What you Need to Know About BGA PCB

BGA PCB is a type of printed circuit board which uses ball grid array connections to make the electrical connections between integrated circuits and components. The term BGA can also refer to the solderless chip carriers used in surface-mount technology.

PCBTok is the best place to buy BGA PCBs. We have a wide variety of options available, and our prices are the lowest in the industry. Plus, we have a team of experts who can help you figure out what kind of BGA PCB you need for any project.

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Reliability and Dependability of BGA PCB

The reliability and dependability of a BGA PCB is an important factor in the success of a product. A good BGA PCB is one that can be used for years without any major issues. BGA PCBs uses the latest technology and has undergone rigorous testing before being released to the market.

A good BGA PCB will have a high level of reliability and dependability because it has been designed by experts who understand how to make sure that all parts work together seamlessly. The components are also chosen carefully so that there is no risk of failure at any point during use or storage

PCBTok is the best place to buy BGA PCB. Our quality is top-notch, and we offer competitive prices. We have been in the industry for more than 12 years and have gained a lot of experience with all kinds of PCBs. We know what it takes to produce high-quality products, and our goal is to make sure that every customer has a positive experience with us.

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BGA PCB By Package Type

Ceramic BGA

Designed to be used in high density interconnection applications. Ceramic packaging provides superior thermal management and electrical performance compared to plastic packages.

Plastic BGA

Plastic BGA or ball grid array packages offer high performance and reliability, the ability to withstand high temperatures and thermal cycling and superior electrostatic discharge (ESD) protection.

Metal BGA

Metal BGA package types are the most common type of microprocessor packaging. They offer excellent thermal properties, and they can handle high electrical current densities.

Tape BGA

Tape BGA is a type of ball grid array which has tape package type that makes it very cheap compared to other types of BGA packages. It is made from finely meshed copper or aluminum wires.

Micro BGA

Micro BGA is a ball grid array component that widely used for electronic devices such as computer, cellphone and digital camera. It has micro package type and connects integrated circuits with devices in electronic products.

Flip Chip BGA

Flip-chip BGA, also known as flip-chip ball grid array or simply flip chip, is a special packaging technology. Flip-chip BGA has an electrical interface between the chip and the substrate that runs perpendicular.

What is BGA (Ball Grid Array) in a PCB?

A ball grid array (BGA) is a type of surface mount packaging (SMD) that’s used to mount ICs (integrated circuits) to a printed circuit board (PCB). The BGA package is composed of a substrate, solder balls and an integrated circuit in the center.

In a BGA assembly process, the chip is mounted on the BGA substrate and then each lead from the chip is soldered to the solder balls in a grid pattern. Then the whole structure is encapsulated with resin.

BGA packages can be found in many consumer electronics devices such as cell phones, smart watches and laptops.

What is BGA (Ball Grid Array) in a PCB
Manufacturing with BGA PCB Process and Inspection

Manufacturing with BGA PCB: Process and Inspection

BGA PCB manufacturing is a process that is used to create circuit boards with ball grid arrays soldered to them. These circuits are generally used in high-end computers and other products that require a large number of connections between the different components of the system.

The process begins by creating a design for the circuit board, which will be printed onto a photoresist layer on top of a silicon wafer. This photoresist layer is then exposed to UV light, which causes it to harden into an opaque form, thereby creating patterns that align with where electronic components should be placed during assembly.

The inspection of BGA PCBs is an important step in the manufacturing process. It is important to ensure that all components are properly placed, soldered and aligned. This will ensure that your product will work as desired after the manufacturing process.

Why do BGA PCBs Need Special Handling?

BGA PCBs need special handling because of the way they are designed. BGA stands for Ball Grid Array, and it refers to the way that the connections on a BGA PCB are laid out.

The connections on a BGA PCB are laid out in a grid pattern with small balls of solder between each connection. This means that if you were to just press down on the board, you’d likely cause all of the connections to touch together and short-circuit your board.

BGA PCBs need special handling because the solder joints are delicate, and the package can be easily damaged. The PCBs are also more prone to failure if they are bent or flexed.

Why do BGA PCBs Need Special Handling

PCBTok | Top BGA PCB Manufacturer

PCBTok Top BGA PCB Manufacturer
PCBTok Top BGA PCB Manufacturer (1)

PCBTok is a leading BGA PCB manufacturer with over 12 years of experience. We provide our customers with the most reliable and highest-quality PCBs in the industry. Our components are tested and inspected by our experienced quality assurance team, and we offer a full range of services to ensure that your products meet your specifications.

We have been providing electronics manufacturing services, especially BGA PCBs since 2010 and have developed strong relationships with our customers over time. Our goal is to provide you with high-quality products at affordable prices while maintaining high standards for safety and environmental responsibility.

BGA PCB Fabrication

Difference Between BGA PCB and FBGA PCB

BGA stands for Ball Grid Array, while FBGA stands for Fine Pitch Ball Grid Array. The difference lies in the pitch of the pins and pads on the board.

In a BGA board, the distance (or pitch) between each pin is small, which means that it is easier to solder individual components onto this type of board. However, because of its small size, it is more difficult to work with than an FBGA board.

An FBGA board is larger than a BGA board because the distance between pins or pads is greater apart than on a BGA board. This makes it easier to work with than a BGA board because you have more room to move around on the board when soldering components into place.

Testing the Assembly Board of BGA PCB

The Assembly Board of BGA PCB is a testing board that allows you to test your product in a realistic environment. It uses real-life BGA components and has connectors for the cables that will go on it. The board also has a variety of test points that allow you to run tests on various parts of your product.

Testing your product before you ship it can save you time, money, and effort by ensuring that all parts are working properly together before they get shipped out to customers who may be waiting on them. It’s also good practice because it allows you to see how well all of your products are working together before they’re shipped out, which will help prevent issues later on down the line.

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PCBTok offers you the most complete range of BGA PCB. For professionals, hobbyists and makers who want to create their own boards but not make a mess, pick us!

BGA PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “I recently ordered a customized circuit board from PCBTok. They were able to create my design and give me a quote in less than 48 hours. I was impressed that they were so quick and responsive. Most companies would take days to get back to you. The best part is that they showed up at my office the day after I ordered the PCB! They dropped it off at my office with everything I needed and even checked to see if I had questions about assembling the product.”

    Brad Elery, Mechanical Engineer from Quebec, Canada
  • “I was in need of a last minute PCB from China. I did not have time to send my design to a local supplier. I found PCBTok on the web and I was able to send my design directly to them. The following day they sent me a quote, and they shipped it after receiving payment. The PCB arrived at my office within a week of ordering. I am impressed with their service, communication and shipping speed!”

    Blake Johnsons, Electronics Technologist from Kallang, Singapore
  • “PCBTok is one of my favorite suppliers. They’re always fast and precise, and I’m always impressed with their level of detail and accuracy. PCBTok is a great business partner who always delivers their products on time and with no errors. I don’t know how they do it, but I’m always amazed that my boards are flawless when I get them back. Thanks! “

    Carlos Vives, Process Engineer from Bogota, Colombia
What Factors Affect your BGA PCB Quality?

The quality of the BGA PCB is determined by several factors. Some of them are the type of BGA, the quality of BGA placement, and the thickness of the board.

The type of BGA affects your PCB’s quality because each type has its own set of requirements. For example, some BGAs require a foil underlayment to help hold them in place during soldering. Others may need an insulating layer to prevent shorts from occurring when they’re placed on the surface.

The placement quality also affects your BGA PCB’s quality because it can make or break how well your product performs. If an engineer doesn’t have proper training in making sure their BGA placement is accurate, they could end up with a faulty product that doesn’t work properly or even worse, creates dangerous situations for consumers!

The thickness of your board will affect its quality if it’s too thin or too thick compared to what it should be for the electronics inside it; this can cause problems like short circuits or even fire hazards if you don’t get it right!

BGA PCB Rework and Repair

While BGA rework is a more complicated process than the other types of rework, it is also one of the most common. With a BGA rework, you need to carefully remove the old solder from the pads and replace it with new solder. This can be done using a hot air gun or by using a solder wick tool. You will also need to remove any excess solder from under each pad before applying new solder paste.

After removing the old solder, you should clean the surface of each pad and then apply new solder paste. After that, you can place your components back onto their respective pads and reflow them in an oven. The oven must be set to its lowest temperature setting, which will typically be around 200 degrees Celsius (392 Fahrenheit).

How to Properly Clean your BGA PCB?

There are a lot of different ways to clean a BGA PCB, but the most important thing you need to know is that you should never use a solvent. Solvents like acetone or alcohol can damage the BGA connectors, which can cause them to break down over time.

Instead, you should use a dry cleaning method. The best way to do this is with compressed air or an air duster. You can also use an ultrasonic cleaner if you have one available.

If you don’t have any of these options available, it’s possible to use a toothbrush in order to clean the circuit board surface without damaging it or leaving behind any residue.

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