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PCBTok - Your Partner in Making Blind Vias PCB That Lasts
PCBTok is a PCB manufacturing service that specializes in making blind vias PCBs of any quantity. We take pride in making the best PCBs with blind vias that last for years in harsh environments.
- 100% E-test and AOI inspection
- 24h quick-turn service for your prototype PCB
- Offer COC report,micro-section, and soldering sample for your order
- Certified with UL in US and Canada
PCBTok’s Mastery in Knowing the Industry’s Blind Vias PCB Needs
PCBTok has a mastery of the blind via technology that is unparalleled in the industry. PCBTok has made their technology advanced and leading compared to other PCB manufacturing companies. This can only be done by someone who is experienced in the industry and who works with orders on a daily basis. PCBTok has mastery in knowing the industry’s blind vias PCB needs and can deliver the product that clients cannot find elsewhere.
To meet the demand of customers, PCB Tok has to provide the latest technology and lead time. So PCBTok accumulated the top engineers with rich experience in PCB industry to design and test a series of blind via PCBs for you.
Blind vias are very common in PCBs, but they are often not mastered or understood by designers or manufacturers. Luckily, PCBTok can solve your blind via problems and manufacture them like a pro!
Blind Vias PCB By Type
It has been widely used in the consumer products and telecom sectors for over 10 years, and is now gaining popularity in other sectors such as medical, automotive & industrial.
Specially designed for the purpose of reducing the area of hole on the PCB. It can be used in a wide range of applications such as computer, communications, metering and power supply.
Inner layers must have holes drilled or other features added without exposing the inner layers. Great way to reduce fabrication cost and increase your manufacturing efficiency.
Flexible Blind Vias for mounting surface-mount components onto a flexible substrate. It is a great way to mount components that cannot be mounted on rigid PCBs
Excellent choice to replace the previous conventional via hole. It can avoid the potential short circuit problems caused by two or more parallel wires contacted through via holes.
High performance, multi-layer flexible PCB system that combines the best characteristics of rigid and flex PCB technologies. Provides all the advantages rigid PCBs with the flexibility.
Blind Vias PCB by Types (5)
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Tented Blind Vias PCB is a new design in the field of PCB industry. It utilizes a unique Via stacking technology, providing an unusual and creative solution for high density interconnect grounding.
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Great for use in any application requiring a simple and effective way to route the wiring between layers of the PCB. This is an easy solution for the circuit designer who needs an efficient way to route their wiring.
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More advanced PCB than traditional non-filled vias as they both provide a connection (or pathways) from one layer to the next, however, traditional vias are open at the end whereas filled via are closed off at the end.
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Used to connect two components on a circuit board without the need for a via hole. The via pad is covered with a plug, which is grounded and prevents the signal from escaping through the via hole in the circuit board.
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Used for making electrical connections between two or more layers of a multilayer printed circuit board. Capped Blind Vias PCB design is the best for RF applications because it increases the conductivity.
Blind Vias PCB by Process (5)
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Photo-defined Blind Vias PCB is a method of producing blind vias without the need for a stencil. The photo resist is applied over the entire board and exposed with UV light.
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Reduce the cost of a PCB assembly is by using controlled-depth blind vias. Can be used to route signals from one layer to another.
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Used to improve the signal integrity of high speed digital data transmission links, maintain transmission performance.
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Through the laser drilling process, blind vias are created by drilling a hole at the desired location on the backside of the PCB substrate using a laser machine.
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Manual-drilled Blind Vias PCBs are extremely popular. Our manual-drilled blind vias PCBs are high quality and made to your exact specifications
Blind Vias PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
PCBTok’s Credibility in Blind Vias PCB Fabrication
PCBTok is the best choice for all your blind vias PCB fabrication needs.
We have been in the business of making blind vias PCBs since 2010, and we have been producing high-quality products all along. We believe that our credibility is what sets us apart from other companies. In order to maintain our credibility, we employ a strict quality control process that ensures that every single batch of blind vias PCBs meets the highest standards. We are also committed to providing our clients with excellent customer service and technical support, so if you need help with anything, we’re here for you!
We know what you’re going to need, how long it’s going to take us to get it done, and how much it will cost. You’ll get exactly what you want and need at a price that won’t break your budget.
PCBTok’s Absolute Quick Turn Blind Vias PCB
PCBTok’s Blind Vias PCB is a fast and reliable solution to your PCB needs.
Our blind vias are designed to provide you with the best possible performance, with the fastest turn time available on the market today. Our blind vias are made in-house, and we have a strong commitment to quality control.
Our blind vias are made using only top-of-the-line materials and equipment, ensuring that your product is both durable and reliable.
Our Blind Vias PCBs come in a variety of sizes, ranging from 0.8mm to 1.6mm holes for easy integration into your design.
PCBTok’s Blind Vias PCB can Help your Business
PCBTok has a wide range of blind via PCBs for your business. Blind via PCB is an important part of the PCB manufacturing process. It allows you to connect two different layers of your circuit board without having to drill a hole in the board or use a through-hole component. Blind vias have many applications in various industries, and they are also used in many different types of electronic devices, such as computers, cell phones, and automotive systems.
In order to create a blind via in your circuit board, you will need to use a special tool called a laser drill machine. This machine uses high-powered laser beams to burn through the copper layers of your board so that metal can be placed between them for conductivity purposes.
Outstanding Devices with PCBTok's Blind Vias PCB
PCBTok is a leading manufacturer of blind vias PCBs. We are proud to be able to offer such a wide selection of outstanding devices and components, as well as the highest quality products available on the market today.
Here are just a few of the many advantages that our blind vias PCBs offer:
- High-quality materials and components: Our blind vias PCBs are made using only high-quality materials and components. This ensures that your device will last longer and perform better than other options.
- Blind vias: We specialize in blind vias. You can use them as stand-alone boards or combine them with other parts to create even more complex devices.
- Low cost: You can get started with one of our blind vias PCBs for less than $100! Compare this to other products on the market today—we guarantee that ours will save you a lot of money!
Blind Vias PCB Fabrication
With years of experience in designing and manufacturing PCBs, we have accumulated abundant technical resources and professional talents to provide customers with quality products and excellent service.
Besides, we have set up an efficient production line with advanced equipment, such as automatic laser machine, CNC drilling machine, automatic laminating machine, automatic drilling machine and automatic soldering machine, etc.
We are committed to providing you with quality tested buried vias PCBs at an affordable price. Our entire team is dedicated to providing you with the best customer service possible so you can be confident in your purchase.
Blind vias are not just holes that are drilled in the circuit board, but they are holes that are drilled in the circuit board and filled with solder. This process can be used to connect two layers of the circuit board together at an angle.
The solder is melted and allowed to cool, creating a solid connection between the layers. This type of connection is more secure than soldering directly onto the copper traces.
It also allows for a more flexible design because you can use larger hole sizes than would otherwise be possible with ordinary through-hole components. This can improve the reliability of electronic devices and reduce costs on maintenance and repair.
OEM & ODM Blind Vias PCB Applications
Used in medical equipment because they allow the manufacturer to reduce costs and increase reliability by using fewer components, while still providing sufficient flexibility in design.
They are used in industrial control applications to provide connectivity between layers of PCB without using a trace.
In the world of military technology, there are many processes that require a high level of precision and accuracy. It is essential that these processes are performed with the utmost care.
Blind vias PCB for smart devices are used in the process of manufacturing smart devices. They are placed on the top side of the PCB and are not visible to the naked eye.
Perfect solution for your telecommunications PCBs. Blind vias allow you to route signals around obstacles, such as other components, without having to create a new connection through the board.
Blind Vias PCB Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Blind Vias PCB: The Ultimate FAQ Guide
First, you may be curious about how blind vias work. The concept is similar to that of a standard PCB. Blind vias are board holes formed by drilling through the central core layer and the surface layer. These layers are then stacked using prepreg material. Blind vias have many applications. This guide will explain the basic principles of blind vias and how they work.
While blind vias are used to connect PCB layers, buried vias are more common. They provide improved power transfer and layer density but have a negative impact on signal quality. Because buried holes are less visible, designers can make boards smaller and lighter. Medical devices, tablets, and cell phones are examples of products that use buried holes. The Ultimate FAQ Manual
The size of any through-hole must be carefully considered. A 10 mil finished hole is considered an “average” via, but smaller vias can be specified. If you are unsure of the size you need, consult your PCB supplier. There are guidelines or specifications for both types of vias. You can also discuss the proper stacking of the board based on the technology.
Blind holes are usually created by drilling holes in one layer of the PCB. This drilling process is similar to the drilling process for through holes, but it uses mechanical drilling that interferes with the characteristics of the underlying board. On the other hand, laser drilling of blind holes goes through the outer layer. The outer layer of the PCB is not plated or etched during the drilling process.