Your Ideal Producer for CEM-3 PCB
PCBTok stands for Safety with Quality. With our CEM-3 PCB, you can be certain of:.
- High-end PCB equipment that is constantly updated by PCBTok
- World-wide recognition by major brands
- Delivery that is on-time and on your schedule
- ISO certificates: ISO-9001:2015 & ISO-14001:2015
Call now for us to produce CEM-3 PCB. They’re similar to FR4 by supporting much needed high data rate transfer.
One of the Best Deals for CEM-3 PCB
We have the ability to adhere to CEM-3PCB standards for stiff or flexible materials for the product’s effectiveness
Our effective PCBs enable consumers to connect immediately in their digital gadgets.
This is good for your business if you are an OEM or business leader.
Because our PCBs have a definite lifespan, it is for long-term use.
Your savings pile up and your costs go down.
Trust PCBTok. Who else can make CEM-3 PCB, Multilayer PCBs, PCBs with customized designs for you so easily but us?
CEM-3 PCB By Feature
CEM-3 PCB By Usage (6)
CEM-3 PCB By Color (6)
CEM-3 PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
The Best Offer for CEM-3 PCB
In addition to making PCBs that are Heavy Copper PCB, we can also build PCBs that are flexible, light, and ultra thin.
With the CEM-3 and CEM-1 materials, all of these are feasible. However, CEM-3 is more so variable with the product line offerings.
If you anticipate ordering a big batch, we’ll get you started with a free sample.
We’ll offer you a free sample if you plan to order a large quantity.
Contact us now, let’s get your order for CEM-3 done.
CEM-3 PCB Outlasting the Competition
We are far ahead of amateur PCB makers for CEM-3 PCB.
- Create your PCB 1 product with up to 40 layers for CEM-3.
- Superior to CEM-1, FR-1, or FR-2 in terms of quality
- Use both hand soldering and wave soldering effectively for PCBs.
- use of sophisticated testing methods, such as visual inspection microscopes
The unchallenged leader in PCBs is PCBTok. One of the leading PCB fabricators, our business is based in Shenzhen, China.
Quality Assured PCB CEM-3 Processing
Get the PCBTok advantage! We don’t like to disappoint our customers
Are you worried about dreaded CEM-3 PCB production problems?
If there is a problem, we will then send you a thorough 8D report to identify the root cause.
If you need a WIP report, we can give you one if your order for CEM-3 PCB or PCB is big enough.
Additionally, we will be happy to accommodate your request for a Certificate of Conformity. Contact us now for further details.
Our CEM-3 PCB is Trustworthy
Our product is far superior to those CEM-3 that fall short.
It’s because we have PCB industry experience starting the year 2008.
For your lighting, home appliance, and computer peripheral PCB requirements, PCBTok ensures the highest standards.
We can achieve these goals using a cost-effective PCB like the CEM-3.
Customers of ours who try us once keep on coming back for more. So, give us a try today!
CEM-3 PCB Fabrication
PCBTok’s economical CEM-3 PCB option wins over customers.
We have the answer for you if you require any PCBs that are related to the CEM-3.
Customers who purchase CEM-3 frequently request advanced PCBs like Microvia, Panelized, and Mobile/WiFi PCBs later on.
What’s more? You may ask…
We can also provide you with professional PCB engineering services.
Because we have these ready, please don’t hesitate to inquire now. You only deserve the superior CEM-3 PCB from a masterful fabricator.
Genuine raw materials and rigorous testing make our CEM-3 PCB noticeable excellent.
Layers: Choose single layer to up to as high as 40.
Board Thickness (finished): 0.4-3.2mm
Outer & Inner Layer Copper Thickness: 1/3 oz to 3 oz
Flammability: UL 94V-0
Dimension Tolerance: ±4mil
Additional Details: Surface treatment can be HASL, Lead-Free HASL, Nickel
OEM & ODM CEM-3 PCB Applications
CEM-3 PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“Surprisingly, my company and I enjoy working with PCBTok. Our sales representative was fantastic and kept his promise. Nothing more is possible. I visited there several times before settling on a variety of PCBs and PCB peripherals. Deal was amazing, but all I asked for was delivery on my schedule. The follow-up on the additional items we agreed upon was excellent.”Hank Mizell, Materials Director from Texas, USA
“PCBTok is the place to go if you’re looking for high-quality PCBs and PCBA. They have a wide variety of goods. The salespeople and other employees are helpful. If you see something you like, give them a call because their inventory changes frequently. If messaging is more your style, you can also do that. I purchased my first Chinese-made PCB components here for our equipment, and everyone was incredibly friendly and helpful.”Alison Pegram, Procurement Officer from London, England
“Nowadays, it is quite difficult to get high-quality PCB workmanship and good, old-fashioned customer service. These folks have a long history of prioritizing the demands of their clients. We are so happy with PCBTok that we are considering three additional updates for our fleet of products. Naturally, they will receive our business. The service has my full satisfaction. Bravo.”Alex Haapsalo, Strategic Sourcing Director from Finland
CEM-3 PCB: The Completed FAQ Guide
Before you begin manufacturing a CEM-3 PCB, you must first learn about the manufacturing process. This guide covers the basics of CEM-3 PCB design, from choosing a template to the final manufacturing process. If you’re unsure what to expect from the manufacturing process, this FAQ guide will provide answers to your most frequently asked questions. It is hoped that it will assist you in making an informed decision about your PCB project.
If you are not familiar with PCB design, you may want to know what a CEM-3 PCB is. This is a brief description of this complex process. A PCB is basically a printed circuit board and the design process is the same. To design your CEM-3 PCB, you should use professional-grade PCB design software. To create your own, ideally, you should have a basic understanding of PCB design.
While there are some similarities between FR-4 and CEM-3 PCBs, they also have some significant differences. CEM-3 printed circuit boards can be double-sided or single-sided. They are comparable to FR-4 boards in terms of price and durability but offer several advantages. They are often found in cell phones and other electronic devices. CEM-3 PCBs are also less expensive than FR-4 PCBs. Regardless of how you choose to build your PCB, please read the specifications carefully.
CEM-3 PCB is a new PCB material. It is a copper-clad laminate, similar to FR4. CEM-3 is a flame-retardant, smooth material that was originally developed to replace FR-4 material. It is used in a variety of applications, including electronics. The sheet is typically made from a nonwoven impregnated with a flame retardant epoxy resin.
The material has excellent electrical and mechanical properties. It has excellent machinability tolerances but is not as thick as FR-4. It has lower thickness and accuracy than FR-4 but is less expensive. CEM-3 PCBs are more flexible than FR-4 and are lead-free and solderable. These features make CEM-3 an excellent choice for electronics such as automotive electronics, appliances, and home appliances.
CEM 3 PCBs are similar to FR-4 boards in terms of solder heat resistance, lightweight, and miniaturization. They are commonly used in high-frequency electronic devices such as fax machines, telephones, and automotive electronics. This material has considerable bending and thermal properties. Here are some of the advantages of CEM 3 PCBs. Read on to learn more about this topic.
Manufacturers use this material primarily to control the mechanical and electrical properties of the board. The overall chemistry of the board is also influenced by the epoxy resin. This material is widely available and adheres easily to the copper foil. It creates an ideal bond between copper fibers and glass. It is inexpensive and soluble in a wide range of solvents. This material is suitable for a wide range of applications, including medical devices, electronics, and consumer products.
Properties of CEM-3 PCB
CEM-3 PCBs have CCL on both sides, making them easier and safer to drill. These boards have similar properties to FR-4. They are made of epoxy resin, which is a good low-cost option. CEM-3 PCBs are also fire resistant and can withstand high temperatures. In addition to having excellent thermal and mechanical properties, it is flexible and durable.
CEM-3 substrates are becoming more and more popular around the world. It is produced in Japan, Korea, Taiwan, and China. In Japan, it is gaining popularity faster than FR4 and will surpass it in the next decade or so. At the same time, it is a much cheaper alternative to FR-4. It is easy to see why CEM-3 is becoming so popular in so many industries.
If you are in the market for a new PCB material, you may be wondering what the differences are between CEM-3 and the more popular FR4. There are some significant differences. While FR4 is superior in some applications, CEM3 is superior in many other applications. In this article, we will explore the differences and why CEM-3 is the better choice.
FR4 is a material consisting of woven glass fibers and epoxy resin. CEM-3 is a non-woven fiberglass fabric. CEM-3 is cheaper and more perforable than FR4, but it meets the same specifications. Compared to FR4, CEM has a lower flexural strength and a higher coefficient of thermal expansion. This makes it more attractive for a wide range of applications that require robust PCBs.
While FR4 is commonly used in everyday equipment, both CEM-3 and FR4 are premium materials. CEM-3 has greater thermal resistance, while FR4 is better suited for low-frequency applications. These materials are also cheaper and easier to produce. If you are considering a PCB substrate material for your next project, talk to your manufacturer about their recommendations.
CEM-3 PCB Material
While CEM-3 is a cheaper and lighter alternative to FR-4, it offers comparable performance but less mechanical durability. While it is not as durable as FR-4, it is a good choice in some cases. If you are willing to sacrifice cost, this may be a good choice. There is no significant advantage to using CEM-1 over FR-4.
If you plan to use CEM-3 printed circuit boards in your next project, certain precautions must be taken during design. First, choose the right size for the PCB. Dielectric layers, wiring copper, and line impedance all affect board size. After that, mark vias on the board to route the signals. After that, you can start laying out your PCB design on the CEM-3 schematic. When you have all these elements, it’s time to start the manufacturing process.
CEM-3 PCB Design
The CEM-3 PCB manufacturing process is extremely complex. The process is similar to FR-4. The laminate is made by heat pressing an alkali-free glass nonwoven coated with a flame retardant epoxy resin. However, you can customize the process to meet your specific requirements. When selecting a manufacturer, make sure the company has experience with the type of application you intend to design.
When designing a CEM-3 PCB, keep in mind that it has CCL on both sides. This makes drilling easier and ensures that the glass pads remain secure. The CEM-3 PCB has many features in common with the CEM-1 PCB. The material used in both cases is epoxy resin, which is both inexpensive and effective. If you want to save money, consider using the CEM-3 material.
The answer to this question will depend on your application and design requirements. For example, you can change the number of power and ground layers, as well as the surface mount material and solder resist process. Then you can choose the size and number of layers of the printed circuit board. After all, you want your product to operate as efficiently as possible.
The manufacturer’s experience in manufacturing PCBs is one of the most important factors to consider. Check that they have cutting-edge technology and international certifications. The manufacturer’s yield and quality control reports should be available for review. You should also look for an organized, clean facility with experienced and dedicated experts for your project. In addition, they should have used your application before.
The manufacturing process for CEM-3 PCBs is similar to that of FR-4 boards. These materials are laminated and impregnated with epoxy resin. CEM-3 boards have several layers, and not all materials can support them. The process is the same as FR-4 and can be customized to your specifications. If you are not sure which CEM-3 manufacturer is best for you, please review the specifications on their website to help you make your decision.
In addition to FR-4, CEM-3 is a composite material that can be used in PCBs. It is an almost complete replacement for FR-4 in terms of dimensional stability. CEM-3 is also more resistant to leakage than FR-4 PCB products. This material has similar properties to FR-4, but with better thermal conductivity. However, if you intend to design products for the consumer electronics market, CEM-3 PCBs are often a better choice than FR-4 products.