FAQ Guide
If you are not familiar with multilayer PCB design, you may be wondering what the most important issues are when designing a board. There are many factors to consider, from the number of layers to the wiring and alignment to the overall layout. If you have any questions, consider hiring a professional. Listed below are some of the most important questions to ask yourself when designing a multilayer PCB.
What are the advantages of a 3-layer PCB? In short, multilayer PCBs are more durable than single-sided PCBs. Because they have more layers and space, they can handle more circuits and add more functionality. Multilayer PCBs are ideal for high-end devices such as smartphones. These boards can perform many of the same functions as multiple single-sided boards.
The 3-layer PCBs have different layouts and bottom materials for the different layers. Alignments are located on the bottom and top layers of the 2-layer PCB. Each layer of the 4-layer PCB is connected to the next layer by a solid copper layer. The layout of these layers is critical to the success of your product, and a custom PCB design file should clearly define all planes that will be used. In addition to layout and routing, t3-layer PCBs have a wider variety of components.
The materials and characteristics of the layers used to create a 3-layer PCB vary. For example, one type has a metal core, while another is insulated with a conductive material. A special adhesive bonds these layers together. The insulating material protects the outer layers. Each layer is also separated by a conductive material. The board is usually multilayered.