Precisely Produced Aluminum Nitride Substrates by PCBTok

The Aluminum Nitride Substrates have a standard color of grey or white ceramic material with a 3.26 g/cm3 density. Also, it has excellent insulating properties.

Since all of our boards have gone through 100% E-Test and AOI, PCBTok is more than capable of delivering you a spectacular Aluminum Nitride Substrate PCB.

Additionally, we provide 24-hour quick turnaround, sample pieces before mass production, and IPC Class 2 or 3 compliance for all our boards.

Order your Aluminum Nitride Substrates today and take advantage of our fantastic offers!

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Supplying Best Quality of Aluminum Nitride Substrates

PCBTok has been in the PCB construction industry for over twelve years; we fully understand any of your circuit board design specifications.

We can produce customized Aluminum Nitride Substrates to your liking, starting from the initial concept of it until the shipment of your orders.

However, no need to worry if you already have a Gerber file; we can still work it out and run through additional inspections to ensure your designs are flawless.

All of our expert personnel are available 24/7 to address all of your PCB concerns.

If you’re seeking a company that will value your principles and PCB requirements, then look no further since PCBTok can provide that for you. Inquire now!

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Aluminum Nitride Substrates By Feature

Multilayer Plate

The Multilayer Plates that we incorporate this particular substrate into are ideal for aerospace devices, medical instruments, and many other applications that require complex circuitry. In addition, it has better quality, density, and durability.

DBC Ceramic Plate

The DPC Ceramic Plate that we integrate this particular substrate into has a proven exceptional solution for electrical insulation and thermal control for semiconductor modules. However, it has reduced thermal conductivity.

DPC Ceramic Plate

The DPC Ceramic Plate into which we incorporate this particular substrate has superior CTE value and excellent thermal conductivity. Moreover, they are highly suitable for high-power applications due to their superb copper conductors.

Customized Plate

The Customized Plate that we integrate this particular board into can be ideal for applications that require individual personalization. In addition, if planning to deploy additional components than usual, this is an excellent alternative for it.

Thin Film Plate

The Thin Film Plate into which we incorporate this particular board can be a suitable option if seeking exceptional usability. Moreover, it has a compact design and size; however, it can be relatively expensive compared with the thick film plate.

Ceramic Plate

The Ceramic Plate into which we integrate this particular substrate has an excellent thermal conductivity value of 150 up to 180 W/mK. In addition, they possess good chemical stability; thus, they are used in high-frequency power supplies.

What is Aluminum Nitride Substrates in PCB?

In essence, the Aluminum Nitride Substrates possess high thermal conductivity with a strong dielectric and low expansion value. Thus, making it the finest ceramic substrate material in the market that is highly accessible.

Due to the capability of this substrate in PCBs, they are commonly chosen as the best option for High Power LEDs, Sensors, ICs, and others.

Since there are possibilities of experiencing surface oxidation due to air, this particular substrate has an Aluminum Oxide Layer that can protect it from up to 137°C.

In addition, this substrate is capable of metallization methods similar to alumina and beryllium oxide. Hence, they are ideal for high wear resistance operation.

Grab our newly improved quality of Aluminum Nitride Substrates today!

What is Aluminum Nitride Substrates in PCB?
Characteristics of Aluminum Nitride Substrates in PCB

Characteristics of Aluminum Nitride Substrates in PCB

As mentioned previously, Aluminum Nitride Substrates have been widely used in various industries; hence, we’ll give you an insight into its primary characteristics.

  • It has a notable thermal conductivity of 170 W/mK up to 230 W/mK
  • It has a Low Coefficient of Thermal Expansion with a value of 3 to 4 ppm/C.
  • In terms of its operating temperature, it can be very low or high.
  • As for its dielectric loss, it has been categorized as a small low.
  • It is highly resistant to wear, heat, and chemical.
  • It has high mechanical strength that has a value of 450 MPa.
  • As for water absorption, it has a rate of 0%.

Material Properties of Aluminum Nitride Substrates

In terms of the Aluminum Nitride Substrates’ material properties it has been divided into four (4) categories; we have, physical, electrical, mechanical, and thermal.

  • Physical – It has a grey or white color, 0% water absorption, and 30% reflectivity.
  • Electrical – It has a dielectric loss value of 3×10-4, a dielectric constant of 8 up to 10, a dielectric strength of > 17 kV/mm, and >1014 Ω·cm for volume resistance.
  • Mechanical – It has a hardness value of 9.3, an elasticity value of 302 GPa, a flexural strength of up to 380 MPa, and 0.3 to 0.6 µm of surface roughness.
  • Thermal – It has a coefficient of thermal expansion at RT 500°C with a value of 2.5 to 3.5 ppm/°C and thermal conductivity at 25°C with a value of 170 W/mK.
Material Properties of Aluminum Nitride Substrates

Choose PCBTok's Premium Grade Aluminum Nitride Substrates

Choose PCBTok's Premium Grade Aluminum Nitride Substrates
Choose PCBTok's Premium Grade Aluminum Nitride Substrates

In choosing the right manufacturer for your Aluminum Nitride Substrates, it is crucial that the company has an extensive experience in the field – that PCBTok possess.

Moreover, we have set a high standard in producing your circuit boards; hence, we conduct meticulous quality control to ensure that they’ll operate flawlessly.

We will not deliver a product that hasn’t met nor exceeded our set standards; we are performing this to guarantee you a worthy output. In terms of PCB Design, we offer a versatile service and can provide you with authentic and up-to-date software.

All of our products have undergone a thorough Flying Probe Test, In-Circuit Test, and all of the necessary inspections required by the international guidelines.

Inquire today! We’ll be delighted to guide you throughout the purchasing process!

Aluminum Nitride Substrates Fabrication

Benefits of Aluminum Nitride Substrates

Aluminum Nitride Substrates can offer a wide array of advantages in your applications, some of which are already mentioned in previous article sections.

Firstly, it has exceptional insulation capacity (>1.1012 Ωcm). Secondly, it has outstanding metallization capability. Third, it has very low adherence.

Fourth, it can be an excellent alternative to Beryllium Oxide since it is non-toxic to the environment. Fifth, it has remarkable surface flatness.

Sixth, it has excellent dimensional stability even when exposed to extreme temperature conditions. Finally, it has excellent tolerance to wear and corrosion.

If you have any questions about this substrate, kindly contact us directly.

Are Aluminum Nitride Substrates PCBs Expensive?

One of the considerations to take in purchasing a product is its cost; hence, we’d like to give you an insight into the rate of the Aluminum Nitride Substrates.

Generally, the answer to this question can be either yes or no. Since if they are compared to standard PCBs, they can be costly due to their materials.

In comparison to Rogers and Metal Core PCBs, this substrate has a higher processing cost per piece. Also, its lower panel size contributes to its price.

However, since this substrate has exceptional thermal properties, it led to the complete module being simplified. Therefore, it has reduced its overall price.

Kindly message us your specifications; we’ll try to give you the best deals!

OEM & ODM Aluminum Nitride Substrates Applications

Medical Technology

Since this substrate has high resistance to chemical and heat, they are commonly utilized in medical technologies wherein it is prone.

Military Applications

Due to the substrate’s capability to withstand extreme temperature conditions, they are widely preferred in military device applications.

Electronic Sensors

Every electronic sensor might require exceptional tolerance to wear and corrosion; thus, they frequently utilize this particular substrate in their PCBs.

LED Lighting

One of the features of this particular substrate is its non-toxic ability; hence, they are commonly deployed in LED lighting wherein it is beneficial.

Aerospace Industry

Since this substrate can operate even when subjected to high temperatures while maintaining its dimensional stability, they are used in the aerospace industry.

Aluminum Nitride Substrates Banner
PCBTok | Top-Tier Aluminum Nitride Substrates Supplier

We have full possession of UL certification, both in Canada and the US.

All of our manufactured boards have undergone stringent inspections.

Aluminum Nitride Substrates Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “My experience with PCBTok is exceptional; they have an organized process in working out my orders, and their expert staff has shown great professionalism towards me. All of the desired outcomes in my ordered board have been fully met; it shows how thorough they prioritize their customer’s needs. Thus, I highly recommend them for any concerns about your circuit boards. Thank you so much, PCBTok, for your exemplary service and top-notch quality of products.”

    Adam Wheeler, Electronics Technician from Nashville, Tennessee
  • “After months of searching for my top PCB manufacturer, I have found PCBTok, which has met my standards. They have the most helpful, respectful, courteous, and professional expert team who have assisted me all-throughout my transaction with them. Also, they have provided me a report on progress concerning my orders; it was such a commendable move of them. Now for their qualities, all of them are efficiently working, and none have any defects. I have nothing more to say than how thankful I am to this Chinese Manufacturer; thanks a lot, PCBTok!”

    Dalton Hale, Procurement Component Manager from Nottingham, England
  • “To be perfectly honest, I hadn’t found any negative traits in PCBTok; they are my real definition of perfection. I was glad I found them and purchased from them because of their remarkable services and products. They didn’t let me experience any hardships while dealing with them; it felt very relaxing on my end. If you’re still looking for your producer, I strongly advise you to try PCBTok; they are well-experienced in this field.”

    Nicholas Dawson, Process Engineer from Winnipeg, Manitoba
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