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Outstanding and Highly Satisfactory Amplifier PCB from PCBTok
We are proud to announce that we have received an outstanding and highly satisfactory amplifier PCB from PCBTok. Based in China and has been in the business of manufacturing circuit boards for over 12 years. Our services include:
- 24h quick-turn service for your prototype PCB
- Offer free sample before the mass production order
- No minimum order quantity for your new order
- Engineering questions(EQ) will be sending within 1-2hours
- Offer COC report, micro-section, and soldering sample for your order
Increase Signal Capabilities with Amplifier PCBs of PCBTok
Amplifier PCBs are an integral part of any electronics project. Whether you are building a power amplifier, audio amplifier or oscillator, we have the right product for your needs. These devices can be used in different applications like audio amplifiers, RF amplifiers and radio frequency circuits. They are available in different configurations such as single stage and multi-stage devices.
If you’re looking for a way to increase the signal capabilities of your circuits, you might want to consider using Amplifier PCBs from PCBTok. These boards are specially designed with the intent of amplifying signals, which can be useful for many applications. The board itself is made from FR-4 material, which means that it’s strong and durable enough to withstand daily use.
As your company grows, so does the need for a reliable signal. The first step to achieving this is by using PCBTok’s amplifier PCBs. These are small PCBs that can be used in a variety of ways to boost the signal in your system. They can be used as an active component or as a passive component, depending on how you want to implement them.
Amplifier PCB By Type
Voltage amplifiers are the simplest in design and have the lowest internal noise of any type amplifier. They are characterized by low output resistance, high input impedance and high open-loop gain.
Current amplifier is a basic, but very useful and common circuit. It takes in a small current (usually DC), and outputs another much larger current. The output signal always has the same polarity as the input signal.
Power amplifiers are used to amplify a signal. They convert a low-power signal to a higher power one. An audio amplifier turns the weak signals coming from your stereo speakers into a louder, more powerful audio signal.
The intermediate frequency amplifier is a class of amplifiers that are used in superheterodyne radios, in which the incoming signal is mixed with a local oscillator to produce sum and difference frequencies.
Enables the input signal of broadcast or transmitted information to control an output signal. The amplifier uses frequency-determining networks to convert the input signal into an output signal.
Ultrasonic amplifier is a high-frequency signal amplifier specifically designed to handle ultrasonic frequencies. Most often used in piezo transducer and sensor applications, up to tens of megahertz.
Amplifier PCB By Classification (6)
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The Class A amplifier is a basic, single-stage design. It utilizes a single switching transistor in the standard common emitter circuit configuration to create an inverted output.
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Class B amplifiers also conduct during both halves of the input cycle; however they conduct with opposite polarity. The result is reduced switching loss and increased efficiency.
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Class A/B amplifiers combine the reliability and robustness of class A operation with the efficiency of class B operation to achieve even higher power efficiency.
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One of the most efficient classes of power amplifier is a class C amplifier. A transistor conducts less than 180°, but this reduces distortion at the expense of efficiency.
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Class D amplifier is an output switching waveform, higher than the highest audio signal that needs to be reproduced for it is this high frequency switching.
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Switch to a higher voltage when the audio signal wave has a peak value that is a higher voltage than the level of the supply voltage, reducing heat and increasing efficiency.
Amplifier PCB by Function (5)
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Direct-coupled amplifiers are a type of amplifier that permits signals with zero frequency, also referred to as direct current, to pass from input to output. Constructed for low impedance inputs and outputs with active or passive preceding elements.
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Buffer amplifiers are electrical devices that provide electrical impedance transformation from one circuit to another, with the aim of preventing the signal source from being affected by whatever currents that the load may be produced with.
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Video amplifiers are used in video cable extension, video recording systems and other applications where analog video signals must be amplified, buffered and filtered. Common applications include video cable extension, floppy disk head amplifiers.
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An operational amplifier is an electronic device that helps amplify small electrical voltages. It does this by taking a small input voltage, converting the voltage into an output voltage. Used in many circuits today for devices’ operational capability.
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Transistor amplifiers are a common device in electronics. A transistor acts as an amplifier by raising the strength of a weak signal. The DC bias voltage applied to the emitter base junction, makes it remain in forward biased condition.
Highest Quality Manufacturer of Amplifier PCB | PCBTok
PCBTok is a leading manufacturer of amplifier PCB. We have been manufacturing PCB for over 10 years, and we provide high quality services to our customers at an affordable price.
Our manufacturing process is done in-house, which allows us to maintain tight quality control on every aspect of your order. Our skilled workers are dedicated to ensuring that your order meets or exceeds your expectations, even when it comes to small details like solder mask color and silk screen colors.
We also offer custom design services for any PCBs you may need. If you have any questions about our products or services, please feel free to contact us today!
Advance Fabrication of Amplifier PCBs in PCBTok
The fabrication of an amplifier PCB is a complex process, requiring a lot of precision and expertise. At PCBTok, we have been in the business for over 12 years, and we are proud to say that we have mastered this art. Our team of engineers has worked hard to come up with innovative solutions that make our products stand out from the rest.
At PCBTok, we understand that you need reliable results every time without fail. It is designed to amplify signals at frequencies. The board has been fabricated using FR-4 material and has been made with a thickness of 1 oz., which makes it very strong while also allowing it to be lightweight.
PCBTok’s Short Turn Time and Fast Delivery Amplifier PCB
PCBTok understands that when you need your PCBs to be made quickly, it can be a difficult task to find a reliable manufacturer. Our team has been able to accomplish this task with ease through our short turn time and fast delivery amplifier PCB services.
We understand that each client has their own unique requirements, which is why we take the time to learn about your product before we begin production. We make sure that every aspect of our process is examined so that we can provide you with quality service at an affordable price.
Qualities and Characteristics of Amplifier PCB | PCBTok
The quality and characteristics of an amplifier PCB are important factors to consider when choosing a PCB for your next project.
There are several qualities to look for in an amplifier PCB, including:
- High input impedance. This is very important at the input signal as it helps the voltage drop entirely on the amplifier.
- Limited bandwidth. A wide bandwidth means that more frequencies can be amplified by the circuit, but this can also mean that you have a lower frequency response and increased distortion.
- High open-loop gain. This is how much gain your circuit will have before feedback kicks in and starts to reduce it.
- Low output impedance. The lower the output impedance, the less distortion there will be in your sound wave after amplification.
Amplifier PCB Fabrication
An amplifier is a device that increases the power of an output signal. It is used in many electronic devices, such as radios and televisions, as well as industrial machines. An amplifier can also be used to boost an audio signal for a sound system.
There are several different types of amplifiers, each with its own characteristics and uses. The most common types are Class A, A/B, B and C amplifiers. In addition, there are other types of amplifiers that have been developed specifically for certain applications. All available here at PCBTok!
The input impedance of a circuit is defined as the ratio of voltage to current at the input terminals.
Amplifier PCBs with high input impedance provide more damping for transients, which means they can handle more sudden changes in signal and are less susceptible to noise.
Amplifier PCB’s high input impedance is the ability to isolate a signal from its source. This is important in many cases, especially when the amplifier is receiving signals from a wide range of different sources.
OEM & ODM Amplifier PCB Applications
Amplifier PCB’s used in Television incorporate many features, including high performance, economic operation and product reliability. Our amplifiers are designed to deliver consistently high quality results.
There are many types of amplifier that can be used in radio. Amplifiers can be used as radio amplifiers which increase the power level of a signal, or as radio frequency amplifiers that amplify the frequency range of a signal.
Amplifier PCB’s used in oscilloscopes are one of the most important parts of an oscilloscope. The amplifiers are the medium through which a signal is converted into voltage or current form so that it can be displayed on the screen.
PCB’s used in music instruments need to carry a high current load, while the signal they carry through the circuit needs to be very low. This circuit uses an optoisolator as input and output device, protecting the signals from noise.
Amplifier PCBs used in microwave will be designed and developed by our experts. We are a leading supplier of microwave PCBs with an experienced team of engineers who design, manufacture and test all components using state-of-the-art technology.
Amplifier PCB Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
