Flawlessly Manufactured 5G PCB by PCBTok

The 5G PCB technology has widely integrated into several industries and has brought various benefits in different applications through its designs and capabilities.

PCBTok will continuously produce high-quality 5G technologies in the market to ensure they can reach their maximum potential during operation.

In addition, this particular board has been recognized worldwide because of its high-speed characteristics, low latency, and enhanced connectivity.

Grab our newly improved 5G PCB technology today, and receive our best offers!

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PCBTok is Determined to Provide First-Rate 5G PCB

Among the manufacturers in the industry, PCBTok has already marked its excellence for over twelve (12) years by producing superior 5G PCB technology in the industry.

We offer various services to support and achieve your board’s specifications through our sophisticated technologies and quality raw resources.

Moreover, you can guarantee an excellent PCB product with us since we thoroughly conduct tests and inspections on it.

PCBTok has highly skilled personnel to provide our customers with complete satisfaction.

Our broad industry experience will enable it to fulfill even the most complex criteria you have for your board. We’ll be pleased to help you; inquire straight away!

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5G PCB By Feature

High-Frequency PCB

The High-Frequency PCB that we deploy this particular board into is widely used in advanced communication systems, military industry, radar systems, and medical systems because it is capable of withstanding extreme temperature settings

Radio Frequency PCB

The Radio Frequency PCB that we integrate this particular board into is capable of tolerating frequencies above 100 MHz but less than 2 GHz. In addition, due to their superior thermal control, they are used in high-power applications.

Microwave PCB

The Microwave PCB that we incorporate this particular board into can operate to a frequency of more than 2 GHz, which makes them different from the RF board. Moreover, it offers high stability, fine-pitch components, and affordability.

Millimeter Wave PCB

The Millimeter Wave PCB that we deploy this particular board into is commonly deployed in the communications industry, wherein they are frequently used for high-bandwidth WLAN. They are ideal for short-distance wireless transmission.


The HDI PCB that we incorporate this particular board into has a diverse range of applications, including in wearable technologies, healthcare, and aerospace industries, because of its exceptional thermal management and managed conductivity.

Multilayer PCB

The Multilayer PCB that we integrate this particular board into has become popular in the industry because of its lightweight construction, enhanced power, and higher density assembly. However, it can be complicated to manufacture.

What is 5G PCB?

In simple terms, the 5G PCB is the fifth generation of mobile broadband technology; it comes into three categories, low-band, mid-band, and high-band.

Among other generations, specifically in 4G boards, this technology offers more different applications.

This includes enhanced speed of transmitting data signals, lower latency that makes it more responsive due to its sub-6 GHz, increased connectivity that creates a much stronger connection, and better reach that can access networks of complex areas.

However, despite its numerous advancements compared to other lowest generations, its coverage is still limited. It still requires the assistance of the 4G technology.

Inquire today and grab our affordable but quality PCB products!

What is 5G PCB?
Why is 5G Essential in PCB?

Why is 5G Essential in PCB?

As we move along modernity, almost every device requires higher standards and faster technologies. Then, the 5G has become more in demand in the market.

The following are the factors that affect the importance of 5G technology in PCB:

  • Industrial Applications – Nowadays, multiple sectors that belong to this industry such as healthcare, automotive, and communications are requiring high-speed technology in their devices and machinery.
  • Customer Awareness – Since a lot of people are knowledgeable of the 5G technologies capabilities, they hold higher demand for this particular board.
  • Data Traffic – It could potentially lessen mobile traffic in 2024 by one-fourth.

Hints for Designing 5G PCBs

After selecting the suitable substrate material, we’d like to share some tips for effectively designing your 5G PCB technology. Here are some of our recommendations:

  • Materials – We highly suggest choosing components with a low dielectric constant (Dk) for enhanced proportionality with its frequency.
  • Solder Mask – It is recommended to apply fewer solder masks because they can have high losses due to their top moisture absorption.
  • Copper Traces and Plans – We recommend perfectly smoothing it since irregular surfaces and paths can increase resistive losses.
  • Automatic Inspection – We advise performing this to achieve consistent performance.
Hints for Designing 5G PCBs

Select PCBTok's Superb Quality 5G PCB

Select PCBTok's Superb Quality 5G PCB
Select PCBTok's Superb Quality 5G PCB

PCBTok’s extensive industry experience has given us the necessary knowledge to produce a top-notch 5G PCB technology that can suffice any application.

In addition, we are capable of fulfilling your desired board requirements without any concerns. Moreover, we will only use sophisticated materials in your product.

We fully possess international certifications in Canada and the US, including ISO-9001, ISO-14001, RoHS, and UL (E477880). Hence, you can put your complete trust in us to produce your product because we abide by the established guidelines.

Our experts meticulously evaluate our products to ensure we provide only top-tier products. Contact us today, and tell us your specifications; we’ll make it happen!

5G PCB Fabrication

What are the Challenges in Designing 5G PCB?

Three (3) factors contribute to the challenges in designing this particular board technology; we’ll talk about them below.

First, Mixed Signal Acceptance; since this technology accommodates high-frequency signals, it requires materials that can prevent signal loss.

Second, EMI Shield; can be prone to crosstalk and parasitical appearance. Thus, it is essential to separate the imperative traces.

Third, Thermal Management Challenges; the higher the speed it performs, the higher it emits. Thus, high thermal conductivity materials are crucial.

If you have any questions concerning this, call us immediately!

Opportunities of a 5G PCB

In today’s modern world, 5G PCB technology has increased demand. Thus, we’d like to share with you the opportunities of utilizing it.

One of the best opportunities to utilize this technology is its enhanced innovative features that don’t have performance issues slowing the system.

It offers more power to the device and can be easily integrated into various operations and industries. Also, its demand will continue to grow.

As more devices and machinery adapt to technological advancement, many consumers have expressed interest.

Immediately message us with any questions you may have about this.

OEM & ODM 5G PCB Applications

High-Speed Cellular Network

Since this particular board can offer remarkably high data rates contributing to faster data communication, they are widely used in high-speed cellular networks.

Smart Home

As technology advances, it requires a device that can connect to various electronics wirelessly without delays; this board can provide that.

Entertainment and Multimedia

Due to the capability of this technology to have a higher download and upload speed of up to 10 GBPS, streaming movies and videos online is made faster and easy.


One of the crucial factors in the logistics sector is tracking and managing its packages through their gadgets; hence, it requires faster technology to monitor them accurately.

Autonomous Driving

Due to the advancement of automotive, it now utilizes high-speed data links to detect certain obstacles with low latency; thus, they deploy this technology.

5G PCB Banner
PCBTok – Well-Trusted 5G PCB Chinese Manufacturer

All of the boards we produce have IPC Class 2 or 3 accreditation.

We offer turnaround service for products purchased within the 24-hour timeframe.

5G PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

Quick Quote
  • “At first, I was hesitant to purchase from PCBTok because of bad experiences with my previous manufacturers. However, I still took the risk and ordered from them. After receiving all my orders, I was relieved with how my products turned out; all of it is free from any damage, and they were working efficiently. I just realized that if I didn’t take a step, I wouldn’t be able to enjoy such luxurious PCBs. I sincerely thank the expert staff of PCBTok, who was very courteous and accommodating to my needs. All of you are truly amazing!”

    Lucas Johnson, Electronics Technologist from Montgomery, Alabama
  • “PCBTok has always been my go-to manufacturer whenever I need my PCBs to be reversed engineered; they really work my products flawlessly. I am always grateful that I found such an accommodating and professional producer in the market; their staff will surely listen to your desired specifications and provide that for you without any delays. That’s why I am definitely in love with this manufacturer; you’re much appreciated, PCBTok!”

    Wyatt Duke, Computer Hardware Professional from Cardiff, Wales
  • “It was a tough decision to leave my previous primary supplier, but luckily, I found PCBTok surpassed the capabilities of my former manufacturer. All concepts and ideas for my ordered PCBs were met without any issues. Also, I am thrilled whenever they provide me with their insights into my designed circuitry because I know that it will make my project way better than I expect it to be. I’ve received tremendous commendation and praise for my work because of the quality products that PCBTok supplied to me; they are really good at their profession. Thank you very much, PCBTok!”

    Brett Schneider, Project Engineer from Leicester, England
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