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PCBTok’s Flawlessly Composed Castellation PCB
PCBTok’s Castellation PCB has its dedicated manufacturing procedure to guarantee that it will perform to its maximum potential through the assistance of our experts.
- Specializing in the PCB industrial sector for twelve years.
- Our refund services are available within 24 hours after the purchase.
- Our supply of high-quality parts is sufficient to meet your needs.
- Updates on your product’s progress are sent on a weekly basis.
- The expert team is accessible at all times; engineers, technicians, and sales.
Superb Quality Castellation PCB Products from PCBTok
We value our customers in PCBTok; thus, we are constantly seeking knowledge in this field despite our over twelve years of experience.
PCBTok wants to deliver their customers only the premium Castellation PCB that is made out of high-quality raw materials, and up-to-standard procedures.
Our dedication to providing top-notch Castellation PCB products and exceptional customer service has made us recognized around the globe.
We are always committed to satisfying the Castellation PCB demands of our customers.
All of these are performed by our expert staff; hence, we are also dedicated to upgrading their abilities. This is because we believe that if they excel, then so do our Castellation PCB products.
Castellation PCB By Feature
The Half-Hole Castellation PCB requires its hole to be plated. As its name indicates, this type of hole is cut in half throughout the board. Additionally, they are the best alternative for combining two different circuit boards.
The Multilayer Castellation PCB offers more flexibility in some situations. However, the more layers you add, the more it will reduce its versatility. They are highly preferred in high-end consumer electronics applications.
The HDI Cut Castellation PCB has become more popular in the communications industry because of its high signal integrity since it utilizes blind via and via in-pad technology. Also, it is a relatively inexpensive type of board.
The Customized Hole Castellation PCB is ideal in applications wherein it requires a lot of freedom in designing the layout, and integrating several components. We are capable of providing this for you.
The Edge Plating Castellation PCB can also be termed copper plating. It covers the surfaces of the circuit board from top to bottom. In addition, this type of board is ideal if you’re seeking a reliable connection between the board and traces.
The Blind Via Castellation PCB is a way of connecting layers. A blind via connects only two or more inner layers. In addition, it penetrates from the outer layer of the board, but it will not pass through to the next outer layer.
Castellation PCB By Layer (5)
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The 4-Layer Castellation PCB has way better thermal control than the lower count layered boards. Also, the more layers it has, the more durable it will be. Thus, it is suitable for industrial control applications.
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The 6-Layer Castellation PCB offers way better routing for low to high-speed signals compared with the 4-Layer. In addition, it possesses enhanced EMI. As a result, they are becoming popular in the communications industry.
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The 8-Layer Castellation PCB is highly preferred in complex devices wherein there’s a need for reduced EMI. It can be a cost-effective option due to its longer lifespan and increased overall performance.
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The 12-Layer Castellation PCB is suitable for high-speed electronic devices because of its two additional signal layers that improve the overall signal integrity. They are economical because it is halogen-free and lead-free.
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The 16-Layer Castellation PCB has become more popular in high-density and high-frequency applications because of its capability to reduce signal interference. Thus, they are ideal in the communications industry.
Castellation PCB By Surface Finish (5)
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The ENIG Castellation PCB is the most recommended surface finish in the industry because of its wide array of benefits including its average cost, longer shelf-life, and exceptional flatness and smoothness it offers to the board.
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The Immersion Silver Castellation PCB requires thorough and sealed packaging because of its risk of tarnishing when exposed to air. However, it has the capability to be reworked.
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The OSP Castellation PCB can also be termed as the ant-tarnishing finish due to its organic materials that prevent the copper from being oxide. In addition, they are considered to be ecologically friendly since it doesn’t have any lead.
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The HASL Castellation PCB is the least expensive type of finish among all the others. They offer a good balance between through-hole and large SMT components. In addition, this type of finish can be free from lead too which makes it economical.
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The Immersion Tin Castellation PCB is ideal for small components due to the flatness of its coating. In addition, this finish offers a smooth and flat surface. It can be very sensitive to touch; thus, gloves must be worn.
Castellation PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Importance of Castellation PCB in your Applications
There are numerous reasons why you may want to deploy Castellation PCB in your applications. In this section, you will have an idea of where you can utilize them and the importance of utilizing them.
If your application requires replication of certain parts in your board, then you can definitely employ castellation holes on the board’s edges.
Nonetheless, Castellation PCB has a wide array of importance. But, the most common application of this is in PCB module creation. Also, you can utilize a Castellation PCB if you wish to glue together separate boards to guarantee its solder joint structure.
Recommended Design Attributes of a Castellation PCB
To get the most out of a Castellation PCB, there are certain features that need to look at in its design. Here are some of the design attributes to look at:
- Surface Finish – The most recommended finish for this type of board is ENIG.
- Size – We recommend utilizing its highest option size available.
- Number of Holes – The holes may depend on the design and your applications; hence, careful consideration of their numbers is crucial. It should be easy to align and assemble.
- Pad – Similar to its size, we recommend the largest possible pad option.
You can contact us if you want further information on this.
Advantages of PCBTok's Castellation PCB
The perks of Castellation PCB are very useful in electric modules. Here are some of the reasons why it’s popular in these types of applications:
- Merging – It is possible to join two separate boards to solidify solder joint quality.
- Mounting – Attaching Castellation PCB to another PCB has made simple.
- Functionality – They are ideal in small modules or breakout boards such as Wi-Fi modules because they can enhance their performance.
- Components – It can be easily configured depending on the needs of the client.
There are more advantages that a Castellation PCB can offer to your applications. Simply message us to have more idea of its capabilities.
Delivering Top-Notch Castellation PCB is PCBTok's Expertise
Selecting the incapable manufacturer for your Castellation PCB can drag its performance down to vain. With PCBTok, you can guarantee that your Castellation PCB is made sure that it is on its highest quality possible and will function efficiently.
Castellation PCB requires the most sophisticated technology in manufacturing. We at PCBTok regularly upgrade our machinery and techniques up-to-date.
We have been in the industry for over twelve years, and we’re fully equipped with the knowledge needed in producing top-notch Castellation PCB. In addition, we are more than capable of customizing your Castellation PCB according to your requirements.
All of these are the things you must look out for in choosing the right manufacturer for your Castellation PCB, and we all possess all of these to please your needs.
Castellation PCB Fabrication
Since we’re already equipped with the recommended design attributes for a Castellation PCB, we will now share the recommended design layout of it.
- Size of Half-Hole – 0.8 mm
- Distance of Pads – 0.25 mm
- Routing Tolerance of Half-Hole – ±15 mm
- Overall Layout Design – Routing Process
- Diameter of Holes and Side Layer Pad – Large
- Surface Finish – ENIG (recommended)
These are the features you might want to look at incorporating into your Castellation PCB to ensure that it will be of its highest-quality possible.
For more details about the design layout; just send us a message.
The manufacturing process of a Castellation PCB requires careful handling since it can be very sensitive. These are the following phases we perform:
- It goes through from PCB Drilling on the edge of its substrate plate.
- Next, plating through the hole is performed.
- Panel plating, milling castellation holes, and removing anti-plate films.
- It now undergoes PCB Etching to remove the unwanted copper.
- Next, peel tin from the substrate and remove it from the holes.
- Finally, we expose the copper of the Castellation holes.
Each of these phases in the production procedure has its own guidelines for performing; we only deploy the most experienced staff to conduct these.
You can ping us if you want a more in-depth understanding of this.
OEM & ODM Castellation PCB Applications
Most Industrial Control devices require the usage of breakout boards for a variety of reasons, and the Castellation PCB is capable of working positively on it.
Due to Castellation PCB’s capability to be integrated into small modules, and combining two separate boards for solder joint quality, they are deployed in high-end consumer electronics.
One of the advantages of utilizing Castellation PCB is its ability to assist in creating wireless PCB to PCB links; hence, they are widely used in the communications industry.
Since Castellation PCB is capable of integrating modules that can be produced by a single board; they are commonly deployed in power applications.
Most Automobile Peripherals are constructed to be ready for future upgrades; hence it requires a board that its components can be easily altered, and a Castellation PCB is capable of that.
Castellation PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Castellation PCB: The Ultimate FAQ Guide
If you are considering purchasing a new PCB, you may be wondering if the Castellation PCB has a solder resist layer. If you are still unsure, read our FAQ about Castellation PCBs. It will address many of your most common questions about the process, from choosing a board to ordering components. Read on to learn how these features work and how they can help you improve your design.
What is a Castellation PCB? It’s also called edge plating PCB. The vias are placed on the outer edges of the Castellation PCB. These holes are semicircles that help with board assembly. When soldering, these holes allow you to align the boards and ensure they are positioned correctly. Here are some frequently asked questions about Castellation PCBs, including how they differ from other types of boards.
What exactly is a Castellation? This method connects two PCBs directly and is ideal for small modules and breakout boards. It also supports wireless PCB-to-PCB connections. Soldering modules with perforations can be difficult, so make sure you understand how to properly connect the two boards. Castellation PCBs should have as many holes as possible to fit the space you are using.
How do I make Castellation holes in the PCB? Unlike traditional holes, these specialized holes are drilled from the edge of the substrate and allow you to place SMD components. Although it is difficult to create such holes during standard PCB manufacturing, they are an important part of many electronic devices. This article will describe how to create and use Castellation PCBs.