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Verified Arlon PCB Producer
PCBTok, with its broad manufacturing capabilities, can offer the most competitive price for high-quality Arlon PCB.
- High-end PCB equipment, always updated
- Mobile PCB & Waterproof PCB can also be designed
- Follow ISO 14001:2015 for Environment Safe Practices
- We deliver to your doorstep anywhere in the world
Call now and take advantage of our quick and free quote for your Arlon PCB!
Confidence With PCBTok’s Arlon PCB
Our well-organized facility manufactures a wide range of Arlon PCB products.
We guarantee that your order will follow your specs.
Zero errors and zero incorrect installations are what we aim for, always.
To acquire the finest outcomes, collaborate with PCBTok for long-term projects.
With us, your electrical equipment is in good hands.
Only trust a skilled fabricator, such as PBCTok, to ensure the quality of your Arlon PCB.
Arlon PCB By Feature
No other PCB material can offer 250⁰C temperature for glass transition other than Arlon 33N PCB. Fire-resistant as it is a polyimide material.
As a lead-free PCB prepreg, the Arlon AD1000 PCB is known for its Dk of 10.2. At this value, it distinguishes itself from the other low loss materials.
The Arlon TC350 PCB is ceramic-filled. These can be used to create multilayer or double-layer PCBs, although single-layer PCBs are not recommended.
The Arlon AD350A PCB is strengthened with durable woven fiberglass elements. We can produce this specific type of PCB of any layer as an OEM for you.
Arlon Rogers PCB can be utilized with Power Supply, AC-DC converter PCB, etc. Notably for high voltage vibrating machinery and generators, it’s very a good option.
When you require lead-free circuit boards that are acceptable for RF functions, Arlon PTFE Teflon PCB can be your go-to option. They’re dependable.
Arlon PCB By Type (6)
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Flexible Arlon PCBs can be completed by our production team. We even produce PCBs for outer space using Arlon laminates and advanced prepregs.
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Many commercial and industrial industries favor the 1 ounce PCB thickness when using Rigid Arlon PCB boards, by far, this is the best-selling spec.
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Rigid-Flex Arlon PCB is necessary for industrial applications needing regular use. Customers who utilize these wireless PCBs like computers, medical equipment typically advance-order.
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Due to its adequate high heat thermal resistance, High Frequency Arlon PCB won’t force you to go over your budget. This lessens device damage.
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For RF/Microwave Arlon PCB, electronic designers and PCB engineers must rely on reputable circuit board manufacturers like PCBTok.
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Arlon components are made for heavy-duty PCBs with longevity in mind while maximizing HDI function, which is why HDI Arlon PCB is a premium item.
Arlon PCB By Layer (6)
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Typically, our Multilayer Arlon PCB is a wireless PCB. It is made for devices with wireless interfaces, like WiFi 6 routers, modems, and controllers.
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The cost of the Double-Sided PCB Arlon is its greatest asset. You always receive a winning product when you allocate it for medium or simple appliances.
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Personalization is one of the main benefits of a Prototype Arlon PCB and Customized Arlon PCB.
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Using 16 Layer Arlon PCB and the best PCB Ink, Taiyo Ink, we achieve the best results. Our copper clad Arlon PCB solutions are well-known.
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Gold, ENIG, and OSP are some of the high-end materials utilized to surface finish the 20 Layer Arlon PCB surface finish. Even though they are complex multilayer boards, it’s do-able.
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Both the uplink and downlink connectors of satellite PCBs might benefit from using 30 Layer Arlon PCB. Additionally, it can be applied to aeronautics.
We Are Mass Makers of Arlon PCB
We pride ourselves for the ability to create and produce Best-in-Class Arlon PCBs of all types and shapes.
Even on a large scale, a sheer amount of Arlon PCBs can be produced.
When it comes to creating such complex PCBs like the Arlon line, PCBTok employs a continuous improvement technique.
To ensure excellent product manufacture, we test often, even if it is a big batch.
Just give us a few days’ heads-up, and we can deliver your bulk order without a hassle.
PCB-Making Expertise
Our clientele are happy with these cutting-edge Arlon devices. It’s because we ensure power distribution and effective current load. In addition:
- For mounting ICs and microcontrollers, you can utilize SMD and PTH.
- Create your PCB 1 up to 40 layers
- Copper thickness can be ranging 0.15 mm to 6 mm.
- We can produce Arlon PCB that is transparent and lightweight
Customers of ours who try us once keep on coming back for more. So, give us a try today!
Quality Assured PCB Raw Materials
We make sure our raw materials pass global regulations—we know this is important for our customers.
PCBTok guarantees the highest standards for your lighting, industrial control, and aerospace PCB requirements.
Additionally, we produce large orders for printed circuit boards.
Panel sizes and PCB stack-up layers are available in a range to meet your demands.
The best grade PTFE, ceramic, and copper cladding raw materials are all used. They are all safe and effective.
Arlon PCB That Generates Growth
We help businesses like yours grow.
With us, all of your Arlon PCB requirements are met.
Not only that, we have outstanding Quality Control measures in place. It’s vitally important—
We don’t want customers to experience any inconvenience.
As a PCB technician or a manager, these Quality Assurance points undoubtedly improve your bottom line.
Arlon PCB Fabrication
PCBTok’s economical option wins over customers.
Because we have been in the industry longer and have greater expertise, we don’t make the same mistakes as our rivals.
In actuality, we have a solid reputation as an EMS supplier distributing Arlon PCB.
As a result, our Arlon PCBs are sold all over the world.
We are a company that cuts cost for you. So, we are valued by both huge enterprises and SMEs.
Rigorous testing plus Arlon raw materials result in the best customized Arlon PCB.
- Functional tests, microscope tests, and AOI guarantee functionality
- Contemporary methods like SMT and DIP applied
- If you only require source materials, we provide them.
- There are Arlon PCB that use FR4 processing, we carry these too.
Last but not least, the PCBTok’s affordable pricing quickly wins you over!
Contact us to avail immediately.
OEM & ODM Arlon PCB Applications
The main electrical parts of IT systems are connected by PCBs, among other things. Industrial cloud computing, backup, data storage, etc. all use our Arlon PCB.
Our Arlon PCB for Telecommunication is constructed from a durable composite of fiberglass, ceramic, or PTFE. Just ask for it, and long-lasting telecom equipment is yours to use for longer.
Maximum dependability is a priority in the particular fabrication of Arlon PCB for Aeronautics and Outer Space. They are all classified as IPC Class 3 as a result.
Electric, gas-powered, and diesel engines can all use Arlon PCB for automotive applications. For maritime vessels, we also offer waterproof Arlon PCB.
Our PCBs can be used with hybrid machinery with IoT capabilities. We can also adapt PCB for a self-driving vehicle, smart appliances, and etc.
Arlon PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Arlon PCB – The Completed FAQ Guide
The rise in demand for Arlon PCB is having an effect on the product’s demand. However, there are a few things you should know before purchasing it. To begin with, Arlon PCB is not your typical PCB. It makes use of modern technologies and necessitates a unique design. This necessitates that manufacturers exercise extreme caution during the manufacturing process to avoid any potential errors.
You will find all the information in this FAQ guide.
The most important thing to remember when selecting an Arlon PCB manufacturer is to choose the best. Choosing the wrong manufacturer can lead to complete project failure. Choose a PCB manufacturer that has extensive experience with Arlon boards. In addition, they must use cutting-edge technology to make the best Arlon boards. Experience is also important. This will allow you to explore the various options for Arlon board customization.
When using Arlon materials, Arlon PCB designs are similar to standard printed circuit boards. The stacking and schematic layout process may be similar. However, to ensure proper flow and execution of the design, use the latest board design software. You can use the right software to create a PCB prototype that works as expected. Once the prototype is ready, it is time to start testing.
Arlon TC350 PCB
Use copper foil layers and through-holes for electrical connections. Copper foil is used for a variety of purposes, including circuit wiring, grounding, and power overlays. Another important component of Arlon PCBs is copper foil. It effectively protects your components from UV damage while maintaining the rigidity of your PCB. High-quality Arlon PCBs can withstand a wide range of temperatures. It is ideal for use as a lead-free ceramic chip carrier.
The thickness of the Arlon PCB is another important consideration in deciding between it and a standard PCB. Arlon PCBs are thicker and contain more copper than standard PCBs. To build the best Arlon PCB, choose a top contract manufacturer with extensive experience and expertise. Consider the thickness of the copper foil when choosing a contract manufacturer.
You should know these part numbers if you plan to design boards using Arlon materials. Arlon materials are constructed in the same way as standard printed circuit boards, using the lamination method. The board design process is similar, but you will need to use current PCB design software to ensure that the details are executable and that the prototype will work.
Arlon materials are available in a variety of forms. You can use Arlon 47N, a modified epoxy low-flow resin with a glass transition temperature of 350 degrees C. It also has a 0.1% moisture absorption, which is required by IPC-4101/21.
Arlon materials are designed to prevent heat generation when exposed to high RF levels. As a result, they have low-loss dielectrics, making them ideal for high-frequency applications. Arlon materials are used in a variety of high-temperature applications, including fuel cells, military, and high-temperature displays. Part numbers are easy to identify, so it’s easy to find what you need.
When looking for Arlon materials, look for a company that sources the material and provides manufacturing and assembly. Arlon’s unique chemistry makes it ideal for industrial applications and high-performance PCB circuits. Arlon also offers low-loss thermoset lamination systems. You will then be able to select materials for your PCBs.
Polyimide Products:
| Resin | Description | Tg (°C) | Z-Axis Expansion (%) | UL-94 Rating | Td 5% (˚C) | H₂O Absorp (%) | Tc (W/m-K) | IPC4101 Class | Comments |
| 33N | Flame Retardant Polyimide | 250 | 1.2 | V0 | 389 | 0.21 | 0.2 | GIL /40 /41 | Max Flame Retardance |
| 35N | Flame Retardant Polyimide | 250 | 1.2 | V1 | 407 | 0.26 | 0.2 | GIL /40 /41 | Reduced Cure Time |
| HF-50 | Powdered Poly Hole Fill Compound | 250 | 0.55 | N/A | >400 | 0.4 | 0.5 | N/A | Hole/Via Fill Compound |
| 84N | Filled Polyimide Prepreg | 250 | 1 | Meets HB | 407 | 0.3 | 0.25 | GIL /40 /41 | Filling Heavy Copper |
| 85N | High Temp Polyimide | 250 | 1.2 | HB | 407 | 0.27 | 0.2 | GIL /40 /41 | Optimum Long-Term Stability |
| 85HP | High-Performance Polyimide | >250 | 1 | Meets HB | 430 | 0.32 | 0.5 | GIL /40 /41 /43 | Tc (W/mK) is 2x Polyimide |
| 84HP | Filled Polyimide Prepreg | >250 | 1 | Meets HB | 430 | 0.32 | 0.5 | GIL /40 /41 /43 | Fills Thick Copper Layers |
Low Flow Products:
| Resin | Description | Tg (°C) | Z-Axis Expansion (%) | UL-94 Rating | Td 5% (˚C) | H₂O Absorp (%) | Tc (W/m-K) | IPC4101 Class | Comments |
| 37N | Low Flow Polyimide Prepreg | 200 | 2.3 | Meets V0 | 340 | <1.00 | 0.3 | GIJ /42 | Rigid-Flex Applications |
| 38N | 2nd Gen Low Flow Polyimide Prepreg | 200 | 1.5 | Meets V0 | 330 | <1.00 | 0.3 | GIJ /42 | Enhanced Rheology Rigid-Flex |
| 47N | Modified Epoxy Low Flow | 135 | 3.5 | V0 | 315 | 0.1 | 0.25 | GFG /21 | Heat Sink Bond, Low Temp Cure |
| 49N | Multifunctional Epoxy Low Flow Lead | 170 | 3.1 | V0 | 303 | 0.1 | 0.25 | GFG /26 | Rigid-Flex, Heat Sinks |
| 51N | Lead-Free Epoxy Low Flow | 170 | 2.6 | V0 | 368 | 0.15 | 0.25 | GFG /126 | Lead-Free Solderable, Rigid-Flex |
Epoxy Products
| Resin | Description | Tg (°C) | Z-Axis Expansion (%) | UL-94 Rating | Td 5% (˚C) | H₂O Absorp (%) | Tc (W/m-K) | IPC4101 Class | Comments |
| 44N | FIlled Epoxy Prepreg | 170 | 2.2 | V0 | >300 | 0.1 | 0.3 | GFG /98 | For Via/Clearance Hole Fill |
| 45N | Multifunctional Epoxy Low Flow Lead | 175 | 2.4 | V0 | >300 | 0.1 | 0.25 | GFG /26 | High Layer Count MLBs |
There are many benefits to using Arlon PCBs for PCB design. Due to its unique chemistry, it is suitable for a wide range of applications. Its high dielectric constant makes it ideal for electronic applications where signal speed is critical. In addition, the laminate allows it to flow well. As a result, it is an excellent choice for PCB manufacturing. How does Arlon PCB differ from other materials?
Arlon Laminates
The low-loss dielectric thermoset material in Arlon PCB materials prevents heat generation in high-frequency RF applications. Polyimide is a high-performance plastic with excellent heat resistance used in the manufacture of Arlon PCB materials. It has a wide range of applications, including high-temperature displays, fuel cells, and military uses. Some of the properties of Arlon PCBs are listed below.
Another important property of Arlon boards is the copper foil. Because of its low dielectric constant, it is ideal for lead-free ceramic chip carriers. However, the copper foil on Arlon PCBs must be precisely spaced and sized. Copper foil is known for its excellent thermal performance. The lower the temperature of the conveyor line, the more copper foil is used. The copper foil must be compatible with the resin compound.
The main advantage of Arlon PCBs is that they are very durable and offer many benefits. Polyimide is a polymer composed of high-performance plastic-like monomers. It is extremely heat resistant and can operate in an RF environment without rapidly rising in temperature. PTFE and silicone are two other materials used in PCB manufacturing. Arlon, silicone, and PTFE are among these materials.
These PCB materials are a combination of woven glass fiber reinforced resins and controlled expansion ceramic fillers. They have low dielectric and static constants over a wide temperature range. Therefore, they are ideally suited for use in radio systems and other high-frequency components.
The polyimides in the third-generation polyimide family are designed for maximum temperature resistance and thermal stability. For example, Arlon’s 33N and 35N polyimides are suitable for applications requiring high temperatures and low Z-axis directional shrinkage. In addition, because they can withstand lower temperatures and shorter cure times, reinforced polyimides are suitable for PCB manufacturing. Printed circuit boards made with Arlon 84N polyimide compounds are ideal for those who need clearance holes in the alignment. These polyamides are also suitable for applications requiring high-level count MLBs.
35N Arlon PCB
Polyimide resins are the PCB industry standard. Epoxy, polyimide, and high Tg epoxy resins are examples of their various types. Polyimide has a wide range of applications in PCB manufacturing, including high-temperature resistance, low loss, and microvia PCBs. for more information on these materials, please visit the websites listed below.
Arlon 45NK woven Kevlar-reinforced laminates have a coefficient of thermal expansion (CTE) of 6.0 ppm per degree Celsius. This is an excellent choice for lead-free ceramic chip carrier accessories. Compared to other PCB materials, Arlon 45NK has a moderately low CTE. The copper-yin steel-copper distribution restraint sheet and nonwoven aramid reinforcement are at acceptable levels.