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PCBTok | Prime Buried Vias PCB for All Industry
Buried Vias PCBs are used in various industries such as automotive, consumer electronics, medical equipment, aerospace and defense etc. The PCBs are manufactured using the best quality raw materials and advanced technology. We offer a wide range of customized products at affordable prices.
- No minimum order quantity for your new order
- All printed circuit boards meet IPC Class 2 or 3
- Files receive full CAM review prior to manufacturing
- Accept third party factory audit and inspection before starting our business
PCBTok’s Top-Grade Buried Vias PCB
At PCBTok, we love PCBs. We love them so much, in fact, that we want you to love them too. So here’s the deal: if you’re looking for a buried vias PCB that is as durable and reliable as it is beautiful, look no further. Our top-grade buried vias PCBs will meet or exceed all of your expectations for durability and reliability—and we’ll do it in style!
Buried via means that you can see the connection between two points through a hole in the board, but it’s not accessible from the outside. This is a common way to connect signals across multiple layers of PCBs. It’s useful to have buried vias when you need to connect two points that are on different layers of your board, but you want to keep those connections hidden from view.
PCBTok provides you with low cost, high quality PCBs and good customer service. Our products are made from materials which is durable and long lasting. We have a team of experts who will work with you to make sure that you get exactly what you want from our company.
Buried Vias PCB By Type
The buried via runs through the entire thickness of the ShengYi PCB, allowing you to connect two layers of the printed circuit board without having to run a trace on both sides.
NanYa Buried Vias PCB is a new technology that allows for the insertion of conductive vias through the board without the need for through-hole soldering.
Buried Vias PCBs allow for higher frequencies than traditional FR4 boards because they provide greater isolation between traces and ground planes on a FR4 PCB.
Isola Buried Vias PCB is a revolutionary printed circuit board that allows you to bury vias in the Isola board, enabling you to create more efficient designs and get better performance of devices.
Nelco Buried Vias PCB can be used for various applications, including high-speed digital, MEMS and heat sink applications. A great solution for creating a reliable, durable circuit board.
Providing you with the best possible quality and durability. Arlon is known for its high quality, which means that you can use it for any project without worrying about the longevity of your product.
Buried Vias PCB by Layer (5)
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The 4 layer buried vias PCB has a robust design that meets standards, ensuring it will stand up to the harshest environments
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6 Layer Buried Vias PCB is a high-quality, cost-effective solution for your product’s needs, and can be used in all kinds of industries.
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PCB for high frequency circuits. 8 layer buried via PCB has a high inductance, which reduces the impedance and provides low noise signals.
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The 10 layer buried vias PCB made up of ten layers, and each layer has a hole in the center for connecting to other layers.
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12 layer buried vias PCB is a kind of PCB with 12 layers. It has the advantages of dense, small size, high accuracy though PCB is complex.
Buried Vias PCB by Kind (5)
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With the Prototype Buried Vias, your board will be routed with buried vias, so there’s no need to worry about any unrouted traces.
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Quick Turn Buried Vias PCBs are used in the electronics industry to make it easier for companies to get their products out the door.
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The High Power Buried Vias PCB allows you to use more advanced capacitors, resistors, and other components than ever before.
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Used on power lines, overhead telephone lines and high voltage transmission lines. Insulates the copper traces from ground potential.
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Eliminates the need for through-hole vias by using buried vias to connect parts without exposing them to the outside world.
Buried Vias PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
PCBTok Buried Vias PCB Services
We offer PCBTok Buried Vias PCB Services, which are used to connect one layer of a circuit board to another layer. These vias allow you to route signals from one side of your board to another without having to worry about running separate wires or traces.
When we say buried vias, we’re talking about the little connection points that allow you to connect your components and make the magic happen. You know, those tiny little holes in the middle of your board that act as the pathway for your electrical current? Those are buried vias.
We use the latest technology to manufacture these vias, including our own in-house laser machining center. Our ability to machine our own vias means we can provide you with the highest quality product at a competitive price.
Contact us today to learn more about our products and services.
PCBTok’s Buried Vias PCB Fabrication Process
Our buried vias PCB fabrication process is designed to ensure that the quality of your PCBs is the absolute best it can be.
We start with our state-of-the-art equipment, which combines the latest technology with our years of experience in the industry. This means you get a high-quality end result right from the start.
Then we use only the best materials: copper boards made out of pure copper (not just plated) and gold-plated vias to ensure that they can withstand even the toughest conditions. We also use a special solder material that allows us to keep costs down while still providing superior quality. Finally, we test each board after production before shipping them out so you can rest assured knowing your product is going to last for years to come!
PCBTok’s Buried Vias PCB Quality Check
At PCBTok, we are committed to providing you with the best quality products and services.
We follow strict quality control measures that ensure your products meet the highest standard—from raw materials to finished goods.
One of our most important quality checks is on buried vias, which we use as an indicator of whether you’ll be satisfied with your order.
We inspect each board for any damage that would prevent it from being manufactured correctly. If there is any damage, then the board is rejected and sent back our manufacturing for repair.
We check for missing or unconnected vias by sending an electrical current through each one to make sure it conducts electricity properly, or if there are any breaks in the electrical circuit caused by a broken via or poor connection between two different layers on top of each other.
PCBTok’s Reliable Buried Vias PCB for Any Application
Buried vias are a reliable and cost-effective way to connect different layers of your PCB. This is especially true when you need to connect two or more layers that are not directly above or below each other.
The problem with buried vias is that they are difficult to work with and can be time-consuming. They also require special equipment and materials to get it right. But with PCBTok, you can make sure that your buried vias are done right every time so you don’t have to worry about any of the hassles that come with them.
We offer high quality products at affordable prices so that you can get the most out of your PCB without having to spend too much money on it.
Buried Vias PCB Fabrication
Buried vias are an essential part of any PCB, but they can be difficult to work with. That’s why we’re here—to make sure you get the best of buried vias PCB from PCBTok!
We’ve got a team of skilled professionals that know their way around the ins and outs of buried vias PCB. We know what it takes to produce a product that will last you for years to come and perform exactly as expected every time.
And we’re ready to help you find out what we can do for your project! Just give us a call today or send us an email and get quoted at our website.
Our team of PCB designers and engineers are always working to ensure that our products meet the highest standards.
Our Buried Vias PCB meet IPC Standards. We have a full range of capabilities for all your PCB needs, from simple prototyping to full production runs.
The IPC has been setting industry standards for over 70 years. These standards are used by companies all over the world as a guide for creating quality products. They are designed to ensure that the end product is safe and reliable, while also being affordable.
OEM & ODM Buried Vias PCB Applications
The Buried Vias PCB for Wireless Keyboard is the best way to increase your typing speed, avoid the risk of wireless interference and enjoy the convenience of a wireless keyboard.
A Buried Vias PCB for Smart Phone Tracker is a circuit board that includes at least one buried via. A buried via is a via that is placed within the substrate of the circuit board used to connect traces on different layers.
Buried vias can be used in many situations, but they are especially important in medical technology applications because they allow for greater flexibility and durability. Always have access to functioning equipment.
Buried vias are ideal for military use because they allow engineers to create circuits that can withstand even the harshest conditions without getting damaged or failing.
Our Buried Vias PCBs provide a faster and more reliable connection than ever before. The new design allows for better signal strength, which means that you’ll be able to transmit and receive data quickly.
Buried Vias PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Buried Vias PCB: The Ultimate FAQ Guide
The ultimate FAQ guide to buried vias PCB manufacturing is a comprehensive resource for those looking for an experienced buried vias PCB manufacturer. Buried vias are a common feature on circuit boards, but not all manufacturers have the knowledge to design them correctly. In addition, buried vias can have an impact on board yields and signal integrity. Therefore, selecting a buried via PCB manufacturer is critical to the success of your project.
There are two types of vias: buried vias and blind vias. Buried vias are conductive holes located below the PCB layer. These vias save space while having no impact on surface components or alignments. The former is often used for BGA components to reduce signal short cut-offs. On the other hand, buried holes are less common and more difficult to design than blind holes.
Before you can start burying holes in a PCB, you must first understand the aspect ratio. This is the ratio of the depth of the hole to its diameter. This ratio should be around three to one, but a standard board is only 0.062 inches thick. As with any other buried hole, the board size must be considered. A 0.006-inch through-hole will fit through a 0.062-inch board.
A critical step in a high-speed PCB project is the selection of the Buried Vias PCB design. Through-holes are the most important component of the circuit and buried holes must be considered. They are used to isolate components on the printed circuit board. These holes are critical to the operation of high-speed electronic components. They also reduce the overall cost of the PCB.