Large PCB Company for 3-Layer PCB
PCBTok produces excellent customized PCBs like the 3-Layer PCB.
Normally, this product is by special request, since PCB stack-ups occur in even numbers.
As a consistent maker of Prototype PCB and OEM PCB, we accept the 3 Layer PCB challenge.
Inquire from our sales representatives now. We will answer you promptly.
Sophisticated 3-Layer PCB Method Applied
A 3 Layer PCB is a multilayer board. This stack-up design is in some applications, like to IT, industrial control, and consumer electronics
- For high-density interconnects (HDI) 3 Layer boards, we have PCB equipment.
- Responses to queries about specialty electronics products answered fast
- Sturdy, soldering work, and, if applicable, a complimentary soldering sample.
Contact us now to avail!
One of our products is a digital PCB, sometimes known as 3 Layer PCB.
Everything you’ll ever need about this special piece is covered in this feature write-up.
3 Layer PCB By Feature
3 Layer PCB By Thickness & Shape (6)
3 Layer PCB By Surface Finish & Color (6)
Successful 3 Layer PCB Products
Your business will expand with the help of PCBTok’s 3 Layer PCB.
Our PCBs are made to last—they are very effective.
We incorporate efficient heat management into your product when you order a 3 Layer PCB.
As well, our capability in making HDI, High-Speed, and High-Power 3 Layer PCBs design will make you believe in us.
We’ve worked in the PCB industry for a very long time, and not only in China.
We are your everywhere-competent 3 Layer PCB provider.
Trustworthy 3 Layer PCB Process
Consumer, medical, and even computer PCBs are now included in the application of 3 Layer PCBs.
In sum, middle-range PCBs should not be used for single-sided applications. Even those intended for a high layer count.
That is why some PCB designers land on the 3 Layer PCB design.
To help them, we use contemporary 3 Layer PCB testing techniques.
We want to ensure the highest standard PCB and PCB assembly for this special kind of 3-layer PCB.
Thrive With Our PCB Support & Capability
We use modern 3 Layer PCB testing techniques like Micro Metallographic Section Analysis and Fixture Test to ensure the highest standard PCB and PCB assemblage.
Other tests cover the automated process (AOI), the complete set of thermal tests, pus solderability tests.
Also, we want to mention that if 3 Layer PCB assembly is included, we perform chip testing. This relates to ICs, microcontrollers and all BGA kinds.
Please ask PCBTok if you need further details.
Built-in Durability: PCBTok 3 Layer PCB
As a multilayer PCB fabricator, we have no issue making your 3-Layer PCB even though it is an unique item.
We are very used to customized requests.
In fact, we have made quite a lot of special, one-of-a-kind PCBs for leading brands in the electronics industry.
We are often an OEM or EDM PCB of choice for not just 3 Layer PCB, but for RF PCBs, SSD PCBs, Drone PCBS, and more.
If you want to avail of our offers, contact us now!
3 Layer PCB Fabrication
Departing from the usual 4 Layer or 6 Layer PCB count is the special 3 layer PCB product.
We are constantly keeping in touch with new innovations.
So, if you desire a special class of PCB like this, we can always accommodate it.
Reworkability is a benefit of the customized type of PCB like this one.
You will understand how we operate after studying this page.
We encourage you to consider innovative PCB designs.
Therefore, we are not restricting PCB designers who prefer this odd option.
We offer top-notch 3 Layer PCB production methods, such as:
Material to SMT/ PTH, Solder Paste Methods, 100% Visual Inspection—
And of course, Final Assembly as well as careful packaging.
We always aim to do 3 Layer PCB right by you!
OEM & ODM 3 Layer PCB Applications
3 Layer PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“PCBTok is the most helpful, considerate, reliable, and resourceful PCB online business. Really appreciate the level of service and assistance they offer to engineers and PCB designers. Our requirements for assembly service were met. I have visited several times, and each time, they are kind, understanding, and welcome. I’ve been coming here for at least two years and have received guidance on numerous PCB possibilities. Thanks much!”Yoad Patish, Commodity Manager Tooling, Machinery & Equipment from Israel
“This is my go-to location for anything about PCB assembly, PCB parts and more. Sales person “H” is incredibly understanding and enjoyable to deal with. Additionally, a really easy checkout process, they do have. Despite the fact that I have some technological difficulties, they took the time to explain my alternatives and set up my prototype PCB so I wouldn’t have to worry about anything. I received excellent service and also had a good time!”Bogdan Sigal, CAD/PCB Librarian & Layout Enginee from Midlands, UK
“The PCBTok crew offered a lot of information on all PCB part brands and assisted me in making a decision. and advantages, they were thoroughly described. Yay, PCBTok is by far better compared to all other Chinse suppliers I have dealt with before. They truly went above and above. I’d advise everyone I know who like circuit boards to use this company and their services in particular!”Motti Schmuel, Materials Director from Brisbane, Australia
3-Layer PCB – The Ultimate FAQ Guide
If you are not familiar with multilayer PCB design, you may be wondering what the most important issues are when designing a board. There are many factors to consider, from the number of layers to the wiring and alignment to the overall layout. If you have any questions, consider hiring a professional. Listed below are some of the most important questions to ask yourself when designing a multilayer PCB.
What are the advantages of a 3-layer PCB? In short, multilayer PCBs are more durable than single-sided PCBs. Because they have more layers and space, they can handle more circuits and add more functionality. Multilayer PCBs are ideal for high-end devices such as smartphones. These boards can perform many of the same functions as multiple single-sided boards.
The 3-layer PCBs have different layouts and bottom materials for the different layers. Alignments are located on the bottom and top layers of the 2-layer PCB. Each layer of the 4-layer PCB is connected to the next layer by a solid copper layer. The layout of these layers is critical to the success of your product, and a custom PCB design file should clearly define all planes that will be used. In addition to layout and routing, t3-layer PCBs have a wider variety of components.
The materials and characteristics of the layers used to create a 3-layer PCB vary. For example, one type has a metal core, while another is insulated with a conductive material. A special adhesive bonds these layers together. The insulating material protects the outer layers. Each layer is also separated by a conductive material. The board is usually multilayered.
If you are designing PCBs for electronic devices, you may be wondering what a 3-layer PCB is, and this article will answer the question of whether you are designing a board for a phone, tablet, or any other type of electronic device. This new PCB offers many benefits, including enhanced functionality and flexibility. In addition, it reduces the number of layers, which increases the durability of the PCB.
A 3-layer PCB is a printed circuit board with three layers of copper foil. A thermally covered insulator holds these layers together and allows the copper foil to conduct electricity. This technology is ideal for compact designs such as smartphones and laptops. Because of their durability, 3-layer PCBs are also an excellent choice for medical devices. This technology is rapidly gaining popularity. With the cost savings associated with this type of board design, your device will have the performance you’ve always wanted.
3 Layer Rigid-Flex PCB
Although more expensive than its two-layer counterpart, this type of PCB is better suited for certain applications. It can improve signal integrity and reduce propagation levels but is much more complex. If you are designing a multilayer board, you may want to use four layers, but keep in mind that it is also more expensive than two layers. For most applications, it is best to stick with 2-layer PCBs.
Before you start actually building a 3-layer PCB, it is important to first grasp the concept of stacking. This is the process of connecting layers of different materials together. It also requires some planning to ensure that the board works properly. This is an outline of the stacking process. If you have a basic understanding of how electronics work, it should be easy to understand.
This stacking method has several advantages. It reduces radiation, while also improving signal quality and decoupling the power bus. However, there is no one method that meets all of these criteria. The following are the two main stacking procedures.
First, we must recognize that well-balanced stacking is critical to a good board. This will reduce deformability in areas that would otherwise prevent the installation of an assembled PCBA. A balanced stack also reduces the likelihood that the board will be deformed due to uneven copper coverage. At the end of this article, we should have a better understanding of the stacking process and how it can help you.
Stack-up for 3 Layer PCB
As electronic devices become more complex, so do the design and layout of PCBs. These complex circuits cannot fit on a single-layer PCB. Multilayer PCBs are composed of multiple layers of conductive and insulating materials. The resulting PCBs are thicker and more durable than single-sided PCBs. Carefully designed PCBs are preferable to PCBs with only one or two layers.
3-layer PCBs are often used in more complex devices and systems. They are more compact and durable than single-sided PCBs. More circuits and materials can fit on a multilayer PCB. They also have higher circuit density and can run at faster speeds. They are also lightweight and can be molded into smaller spaces. As a result, they are a popular component in modern electronics.
Multilayer PCBs have many layers, each of which contains one or more single panels. Its most complex multilayer PCB has 129 layers! To avoid post-solder problems, layer stacks are usually even with an even number of layers. In addition, special adhesives are used to separate the boards with solder resist layers on the outer boundaries. Multi-layer PCBs are also more durable and require less soldering than single-sided PCBs.
Choosing the right material for your PCB is crucial. The dielectric constant of the substrate is determined by the material used to manufacture them. The dielectric constant varies with frequency. Broadband applications are more prone to phase distortion. In addition, faster signal reflection is more effective because transmission line impedance decreases with frequency. The material’s dielectric breakdown voltage and resistance to leakage starting marks determine its ability to resist voltage gradients.
3 layer PCB Sample
3-layer PCB hole walls are usually made of conductive or plated copper. These plated holes connect the conductive layers of the PCB. In addition, when a multilayer board has multiple layers, adhesive smearing is usually created on the surface. This smear is removed using plasma etching or chemical decontamination to ensure that the copper layers are properly attached.
The first thing to realize is that 3-layer and 4-layer stacks are not the same things. While both can be used to manufacture circuit boards, they have distinct advantages. For example, 3-layer PCBs can be stacked more than twice as high, which significantly reduces the cost of the board. On the other hand, 4-layer PCBs can be made more complex, which significantly increases production time.
Another significant difference between 3-layer and 4-layer PCBs is their complexity. 3o-layer PCBs may not be suitable for devices with more delicate signals, while 4-layer PCBs are more expensive and difficult to manufacture. 4-layer PCBs have the advantage of having a larger surface area, which allows them to provide better insulation. However, they lag behind 4-layer PCBs when it comes to dealing with interference issues.
Stack-up of Multilayer PCB
The materials used to make 3e-layer PCBs are different from those used to make 4-layer PCBs. Although both types of boards are made from similar materials, they are manufactured differently. Copper foil and PP can be used to make 4-layer PCBs. high temperatures and high pressures are used in the production of these boards. The inner layers are then etched to create the circuitry, which increases the cost of the PCB.
Four copper layers are laminated together to form a 4-layer PCB. the same core material is used for the 3-layer PCB, plus a layer of prepreg. The prepreg is a soft glass fiber material that hardens when heated. The process-cured copper layer is more durable than a 3-layer PCB.