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What you Need to Know About BGA PCB
BGA PCB is a type of printed circuit board which uses ball grid array connections to make the electrical connections between integrated circuits and components. The term BGA can also refer to the solderless chip carriers used in surface-mount technology.
PCBTok is the best place to buy BGA PCBs. We have a wide variety of options available, and our prices are the lowest in the industry. Plus, we have a team of experts who can help you figure out what kind of BGA PCB you need for any project.
Reliability and Dependability of BGA PCB
The reliability and dependability of a BGA PCB is an important factor in the success of a product. A good BGA PCB is one that can be used for years without any major issues. BGA PCBs uses the latest technology and has undergone rigorous testing before being released to the market.
A good BGA PCB will have a high level of reliability and dependability because it has been designed by experts who understand how to make sure that all parts work together seamlessly. The components are also chosen carefully so that there is no risk of failure at any point during use or storage
PCBTok is the best place to buy BGA PCB. Our quality is top-notch, and we offer competitive prices. We have been in the industry for more than 12 years and have gained a lot of experience with all kinds of PCBs. We know what it takes to produce high-quality products, and our goal is to make sure that every customer has a positive experience with us.
BGA PCB By Package Type
Designed to be used in high density interconnection applications. Ceramic packaging provides superior thermal management and electrical performance compared to plastic packages.
Plastic BGA or ball grid array packages offer high performance and reliability, the ability to withstand high temperatures and thermal cycling and superior electrostatic discharge (ESD) protection.
Metal BGA package types are the most common type of microprocessor packaging. They offer excellent thermal properties, and they can handle high electrical current densities.
Tape BGA is a type of ball grid array which has tape package type that makes it very cheap compared to other types of BGA packages. It is made from finely meshed copper or aluminum wires.
Micro BGA is a ball grid array component that widely used for electronic devices such as computer, cellphone and digital camera. It has micro package type and connects integrated circuits with devices in electronic products.
Flip-chip BGA, also known as flip-chip ball grid array or simply flip chip, is a special packaging technology. Flip-chip BGA has an electrical interface between the chip and the substrate that runs perpendicular.
What is BGA (Ball Grid Array) in a PCB?
A ball grid array (BGA) is a type of surface mount packaging (SMD) that’s used to mount ICs (integrated circuits) to a printed circuit board (PCB). The BGA package is composed of a substrate, solder balls and an integrated circuit in the center.
In a BGA assembly process, the chip is mounted on the BGA substrate and then each lead from the chip is soldered to the solder balls in a grid pattern. Then the whole structure is encapsulated with resin.
BGA packages can be found in many consumer electronics devices such as cell phones, smart watches and laptops.
Manufacturing with BGA PCB: Process and Inspection
BGA PCB manufacturing is a process that is used to create circuit boards with ball grid arrays soldered to them. These circuits are generally used in high-end computers and other products that require a large number of connections between the different components of the system.
The process begins by creating a design for the circuit board, which will be printed onto a photoresist layer on top of a silicon wafer. This photoresist layer is then exposed to UV light, which causes it to harden into an opaque form, thereby creating patterns that align with where electronic components should be placed during assembly.
The inspection of BGA PCBs is an important step in the manufacturing process. It is important to ensure that all components are properly placed, soldered and aligned. This will ensure that your product will work as desired after the manufacturing process.
Why do BGA PCBs Need Special Handling?
BGA PCBs need special handling because of the way they are designed. BGA stands for Ball Grid Array, and it refers to the way that the connections on a BGA PCB are laid out.
The connections on a BGA PCB are laid out in a grid pattern with small balls of solder between each connection. This means that if you were to just press down on the board, you’d likely cause all of the connections to touch together and short-circuit your board.
BGA PCBs need special handling because the solder joints are delicate, and the package can be easily damaged. The PCBs are also more prone to failure if they are bent or flexed.
PCBTok | Top BGA PCB Manufacturer
PCBTok is a leading BGA PCB manufacturer with over 12 years of experience. We provide our customers with the most reliable and highest-quality PCBs in the industry. Our components are tested and inspected by our experienced quality assurance team, and we offer a full range of services to ensure that your products meet your specifications.
We have been providing electronics manufacturing services, especially BGA PCBs since 2010 and have developed strong relationships with our customers over time. Our goal is to provide you with high-quality products at affordable prices while maintaining high standards for safety and environmental responsibility.
BGA PCB Fabrication
BGA stands for Ball Grid Array, while FBGA stands for Fine Pitch Ball Grid Array. The difference lies in the pitch of the pins and pads on the board.
In a BGA board, the distance (or pitch) between each pin is small, which means that it is easier to solder individual components onto this type of board. However, because of its small size, it is more difficult to work with than an FBGA board.
An FBGA board is larger than a BGA board because the distance between pins or pads is greater apart than on a BGA board. This makes it easier to work with than a BGA board because you have more room to move around on the board when soldering components into place.
The Assembly Board of BGA PCB is a testing board that allows you to test your product in a realistic environment. It uses real-life BGA components and has connectors for the cables that will go on it. The board also has a variety of test points that allow you to run tests on various parts of your product.
Testing your product before you ship it can save you time, money, and effort by ensuring that all parts are working properly together before they get shipped out to customers who may be waiting on them. It’s also good practice because it allows you to see how well all of your products are working together before they’re shipped out, which will help prevent issues later on down the line.
BGA PCB Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
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1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
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It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
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It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
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Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
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Related Products
The quality of the BGA PCB is determined by several factors. Some of them are the type of BGA, the quality of BGA placement, and the thickness of the board.
The type of BGA affects your PCB’s quality because each type has its own set of requirements. For example, some BGAs require a foil underlayment to help hold them in place during soldering. Others may need an insulating layer to prevent shorts from occurring when they’re placed on the surface.
The placement quality also affects your BGA PCB’s quality because it can make or break how well your product performs. If an engineer doesn’t have proper training in making sure their BGA placement is accurate, they could end up with a faulty product that doesn’t work properly or even worse, creates dangerous situations for consumers!
The thickness of your board will affect its quality if it’s too thin or too thick compared to what it should be for the electronics inside it; this can cause problems like short circuits or even fire hazards if you don’t get it right!
While BGA rework is a more complicated process than the other types of rework, it is also one of the most common. With a BGA rework, you need to carefully remove the old solder from the pads and replace it with new solder. This can be done using a hot air gun or by using a solder wick tool. You will also need to remove any excess solder from under each pad before applying new solder paste.
After removing the old solder, you should clean the surface of each pad and then apply new solder paste. After that, you can place your components back onto their respective pads and reflow them in an oven. The oven must be set to its lowest temperature setting, which will typically be around 200 degrees Celsius (392 Fahrenheit).
There are a lot of different ways to clean a BGA PCB, but the most important thing you need to know is that you should never use a solvent. Solvents like acetone or alcohol can damage the BGA connectors, which can cause them to break down over time.
Instead, you should use a dry cleaning method. The best way to do this is with compressed air or an air duster. You can also use an ultrasonic cleaner if you have one available.
If you don’t have any of these options available, it’s possible to use a toothbrush in order to clean the circuit board surface without damaging it or leaving behind any residue.