Progressive AlN Substrate in Your Printed Circuit Board

The AlN substrate is a special material utilized in making Ceramic PCBs.

If you’re using this kind of material for high-frequency applications like telecommunications,

It will function better, and this will benefit your sales.

Numerous customers have relied on PCBTok to create circuit boards using this kind of material for years.

For your happiness, we provide unrivaled high-class products using AlN.

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Incorporate AlN Subtrates from PCBTok

We are a leading manufacturer of PCBs, including PCBs made with AlN material. We provide premium circuit boards at prices that are affordable for you.

  • These products have IPC Class 2 and 3 PCB certification.
  • Custom PCB design and prototype services are available from us.
  • Prior to large orders, we provide a free sample upon request.
  • There is no MOQ for any order
  • Our sales team is available to you round-the-clock.

Only PCBTok can easily produce better PCBs with AlN for you than any other company.

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AlN Substrate By Feature

naked AlN substrate

This board is “naked,” meaning it is made entirely of ceramic and has no components or routing. It can be utilized for projects.

Prototype AlN Substrate PCB

You will benefit from rapid development for the prototype PCB when you use reliable, error-free AlN material in your job.

Ceramic AlN Substrate PCB

AlN is a type used in ceramic PCBs, so they are occasionally called ceramic. Though, there are other ceramics substrates.

Multilayer AlN Substrate PCB

AlN is a material that can be used in multilayer PCBs; particularly in the semiconductor industry, these are an affordable choice.

High Tg AlN Substrate PCB

Customers use AlN material primarily for its high Tg, so it stands to reason that this is preferred for power applications.

LED AlN Substrate PCB

Customers who require LED lighting must choose between Metal Core and AlN. Both are suitable for continuous, long-term use.

What is AlN Substrate?

It is a ceramic substrate material with the following features:

  • High thermal conductivity
  • Strong dielectric property
  • Minimal and desired expansion factor

Because of AlN’s capabilities, it is ]frequently selected in in PCBs for:

High-power LED lighting, sensors, ICs and microcontrollers, RF devices, etc.

Oxidation is prevented even when exposed to 137 Celsius heat.

In addition, the material can be metallized using techniques similar to those used with alumina and beryllium oxide.

What is AlN Substrate
Why Use AlN Substrate on Circuit Boards

Why Use AlN Substrate on Circuit Boards?

Customers are drawn to AlN’s adaptability heat in particular. The strength of it against harsh elements is a plus. What they like:

  • 0% water absorption, ideal for moist environs
  • Efficiency compared to other substrates like FR4
  • Low thermal expansion coefficient (3 to 4 ppm/C)
  • Strong mechanical structure with a 450 MPa value.
  • Thermal conductivity range (170 W/mK – 230 W/mK)

It makes sense if you consider the typical user of this substrate, such as the telecom industry.

Applications of AlN Substrate

It was previously mentioned that the major players in the telecom industry use the AlN substrate extensively.

However, there are some additional industries. If you choose a reliable manufacturer, the business is likely to be producing ODM or OEM PCB for businesses in the following industries:

  • A variety of military devices
  • Aerospace and flight equipment
  • Backplanes or PCBs that connect other PCBs
  • Computer memory modules
  • Highly complex and simple medical tools
  • Lighting and display modules because of the high heat involved in it
Applications of AlN Substrate

A Reliable Supplier of AlN Substrate PCB

A Reliable Supplier of AlN Substrate PCB
A Reliable Supplier of AlN Substrate PCB 2

At PCBTok, we carefully and precisely manufacture PCBs using a unique manufacturing process.

The majority of consumer, industrial, and medical electronic products are built on flexible and rigid-flex types of polyimide.

We begin by choosing the best ecologically sound material for your project.

We at PCBTok are proud to produce PCBs of the highest caliber available. All of our products are expertly made and covered by a satisfaction guarantee.

AlN Substrate PCB Fabrication

Advantages of AlN Substrate

Despite appearing expensive, this material is actually affordable due to its high level of efficiency. Consider the following:

  • AlN material is mechanically robust in addition to being heat resistant. It has a wide range of applications.
  • It makes for a superior copper conductor, particularly when DPC Ceramic processing is applied.
  • Compared to Beryllium Oxide (BeO), it is a good substitute because it follows environmental safety restrictions.
  • Additionally, it has a remarkable capacity for insulation, preventing accidental contact with other PCB surfaces.
Manufacturing Options Available for AlN Substrate

AlN substrates are used in semiconductor industry because it can function even when exposed to daily usage and/or non-stop use.

Keep in mind that AlN is a type of ceramic PCB as well.

So, two of the Four Processes used to create ceramic PCBs are DBC Ceramic Processing and DPC Processing.

The LTCC (Low Temperature Co-firing) and HTCC (High Temperature Co-firing) are the other two additional processes. Reminder for packing: AlN materials are very photosensitve. For final covering, the item needs to be tightly protected from sunlight.

AlN Substrate banner 2
PCBTok’s Special PCB with AlN Substrates

If your circuit board contains AlN Substrates,

You should anticipate the best performance.

AlN Substrate PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “I would heartily recommend PCBTok to anyone searching online for a PCB supplier. In June, I received my PCBs from them. The team made the process simple and easy-going. They responded quickly, addressed all of my inquiries, and provided me with the details as soon as they became available. In general, I detest dealing with salespeople, but all of these guys are excellent. Once more, many thanks for making the purchasing process simple!”

    Mylan Chevrier Production Manager from Rouen, France
  • “I’m content with the PCBTok team. Digital applications helped to speed up the transaction, and all of the PCBs were genuine. Fastest PCB purchase I’ve ever made. These people treat their customers well, have an effective manufacturing process, and know what they’re doing. They very effectively follow up. They follow through on their promises. Additionally, they were a joy to work with. I won’t be placing my future orders anywhere else.”

    Cauã Bonilla, Shipping Supervisor from San Pedro Sula, Honduras
  • “In my line of work, satisfaction with PCB suppliers is uncommon, but PCBTok made me extremely happy. I called back numerous times with numerous questions, and each time they resolved the problems even though they weren’t required to. I’ve always been a very picky customer when it comes to PCB suppliers. They will also receive referrals from my friends and coworkers because they meet my standards. My coworkers at the company appreciate their hard work.”

    Liam Lewis, IEC Engineer from Queensland, Australia
What are the Material Properties of AIN Substrate?

In terms of relevant properties of the AlN substrate, consider the following:

Regarding its thermal properties, it has a thermal conductivity of 170 W/mK at 25°C and a coefficient of thermal expansion between 2.5 and 3.5 ppm/°C at RT 500°C.

It has a dielectric loss value of 3×10-4, a dielectric constant of 8 – 10, a dielectric strength of > 17 KV/mm, and a volume resistance of > 1014 cm for electrical properties.

Lastly, its mechanical characteristics include 302 GPa elasticity rating, a flexural strength of up to 380 MPa, and a surface roughness of 0.3 to 0.6 m.

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