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Get Started with PCBTok's High-Tech 6-Layer PCB
In order to make the 6-layer PCB as reliable as possible, we strictly follow good design rules of the electronics industry and use high quality materials. With our many years of experience in manufacturing PCBs, we have optimized production processes and equipment so that our boards can reach accuracy. Here’s why you need it!
- 24h quick-turn service for your prototype PCB
- Offer 1-40layer different types of PCBs
- Accept third party factory audit and inspection before starting our business
- 100% E-test and AOI inspection
PCBTok’s 6-Layer PCB Quality
PCB quality is a major factor in determining the price of your PCBs. It’s very important that you choose a PCB shop that can provide you with high-quality boards at an affordable price, because if they don’t, then your project will be delayed and you might not get what you paid for.
When it comes to PCB manufacturing, make sure that the material used is FR4 (.062 inches thick). FR4 provides excellent durability without sacrificing any flexibility.
Also make sure that there are no copper voids on the board since these voids can cause issues later down the road when assembling your product or even during testing stages before shipping them out to customers.
If you’re looking for even more options when designing your next board layout, then PCBTok is definitely something to consider! PCBTok gives designers more flexibility with routing signals through a circuit board without having them cross over each other’s paths–and if they do cross paths then they won’t short out like they would with fewer layers of copper between them.
6-Layer PCB by Material
FR-4 6-Layer PCB is engineered for reliability, repeatability and longevity. It allows your design to be fabricated in the most cost-effective way possible while ensuring consistent performance with each new build.
Cost-saving alternative to traditional multi-layer printed circuit boards. It provides you with all the capabilities and performance of higher cost boards while significantly reducing the time and cost of your design cycle.
For high-reliability and quality manufacturing, with a balanced mixture of copper and silver plated copper for maximum thermal conductivity. Ideal for engineers looking to create smaller, more energy efficient boards.
Isola 6-Layer PCB is an advanced technology with high efficiency, small footprint and low power consumption. The components are equipped with thick copper traces, wider traces and holeless design.
Shengyi 6-Layer PCB is specially designed for the high-speed network and application markets. This product has excellent electrical performance, good manufacturing process control, as high as 90% yield rate.
The Kingboard 6-Layer PCB is the ideal choice for high power and large current consuming systems design, and can be used in most high-power applications that require a high efficient conductivity between all components.
6-Layer PCB by Surface Finish (6)
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An extra level of protection from harmful electrical interference. This is achieved by adding an additional layer with electroplated tin underneath the solder mask that acts as a built-in ground plane or shield.
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Most advanced 6 layer immersion silver technology provides a more reliable electrical connection and faster signal transfer between traces so you can get back to prototyping faster.
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This is a six-layer printed circuit board that allows you to add more advanced features to your electronics projects. It comes with an organic shield plane (OSP) on the top layer, which prevents moisture from entering through the top of the board.
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HASL is short for Hot Air Solder Leveling(HSOL), which ensures a better quality surface finish for your PCB. This 6-layer PCB contains 6 sides and each layer is separated with FR4 material. HASL finish is featured to avoid oxidation, sparks and so on.
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6-layer PCB with ENIG finish is the best solution for high frequency and power application. The ENIG (Electroless Nickel Immersion Gold) finish provides excellent adhesion between the solder mask and finishes of your printed circuit boards.
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ENEPIG 6-Layer rigid PCB, being one of our premium 6-layer products, comes with ENEPIG technology which ensures high quality production. It’s an ideal choice for a wide range of applications such as industrial electronics and more.
6-Layer PCB by Thickness (6)
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Our 0.8mm PCB is an excellent choice for customers looking to save space while creating a high-quality product. This option also allows you to create your own custom stackup, providing you with the flexibility you need to fit your needs perfectly.
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A complex and high density board. It can provide high thermal conductivity and enhance the signal transmission capability between different layers. In addition to the advanced design, it comes in various types of materials and finishes.
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For lower electrical resistance and allows for the board to be lighter than other materials. The copper layers ensure good current flow and heat dissipation in your designs, which helps prevent overheating and degradation of performance.
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With superior thermal dissipation and high bending strength for next-gen wireless charger applications. The top and bottom layers are made of copper, while the middle layers are made of FR4 material that achieve a thickness of 1.6mm.
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Our 2mm PCB is ideal for small form factor and IoT applications because of its small size, low cost and flexible design options. Its multi-layer construction makes it strong and sturdy, while an epoxy base ensures excellent heat dissipation.
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Ideal for more complex and advanced projects that require a larger space to implement board connections. The extra layers give you more room to connect components, making it easier to integrate more electronics into your circuit design.
PCBTok’s 6-Layer PCB Quick Turn Services
If you need a 6-layer PCB, PCBTok can make it for you! We can have your design ready in as little as one week, and we offer quick turn services to meet the needs of our customers.
The delivery time for 6-layer prototypes usually takes between two and four weeks depending on where in the world they are being made (shorter times mean faster shipping).
However, if there are any problems during manufacturing then this may push back delivery dates further than expected by several weeks—it all depends on how long it takes them to fix any mistakes found during this period!
You should always order early enough so that there isn’t too much hassle involved when trying to get started right away after ordering one near completion.
PCBTok’s 6-Layer PCB Product Certifications
PCBTok’s 6-Layer PCB Product Certifications are the following:
ISO 9001:2008 (Quality Management System), ISO 13485:2003 (Medical Devices), ISO 14001:2004 (Environmental Management Systems), TS 16949:2009.
In addition to the above certifications, the following are also included for our 6-layer PCB products:
ISO/TS 16949:2009 – Requirements for Automotive Suppliers; Quality Management System – Requirements for Assembly and Testing of Electrically-Operated Motor Vehicles.
ISO/TS 16949:2017 – Requirements for Automotive Suppliers; Quality Management System – Requirements for Assembly and Testing of Electrically-Operated Motor Vehicles in accordance with ISO 90012008/EN91002008 standards.
China’s Most Reliable 6-Layer PCB from PCBTok
6-Layer PCB is the most common type of surface mount assembly. A through hole board has holes through which components are soldered. The holes are usually arranged in rows and columns.
Through hole boards can be either single-sided or double-sided. Single sided boards contain only one layer where all components are soldered on it. Double sided boards have two layers, one for top side and another for bottom side. It is not necessary to solder all components in a double sided board. You can just solder some of them to reduce the cost and weight of your product.
At PCBTok we provide quick turnaround 6-Layer PCB services using high precision equipment and advanced technology at competitive prices with high quality products and services to our customers worldwide!
PCBTok’s 6-Layer PCB Made from High Tech Equipments
PCBTok is a professional PCB manufacturer in China. Our business includes PCB prototypes to mass production.
We made outstanding 6-layer PCB on copper foil, FR4, Rogers and other materials by using advanced high-tech equipment.
PCBTok is known for its high quality 6 Layer PCB manufacturing process with time-proven 6-layer fabrication equipment that produces boards of the highest quality.
Our state-of-the-art facility uses only the latest metal deposition technology and robotic assembly machines which helps us reduce our production times, while increasing product quality.
6-Layer PCB Fabrication
PCBTok’s 6-Layer PCB Standard Thickness is one of the most widely used and reliable PCB thickness. It’s fairly cheap, yet very effective for a wide variety of projects.
Standard thickness is often used in high speed applications and places where uniform thermal performance is required. It also helps in reducing the cost of board manufacturing, as it reduces the number of components needed and hence the amount of copper used per square inch on the entire board.
Many PCBs have a standard thickness of 1.6mm or 0.062 inches thick, although some thicker boards can be made up to 4mm or 0.157 inches thick with extra cost per square inch.
With PCBTok’s 6-Layer PCB Surface Finish, you can be assured that your PCB will have improved connections, increased durability, and a finish that resists corrosion.
PCBTok’s 6-Layer PCB Surface Finish is a process in which we clean, bake and rinse the printed circuit board surface. This protects the copper traces and other components on your boards from oxidation and corrosion during testing, storage or shipment.
PCBTok’s Surface Finish process completes the surface finish with a transparent lacquer coating that provides superior durability and protection against tarnishing, scraping, abrasion and other environmental factors.
OEM & ODM 6-Layer PCB Applications
The 6-layer PCB with the enhanced performance of higher continuity and reduced tracking impedance than the conventional 3-layer PCB, ensures the more reliable connectivity.
Designed for the aerospace industry to meet reliability, precision and thermal requirements. The top layer is copper, and there is no need for any special materials.
The 6-Layer PCB for Consumer Electronics is a flexible and lightweight product. This PCB consists of six layers, which makes it extremely durable and versatile.
Stands out among others with its outstanding durability and reliability. With our PCB design, you can produce the product accurately and get your expected quality results.
Perfect choice for your high-end medical equipment to ensure perfection. With the use of 6-layer lamination, high thermal conductivity and reliable strength are both guaranteed.
6-Layer PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
6-Layer PCB: The Ultimate FAQ Guide
If you are not familiar with PCB design, this book will help you get started. It will help you throughout the design process, from board selection to assembly. This guide will also cover the basics of 6-layer PCB manufacturing. In this guide, we will discuss the various types of PCBs and answer some of the most FAQs about them.
The main benefit of a 6-layer PCB is that it has more signal paths than a 4-layer board, which allows for more components and a higher net count. In addition, the basic 6-layer stack-up uses the same signal layout as a 4-layer board but adds the signals to the center of two additional stack-up. While this can improve EMC, it is not always the best choice for many applications.
6-layer PCBs consist of lightweight components that do not require connectors. They have a simple layout and clear labeling, making them ideal for miniature devices. In addition, their stacking saves material and space, making them ideal for smaller devices. In addition, 6-layer PCBs are easier to assemble and connect, making them a better choice for smaller devices.
When designing a 6-layer printed circuit board, keep in mind that higher-density layouts are more efficient when it comes to power wiring. In fact, power cabling can be done on a single layer, freeing up space for components. In the process, the power and ground layers can be interleaved. Signals can also be routed using additional layers.
The stack of 6-layer PCBs is a critical design parameter that can have a significant impact on the performance of your product. There are many reasons to use a 6-layer board in your design. For starters, this board is much lighter than its counterpart. In addition, it requires fewer connectors, which reduces the overall weight of the board.
６-Layer PCB Stack-up
Another reason to use this stacking is that it allows you to use power rails on a single layer. The signal layer is usually surrounded by two layers of power, but to balance EMI, a single power rail can be placed on L4. To prevent capacitive coupling, the other two layers can be grounded. This way, no two parts of the board are in direct contact.
The second reason for using stacked layers is to reduce signal layer shielding. You can reduce the number of external shielding cans by using separate power and grounding layers. Stacking also allows for denser board layouts and smaller footprint areas. They also simplify wiring because four signal layers and one ground layer can be wired on the same board.
The stacking of 6-layer PCBs is an important step in the manufacturing process. This process guides the entire production process and determines the materials to be used. It is also known as the bill of materials and helps to plan the materials correctly. The material is cut to the proper size during the stacking process. Depending on the application, stacking may require different types of machines.