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Best BGA Assembly from PCBTok For Your PCBs
Your product, whether it’s high tech or low tech, needs to be assembled to reach the market. BGA assembly is one of the simplest methods of board-level circuit assembly, and it can provide a convenient solution for mass production if you don’t have time or resources to make your own circuits from scratch.
- Over 12 years PCB manufacturing experience
- All printed circuit boards meet IPC Class 2 or 3
- No minimum order quantity for your new order
- Provide 8D quality report for each quality complaint
PCBTok Offers Worry-Free BGA Assembly Services
As a printed circuit board (PCB) manufacturer, we know that the BGA assembly process can be daunting.
That’s why we offer worry-free BGA assembly services to our clients.
We have a team of experienced engineers who will work with you to ensure that your PCB is assembled correctly and efficiently.
Plus, we use the latest technology and equipment to ensure that your PCB meets the highest standards.
So if you’re looking for a trusted and reliable BGA assembly partner, look no further than PCBTok!
PCBTok have a 100% satisfaction guarantee so you can be sure that you’re getting the best possible service. Contact us today to learn more about our BGA assembly services!
BGA Assembly by Feature
Micro BGA Assembly is smaller form factor than the standard BGAs, but they are still packed with power. Micro BGAs are named as such because they measure only 3mm x 3mm.
Utilize circuited tape as the die carrier mounted to a printed circuit card or board. Used for chips with leads and pins, such as analog devices and microprocessors.
The POP BGA Assembly package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages.
Has insulation properties and provides protection against electromagnetic interference (EMI) caused by other nearby circuitry on adjacent boards and signals from external sources.
Molded Array Process BGA Assembly Mold and solder a low-profile array of surface mount packages using a grid of solder balls for electrical connections.
Thermally Enhanced Plastic (PET) is used for L-lead BGAs because it has the lowest dielectric constant and capacitance. The lead frames are bonded to the chip with a fluxless technique.
BGA Assembly by Package Type (5)
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Discrete logic and memory packages, PoP Package Type has the ability to reduce the number of pins and increase power density.
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Good thermal performance and lower resistance, making it easier for automated placement with reduced risk of defects.
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Leadless, small size with moderate heat dissipation. QFNs are found in many devices where the thermal budget is modest.
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Provides electrical connection from each wire to individual transistors on the silicon device being packaged.
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Its low inductance and improved thermal operation make it an excellent choice for today’s most demanding applications.
BGA Assembly by Soldering (5)
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Solder Paste Printing uses pre-cut stencils with openings which are pressed onto the PCB, and solder paste is forced out from between the openings.
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The phase in which our react component mounts on the DOM. Has its own state, and this becomes independent from other instances of that same component.
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Reflow Soldering is a process where solder paste is used to temporarily attach one or thousands of tiny electrical components to their contact pads.
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If you’re looking for a cost-effective solution to fixing your device, BGA rework service remove and replace the faulty components or PCBs with brand new ones.
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Joining metal surfaces with solder to create a strong and electrically conductive joint. Using only your hands, you will get the perfect amount of solder on each pad.
BGA Assembly Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Why PCBTok is the Most Trusted Source for BGA Assembly in the Industry?
As a PCB manufacturer, we have been in the business for over 10 years. We have printed circuit boards that are used in a variety of industries, including telecommunications, automotive, medical, and more.
Our BGA assemblies are of the highest quality and we have a team of highly skilled engineers who are able to deliver on our promise of quality products.
We are also able to provide our customers with competitive pricing and quick turnaround times.
Our goal is to always exceed our customer’s expectations and to build long-lasting relationships.
We are proud to say that we have satisfied customers all over the world.
If you are looking for a reliable source for BGA assembly, look no further than PCBTok!
PCBTok’s BGA Assembly Process in PCB Fabrication
BGA, or ball grid array, is a type of surface-mount packaging used for integrated circuits. A PCB manufacturer in China that offers this service is PCBTok.
BGAs are used when space on a circuit board is at a premium, or when the heat produced by the device requires special thermal management.
PCBTok’s BGA assembly process begins with the inspection of all materials before any assembly begins.
The next step is to solder the BGA onto the PCB. This is done by first creating a stencil of the BGA on the PCB.
Once the stencil is in place, solder paste is applied to the BGA and then it is placed on the board.
PCBTok’s BGA Assembly’s Advantage
PCBTok is the most trusted BGA assembly manufacturer from China. We offer our clients a number of advantages, including:
- Quality – We use the highest quality materials and components to manufacture our products. This ensures that our products are durable and reliable.
- Competitive Pricing – We offer competitive pricing on all of our products. This allows our clients to get the best value for their money.
- Fast Turnaround Times – We understand that our clients need their products as soon as possible. That’s why we offer fast turnaround times on all of our orders.
- Experienced Staff – Our team is composed of experienced professionals who are dedicated to providing the best possible service to our clients.
BGA Assembly Process: Why Is It Important in PCB Manufacturing?
BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits. BGAs are used to permanently mount devices such as microprocessors.
A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
The whole assembly process is important in ensuring the longevity and quality of your PCBs.
We, at PCBTok, ensure both the quality and robustness of our products. That’s why our BGA Assembly Process has been long trusted by our loyal customers.
PCB Drilling Fabrication
PCBTok is a leading manufacturer of PCBs in China.
We have been in business for over 10 years and have gained the trust of many clients. We offer a wide range of services, including BGA assembly.
Our BGA assembly components are of the highest quality and are trusted by many clients. We offer a variety of services to our clients, including BGA assembly, and we are always looking for new ways to improve our products and services.
With such affordable prices, PCB Tok provides PCB fabrication and PCB assembly with low MOQ.
Contact us today to find out more about how we can assist you with your project!
PCBTok is a PCB manufacturer that specializes in BGA assemblies in the past 12 years.
PCBTok BGA Package Type is the most trusted in China.
It offers superior quality and reliability compared to other brands. Plus, it’s more affordable than most competitors.
PCBTok is renowned for their experienced team of engineers and technicians as well as their state-of-the-art equipment and facilities, which allow them to deliver high quality BGA services to even the most complex of assemblies.
With PCBTok, you’ll get reliable and high-quality work for a price that you can afford.
OEM & ODM BGA Assembly Applications
Used in manufacturing thermometer PCB. The BGA Assembly for Thermometer PCB has a ball grid array which is the size of a ball bearing.
An interface board is a PCB with a set of connections to the motherboard. Often smaller than the motherboards and include ports.
Our dedicated teams, experienced engineers and high-quality manufacturing facilities help you complete your Memory PCB with ease.
For elevator board assembly, quality control for each phase of production, including the final phase of testing and packaging.
Delivers Analog PCB prototypes and small series of high quality PCB assemblies. We developed an automated system for assembling analog boards.
BGA Assembly Production Details As Following Up
- Production Facility
- Cable Assembly Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| Supported Capabilities | |
| Types of Assembly | THD (Thru-Hole Device) |
| SMT (Surface-Mount Technology) | |
| SMT & THD mixed | |
| 2 sided SMT and THD assembly | |
| Order quantity | 1 to 10,000 boards |
| Components | Passives parts, smallest size 0201 |
| Fine pitch to 8 Mils | |
| BGA, uBGA, QFN, POP, and Leadless chips | |
| Connectors and terminals | |
| Component Package | Reels |
| Cut tape | |
| Tube and tray | |
| Loose parts and bulk | |
| Board dimensions | Smallest size: 0.2″ x 0.2″ |
| Largest size: 15″ x 20″ | |
| Board shape | Rectangular |
| Round | |
| Slots and Cutouts | |
| Complex and Irregular | |
| Board type | Rigid FR-4 |
| Rigid-Flex boards | |
| Assembly process | Leaded process |
| Lead-Free (RoHS) | |
| Design file format | Gerber RS-274X |
| BOM (Bill of Materials) (.xls, .csv, . xlsx) | |
| Centroid (Pick-N-Place/XY file) | |
| Sales and support | Emails |
| Phone calls | |
| Electrical testing | X-ray Inspection |
| AOI (Automated Optical Inspection) | |
| Functional testing | |
| Oven profile | Standard |
| Custom | |
| Turnaround time | 1-3 days for only PCB assembly |
| 10-16 days for turnkey PCB assembly | |
| 3-4days Quickest turnkey Prototype PCB assembly |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
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BGA Assembly – The Ultimate FAQ Guide
If you’re assembling BGA components, you’re probably wondering where to start. Fortunately, this guide will answer all your questions! This guide contains information about the various processes you can use to make them, as well as answers to many of the most frequently asked questions. First, you should understand the basics of BGA assembly. It is critical that you purchase the necessary equipment before you begin. BGAs are very precise and there are several steps you must take to ensure success.
Testing your PCB is the first step in BGA assembly. Special equipment is required to properly check the solder joints. To check the solder, you should use AOI and AXI equipment. You should also look for solder theft behavior. If you find that the solder balls are not properly centered, you may need to purchase special test equipment. However, these tools are expensive, and the more difficult the inspection, the more expensive it will be.
When assembling BGA components, remember to store the component packages properly. BGA components are extremely sensitive to humidity and temperature. They must be handled with extreme care. They may not be soldered if they are exposed to air in the manufacturing environment for more than 8 hours. If you want to extend the life of your BGA component packages, store them in nitrogen. Just be sure to follow the technical procedures exactly.