PCBTok is Your Professional Bluetooth PCB Provider
The quality of PCBTok’s Bluetooth PCB has received a lot of favorable feedback and acknowledgment. It would not be attainable without our skill in producing one-of-a-kind Bluetooth PCBs. Hence, if you entrust your PCB with us, you may put your worries away!
- Prototype PCBs are returnable within 24 hours.
- Been in the industry for more than a decade and so.
- We aid with any customized PCBs.
- We have enough components to satisfy your demands.
- Weekly progress update provided.
Bluetooth PCB by PCBTok is Proved to be Dependable
Constructing PCBTok’s Bluetooth PCB is systematic; it goes through various processes to attain its utmost performance. We do not want your Bluetooth PCB to be second-rate, so we are trying to build it via our strict guidelines. In PCBTok’s Bluetooth PCB, you can never go wrong!
We pledge you our commitment in delivering you a commendable PCB, and admirable assistance.
Send us a message for any queries you have now!
PCBTok’s Bluetooth PCB wouldn’t be recommended by other customers, if we’re serving them unremarkable item; thus, this proves that we’re really considerate of your demands and feelings!
Bluetooth PCB By Feature
In the present time, various and most of the stereo devices are upgrading into wireless connections since it is way more convenient to do so rather than the traditional way. In a Bluetooth Stereo PCB, there’s no need to connect several wirings for it to function.
With the advancement of technologies, audio equipment also followed the trend from wired to wireless connections. Some other experts in this field say that the audio transmitted from a Bluetooth Audio PCB sounds way better in comparison with other sorts of PCBs.
Speaker Bluetooth PCB has been extremely popular in the 21st century because it’s no longer a hassle to play music from your phone to a speaker; instead, you can connect to the speaker and listen to music with just a single tap.
The primary function of a Bluetooth Transmitter PCB is to transmit music to a stereo system. However, its function is not just limited to this; you can also use it as a bridge to connect your Bluetooth device to other devices.
Power Amplifier Bluetooth PCB is a great help to musicians since they no longer need to purchase several cables to connect their advance instruments to the amplifier. This produces both aesthetics and convenience.
Cables in a computer setup can be quite annoying to look at, hence the birth of a Bluetooth Keyboard PCB. If you’re striving to remove the unwanted wirings of a keyboard in your PC setup, then this is perfectly suited for you.
Bluetooth PCB By Surface Treatment (6)
Bluetooth PCB By Color (5)
Characteristics of a Bluetooth PCB
PCBTok has all your required qualities for a Bluetooth PCB! The listed characteristics below are just some of what we offer in PCBTok.
- We utilize CEM, FR4, Rogers, and PTFE as its Foundation components.
- The thickness of its copper ranges from 0.3 oz to 6 oz.
- Connector Pin, BGA, and USB are some of the offered SMT aspects.
- Epoxy Resin is deployed as its thermal shielding.
If you have any additional questions concerning the properties of a Bluetooth PCB and what more we can offer, hit the inquiry button now!

Pros of Bluetooth PCB Utilization
The utilization of Bluetooth PCB has significantly helped the devices we currently have in the modern world; it makes the connection with other devices and people much easier.
Some of the benefits of a Bluetooth PCB are the following: it communicates through special codes, it can process information within a 10m diameter range, no wirings are involved, and it is made from high-grade quality substances and components.
In conclusion, Bluetooth PCB is very essential in the present time; given that it can control and operate certain devices without the need for cables.
If you have any questions concerning PCBs, kindly contact us now!
Boost the Capability of a Bluetooth PCB
This is the section to read if you want to understand how to improve the performance of a Bluetooth PCB. For a Bluetooth PCB to endure a long time, it must be maintained thoroughly. Here are some suggestions for doing so.
- Obtain a copy of an authorized module: It will save you time and money in the future when it comes to EMI and antenna susceptibility designation.
- Appropriate device application: To guarantee that your Bluetooth PCB performs well, you must first determine what the ideal Bluetooth PCB is for your needs.
- Right tools with correct analysis: This will aid you in installing the antenna section.
We’ll be delighted to answer any questions you might have about your PCB!

Pick and Take PCBTok’s Exemplary Bluetooth PCB


PCBTok has been operating in the industry for over a decade and two now. We are fully equipped with the necessary knowledge in building a Bluetooth PCB that is top-notch. Furthermore, we have acquired the essential certifications for the betterment of our Bluetooth PCB.
We are always here to assist you with any concerns and specifications you have for your Bluetooth PCB.
You can guarantee satisfactory products since we’re offering free product samples, and a turnaround service if in any case there are some mistakes made. However, no need to worry since we always assure that all of our Bluetooth boards are free from any errors.
Obtain your Bluetooth PCB with PCBTok straight away!
Bluetooth PCB Fabrication
All of our Bluetooth PCBs undergo a sophisticated procedure.
From the pre-production, imaging, etching, lamination, drilling, graphic plating, soldering, surface polishing, and electronic assessment are conducted as part of the process.
The mentioned production processes are compressed to ensure easy understanding. However, every phase of the production is thoroughly performed for a better outcome.
To know more about our production process, send us a message!
PCBTok is constructing Bluetooth PCBs for more than a decade already.
We’re providing Bluetooth PCBs that are of the highest quality with special components attached to them. This is to ensure that it will function effectively for wireless technologies.
The competence of PCBTok in manufacturing Bluetooth PCBs will not be possible if it were not for our over 500 personnel working to perfect your Bluetooth PCB.
Give us a call today with any questions you have about our PCB!
OEM & ODM Bluetooth PCB Applications
Audio devices have always been a part of people’s daily lives, but as technology progressed, it switched from wired to wireless connections. Hence, Bluetooth PCB is becoming more essential.
Most of the Industrial Sensors nowadays adapted to wireless technology to partner the advancement of the technologies, thus Bluetooth PCB has became more popular for this.
With the inconvenience of connecting to other people’s devices to transfer data; the wireless data transmission method is much more convenient because cables are no longer required.
In a computer setup, cables and wirings might be an eyesore, thus as technology advanced, the computer gear went from wired to wireless connections for aesthetics and cleanliness.
Thanks to Bluetooth PCB, all of our household appliances may now be managed via a remote device or even a smart phone as a result of the advent of smart technologies.
Bluetooth PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
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- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
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It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
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It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
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It takes 4-7 business days to deliver the packages to the hands
of our customers.
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If your order is of large volume with PCBTok, you can also choose
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Please contact your sales representative for shipping solutions.
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Related Products
Bluetooth PCB: The Completed FAQ Guide
The Bluetooth PCB Completed FAQ guide will help you understand the basics of this wireless technology and get started on your project as soon as possible. If you follow these guides, you’ll be designing and building Bluetooth-enabled devices in no time.
The complete FAQ guides will answer all your questions and guide you through the Bluetooth PCB design process from start to finish. By following these guides, you will be able to design Bluetooth PCBs that are both robust and easy to implement.
What exactly is a Bluetooth PCB? A board with chips, crystal-based clocks, voltage regulators, and antennas. To avoid problems with range, functionality, and other key features, this board must be carefully assembled and adhere to professional standards. The Bluetooth board must be assembled correctly and carefully in order to work properly. This guide will show you how to properly assemble and test the Bluetooth board.
There are many components on the Bluetooth board, including two inductors. These inductors increase the resistance of the antenna and reduce the impedance between the receiving and transmitting processes. The Bluetooth board also has four IO pins, representing four different module options. Various capacitors and diodes are also included. Finally, the Bluetooth PCB includes many chips and voltage regulators. Crystal-based clocks also play an important role on the Bluetooth board.
Bluetooth PCB
If you want to know what a Bluetooth PCB is, then you have come to the right place. A printed circuit board is called a “PCB”. These devices are usually made up of several layers and many components. Bluetooth PCB designs are created using a variety of design software that can help you produce high-quality designs. In addition to the Bluetooth PCB design, the software also includes a bill of materials, schematics, and printed circuit board layouts.
Thick Copper Bluetooth PCB
What materials are Bluetooth PCBs made of? Thin laminates are used as the primary material for Bluetooth printed circuit boards. The thickness of this laminate varies but is typically about 0.038 inches thick. The core is then used as the primary conductor of electricity and heat. A dry film resist (i.e., a thin layer of photo or film) is then applied to the PCB surface. The “exposure” process involves exposing the image on the PCB. The image is then developed and the inner layer is etched. The resist strip is then removed from the device.
There are certain layout guidelines that must be followed when designing a Bluetooth module or chip. First, make sure the antenna section is free of all high-energy components. Then, create a board with decoupling and coupling capacitors. You should also leave room for tuning components such as ferrite beads. After completing the design, send it to an RF test lab for a compatibility scan.
This paragraph will take you through the process step by step. You should follow the instructions provided by the manufacturer of the Bluetooth chip you intend to use to build your own Bluetooth device. The following steps should help you design the Bluetooth PCB for your device, or you can consult the user manual provided by the manufacturer to learn how to design the circuit.
First, determine the length of the Bluetooth PCB. It must be at least 1.66 mm thick to ensure that it does not interfere with the radio frequency. The next step is to choose the right layout for your Bluetooth PCB. The board layout should be as simple as possible. Keep the PCB’s signal integrity high and avoid placing metal near the GND pins. When building the enclosure, make sure to include the 3.5 mm audio jack.
Once you have determined the location of the circuitry, you can add the wireless module. You can even integrate the antenna into your design. A circuit board is required to connect the wireless transmitter to its base station. The PCB design should also include some components to keep the device running. The Bluetooth module will contain audio amplification and voltage regulation circuitry. The Bluetooth board should then be added.
If you’re wondering “What is a Bluetooth PCB module?” This is the place to go. Then you’ve come to the right place. Here are some of the most important Bluetooth circuit board components. Read on to learn more! The antenna, the Bluetooth chip, and the PCB layer make up the Bluetooth PCB module. Despite its simple construction, the PCB layer can have a significant impact on the performance of your product.
Bluetooth PCB Module
The first factor to consider when choosing the right Bluetooth module is the design. Depending on the application, you may need a smaller or larger footprint. For example, Bluetooth 5.1 modules are stacked on a printed circuit board along with a printed antenna. Bluetooth 5.1 modules are designed to be a bit bulky, so they can’t just be thrown on the board. In addition, you do not need to design a new PCB for Bluetooth 5.1.
A Bluetooth PCB module consists of four layers of circuit boards. The first layer is the signal layer I. The ground layer is the second layer. The power layer is the third layer. The antenna is the last layer. This is the most important part. A Bluetooth circuit cannot operate without a kit and will not work. To be most effective, the design engineer must follow some basic principles.
The Bluetooth PCB module consumes less power and is cost-effective. It also supports multiple interface protocols. In addition to these benefits, the Bluetooth PCB can be used as a standalone Bluetooth device. Bluetooth PCB modules can also be used as a low-cost, low-power, or peripheral solution for simple applications. When selecting a Bluetooth PCB module, it is important to consider the type of product you are designing.
You may be wondering what a Bluetooth speaker PCB is. to answer this question, you must first understand the circuit design process. A printed circuit board is a Bluetooth speaker PCB. unlike other printed circuit boards, Bluetooth speakers are not made from a single board. Instead, they are made up of several layers. Here are some of the components used to make a Bluetooth speaker PCB.
The Bluetooth speaker PCB consists of many small circuits that make up the audio circuitry of the device. The main components of a Bluetooth speaker are the battery, the amplifier board, the boost converter, the audio module, the Bluetooth receiver, and the battery charger. The audio module integrates your smartphone into the Bluetooth speaker and has an integrated security chip. On the PCB, there is also a booster. This helps to charge the device and connect it to external devices such as subwoofers.
The main circuit board contains the battery, microphone, and Bluetooth technology. The Bluetooth speaker has a lithium battery that lasts for about ten hours. During this time, the PCB also contains the microphone and volume control, which allows you to fine-tune the sound. The PCB also controls the other components of the device. If you are wondering “What is a Bluetooth speaker PCB?”, some of the components of a Bluetooth speaker PCB are explained here.
Another important component is the antenna. For sending and receiving data, the antenna area uses a tracking antenna. In addition to the alignment antenna, it has two inductors L4 and L6 to help fine-tune the impedance of the antenna. In addition, several other components are used to improve the performance of the Bluetooth speaker PCB. After determining the function of each component, the next step was to lay out the PCB.
As a manufacturer of small electronic components, the PCB is one of the most critical components in any product. Bluetooth allows you to easily connect two or more devices without worrying about signal interference. Bluetooth is a low-power, reliable technology that is easy to implement on a variety of small peripherals. Despite its age, the technology continues to improve in terms of speed, range, and security. Unfortunately, Bluetooth is susceptible to signal interference; however, a well-designed PCB can mitigate this problem.
The ground stitch through holes on the Bluetooth PCB helps to prevent unwanted radiation from interfering with nearby signals. Again, you should adjust the shape of the board to match the location of the antenna on the Bluetooth device. In addition, you should separate the analog and digital ground planes of the antenna and add shielding to reduce the noise picked up from the surrounding area. Of course, if you are using a ceramic or printed antenna, you will need a ground plane to reduce cross-coupling and maximize input bandwidth.
Bluetooth Classic
If you need a complete Bluetooth module, look for a complete, pre-certified Bluetooth module. This will shorten your development time and time to market, and eliminate antenna placement and EMI sensitivity issues. There are several low-cost certified modules available, many of which include an ARM processor to control simple peripherals. You should also look for modules that do not have much power on the board.