Change Language
Your Ideal Producer for CEM-3 PCB
PCBTok stands for Safety with Quality. With our CEM-3 PCB, you can be certain of:.
- High-end PCB equipment that is constantly updated by PCBTok
- World-wide recognition by major brands
- Delivery that is on-time and on your schedule
- ISO certificates: ISO-9001:2015 & ISO-14001:2015
Call now for us to produce CEM-3 PCB. They’re similar to FR4 by supporting much needed high data rate transfer.
One of the Best Deals for CEM-3 PCB
We have the ability to adhere to CEM-3PCB standards for stiff or flexible materials for the product’s effectiveness
Our effective PCBs enable consumers to connect immediately in their digital gadgets.
This is good for your business if you are an OEM or business leader.
Because our PCBs have a definite lifespan, it is for long-term use.
Your savings pile up and your costs go down.
Trust PCBTok. Who else can make CEM-3 PCB, Multilayer PCBs, PCBs with customized designs for you so easily but us?
CEM-3 PCB By Feature
Rigid PCB components are needed for industrial applications demanding regular use. Customers frequently request CEM-3 PCB, which is utilized in printers and CPUs.
To optimize the area of your electrical connections, multilayer CEM-3 PCB can be specifically made as Embedded / Miniaturized Digital CEM-3 PCB.
The when our brand is what you purchase, you get to make the most of your resources. For eco-safety sake, choose Halogen-Free PCB, or Lead-Free.
We boost compatibility with new digital gadgets. Any OEM PCB or ODM PCB we can create for you is referred to as the Digital CEM-3 PCB.
Customized CEM-3 PCB is a design that PCBTok and the customer have decided mutually to be feasibly used as a component in a device, e.g. a home appliance.
The copper base of this OEM CEM-3 PCB, which is comprised of a mix of glass cloth and glass mat, is sturdy enough for your needs most of the time.
CEM-3 PCB By Usage (6)
-
PCBs used in point-of-sale devices, fax machines, photocopiers, and even devices with Internet of Things capabilities are referred to as Office Equipment CEM-3 PCB frequently.
-
Personal devices are the preferred applications for Home Appliances CEM-3 PCB. These can do a variety of jobs, such as cooking, recording audio, storing batteries, etc.
-
Rigid or Rigid-flex PCBs can be used for the Motor CEM-3 PCB. This is so that they can be both strong and secure. Rigid PCBs are faster to make.
-
For Engine CEM-3 PCB, this one’s base material is comparatively durable, especially when it’s used with the semiconductors for consumer applications.
-
Top feature for this PCB: it provides excellent electrical and thermal conductivity for industrial applications, which is what Commercial CEM-3 PCB is made for.
-
Analog or digital PCBs are both available for the Universal CEM-3. This will fall on accordingly to the gadget it is meant to be a component of.
CEM-3 PCB By Color (6)
-
Aside from customizing with color, we also produce huge PCBs and thick PCBs. Red CEM-3 PCB is just another soldermask variant to avail of.
-
If you purchase a Blue CEM-3 PCB or any other PCB stack-up order from PCBTok, you will receive top-notch designs and schematics. Blue PCB has a neat look.
-
Because we apply advanced PCB inspection techniques for all of our final products using any substrate, Yellow CEM-3 PCB benefits from reduced flaws.
-
Class 2 and 3 IPC ratings for Green CEM-3 PCB are guaranteed if you get from PCBTok. This is true for our whole product line, independent of soldermask color.
-
Using sound processing technique to make White CEM-3 PCB, It is designed to withstand repeated handling and manipulation because it is a consumer good.
-
These Black CEM-3 PCB items can be converted into industrial tools that are essential for maintaining electrical safety during routine everyday activities.
CEM-3 PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
The Best Offer for CEM-3 PCB
In addition to making PCBs that are Heavy Copper PCB, we can also build PCBs that are flexible, light, and ultra thin.
With the CEM-3 and CEM-1 materials, all of these are feasible. However, CEM-3 is more so variable with the product line offerings.
If you anticipate ordering a big batch, we’ll get you started with a free sample.
We’ll offer you a free sample if you plan to order a large quantity.
Contact us now, let’s get your order for CEM-3 done.
CEM-3 PCB Outlasting the Competition
We are far ahead of amateur PCB makers for CEM-3 PCB.
- Create your PCB 1 product with up to 40 layers for CEM-3.
- Superior to CEM-1, FR-1, or FR-2 in terms of quality
- Use both hand soldering and wave soldering effectively for PCBs.
- use of sophisticated testing methods, such as visual inspection microscopes
The unchallenged leader in PCBs is PCBTok. One of the leading PCB fabricators, our business is based in Shenzhen, China.
Quality Assured PCB CEM-3 Processing
Get the PCBTok advantage! We don’t like to disappoint our customers
Are you worried about dreaded CEM-3 PCB production problems?
If there is a problem, we will then send you a thorough 8D report to identify the root cause.
If you need a WIP report, we can give you one if your order for CEM-3 PCB or PCB is big enough.
Additionally, we will be happy to accommodate your request for a Certificate of Conformity. Contact us now for further details.
Our CEM-3 PCB is Trustworthy
Our product is far superior to those CEM-3 that fall short.
It’s because we have PCB industry experience starting the year 2008.
For your lighting, home appliance, and computer peripheral PCB requirements, PCBTok ensures the highest standards.
We can achieve these goals using a cost-effective PCB like the CEM-3.
Customers of ours who try us once keep on coming back for more. So, give us a try today!
CEM-3 PCB Fabrication
PCBTok’s economical CEM-3 PCB option wins over customers.
We have the answer for you if you require any PCBs that are related to the CEM-3.
Customers who purchase CEM-3 frequently request advanced PCBs like Microvia, Panelized, and Mobile/WiFi PCBs later on.
What’s more? You may ask…
We can also provide you with professional PCB engineering services.
Because we have these ready, please don’t hesitate to inquire now. You only deserve the superior CEM-3 PCB from a masterful fabricator.
Genuine raw materials and rigorous testing make our CEM-3 PCB noticeable excellent.
Layers: Choose single layer to up to as high as 40.
Board Thickness (finished): 0.4-3.2mm
Outer & Inner Layer Copper Thickness: 1/3 oz to 3 oz
Flammability: UL 94V-0
Dimension Tolerance: ±4mil
Additional Details: Surface treatment can be HASL, Lead-Free HASL, Nickel
OEM & ODM CEM-3 PCB Applications
These fundamental circuits are used in consumer products’ primary electrical components. The majority of CEM-3 PCB are mass made and best-selling.
This telecom-specific PCB is primarily intended for supporting important applications. For instance, the CEM-3 PCB can be utilized on the interface panels in Fiber Optics technology.
CEM-3 PCB for Transportation Industry refers to circuit boards for smaller devices like GPS trackers and portable two-way radios. These are not inside-automotive PCBs.
Although it’s not the best solution for mobile and telecom applications, this is a less expensive choice. WiFi networks can be supported by these CEM-3 PCB for Communications Equipment.
Those found within computer mice, mechanical keyboards, Bluetooth headsets, and other similar devices are immediately recognized as CEM-3 PCB for computers and peripherals.
CEM-3 PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
CEM-3 PCB: The Completed FAQ Guide
Before you begin manufacturing a CEM-3 PCB, you must first learn about the manufacturing process. This guide covers the basics of CEM-3 PCB design, from choosing a template to the final manufacturing process. If you’re unsure what to expect from the manufacturing process, this FAQ guide will provide answers to your most frequently asked questions. It is hoped that it will assist you in making an informed decision about your PCB project.