Exceptional Ceramic PCB by PCBTok
PCBTok is a frequent participant of circuit board trade shows like PCB West. Trade expos are where we can learn more about circuit board development.
We have the task of keeping our knowledge of the industry up to date as a leading circuit board fabricator of Ceramic PCB.
Hence, we are kept up to date on the latest developments in the manufacturing of these cutting-edge items. We’re also aware of the changes that need to be made to make your company world-class.
An Excellent International Ceramic PCB Fabricator
Our stalwart Ceramic PCBs outperform the competition as a consequence of our hard work and dedication.
We are not only inexpensive, but we also deliver your things quickly and efficiently.
We guarantee your satisfaction with our products 100%.
Call us right now to place an order for a PCB. You will never ever be sorry—we will exceed your expectations.
We can offer competitive prices because of our extensive manufacturing capabilities. We create Ceramic PCBs according to the requirements stated in your Gerber file.
Rigid PCB By Feature
You can get copper thicknesses other than the typical 1 oz with Direct Plated Copper or DPC Ceramic PCB, this time with ceramic substrate material. Heat dissipation is great with this material.
Customers appreciate the DBC Ceramic PCB’s copper thickness, which outperforms DPC. It is possible to create copper as thick as 10oz using an advanced oxidation method. It’s also known as Al2O3 PCB or AlN PCB.
Microwave PCB Low Temperature Co-Fired Ceramic or LTCC Ceramic PCBs are dedicated to microwave applications as well as particularly complicated and digital applications.
If Alumina or AlN material is treated, this form of PCB can be made. The first several versions of the Ceramic PCB are of this sort. HTCC is favored by high power circuits due to its inherent dependability.
Stripline and microstripline applications come to mind when this PCB is mentioned. The Low-Temperature Ceramic PCB can withstand humid conditions as well as hot conditions. Another significant advantage is that it is 3D compatible.
Rogers materials are primarily used in High-Temperature Ceramic PCB. These PCBs are employed in power plants and high voltage circumstances where they can be specifically tailored for microwave applications.
Ceramic PCB By Material (6)
Ceramic PCB By Surface Finish & Color (6)
Ceramic PCB Effects on Devices
Are you looking for Ceramic boards? Those that are Multilayer Ceramic PCBs, in particular? Welcome to our store, then.
We can use your Ceramic PCB on a variety of devices, including the following:
- All types of semiconductors
- Electronics for automobiles (engine, on-board entertainment, navigation, etc.)
- Oscillators for various industrial grades
- Solid-State Relay (SSR)
- Solutions for lighting (LED, for example)

Ceramic PCB by PCBTok Highlights
The benefits of adopting ceramic PCBs are highlighted by using PCBTok’s items.
These boards are easily adaptable to High-frequency applications.
These PCBs can withstand temperatures of up to 800 degrees Celsius, ensuring excellent heat performance (as operating temperature).
Sensors are widely used in the automobile industry, therefore if you’re in the automotive EMS business, partnering with us can benefit you. We make it easier and less expensive for you.
Finally, HDI capability is excellent. This is also in demand these days.
Ceramic PCB Quality Assurance Process
Ceramic PCB multilayer boards have long been recognized as essential in electrical equipment. This is especially true in circumstances requiring high power and thermal conductivity. Quality Assurance Process is included with our Ceramic PCB.
- We make the most of your device’s power
- Class 2 or 3 IPC classification is applied
- Your soldermask’s color can be customized (usually white or yellow preferred)
- Strict AOI inspection, as well as a functional test
Contact us now for incomparable Ceramic PCBs!

Acknowledged Ceramic PCB Manufacturer


We place a high value on serving you well.
As a responsible PCB manufacturer, we guarantee product quality. If it does not satisfy our high requirements, it will not be sent to your door.
High Tg, High Frequency, and High-Speed PCBs are often the arena of Ceramic PCBs.
In addition to these superior PCBs, we can provide Ceramic PCBA services.
We can also create Prototype PCBs, PCBs for Microstrip needs, and other unique requests.
As evidenced by some verified consumers. All of these things are within our capabilities.
Ceramic PCB Fabrication
For your Ceramic PCB, hire only the most adept producer of PCBs in the market.
PCBTok hires PCB Professionals with extensive experience in the field.
On request, in-house engineers will respond to your engineering queries within 1-2 hours.
And there’s more. Our employees’ training is intensive. We emphasize the need for clear communication with our clients: you.
You can be assured that our manufacturing process is second to none. You can be confident we are international-grade.
Are you seeking a cost-effective way to meet your PCB needs? Then go to PCBTok for Ceramic PCBs.
We have everything you need or look for, not just with Ceramic PCBs, but RF PCBs and Microwave-dedicated products too!
A Gerber file is all that is required to get started with PCB design. We can provide custom PCB design services if needed.
We only utilize the most recent PCB design software, such as Altium and Kicad. We make certain that the employees who take your inquiries are properly trained.
OEM & ODM Ceramic PCB Applications
Satellite communications and ground radars all require high-quality PCBs. These Ceramic PCBs, when well-made and require little maintenance.
Ceramic PCBs, as well as metal core PCBs, assist telecommunication and broadband. This is related to the impedance control quality of the materials.
Ceramic PCB is suitable for solar cell substrates as well as antenna and radar applications. This is due to its energy management efficiency.
Polyimide is used to attach ceramic PCBs for high-power applications, especially when flex components are present. We also build High Tg PCBs.
Ceramic PCB for LED Lighting is popular since ceramic is a heat-resistant material. Ceramic PCBs, unlike FR4, transport excess heat away from device’s sensitive areas.
Ceramic PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Ceramic PCB – The Completed FAQ Guide
Consider getting a ceramic PCB for your next project if you need an excellent PCB. These circuit boards have high thermal conductivity, making them suitable for a wide range of devices. They are also naturally resistant to most chemicals and daily moisture. Ceramic PCBs are therefore ideal for high-reliability, high-air-sealing, and high-temperature environments.
Here’s what you need to know if you want to buy a ceramic PCB.
A ceramic PCB is a type of circuit board that is constructed from a single layer of material. Typically, the material used is glass or a conductive metal paste. A layer-by-layer screen printing or laser drilling process is used to apply the metal elements to the ceramic board.
Following the application of the material layers, the stack is baked in a process known as sintering. A ceramic PCB’s firing temperature is typically less than 900 degrees Celsius, which corresponds to the sintering temperature of the gold paste.
It has a thermal conductivity of 9 to 20 W/m, making it an excellent choice for high-frequency data transfer. Its ability to quickly transfer heat is useful for machinery such as transformers and capacitors that require high-frequency data transfer.
They are less expensive than traditional metal PCBs and can improve performance and reliability without adding weight or complexity. Ceramic PCBs have several advantages over metal PCBs, including high resistance to corrosion and extreme temperatures.
DPC Ceramic PCB
One of the most significant advantages of ceramic PCB is its inherent resistance to most chemicals. It is impervious to moisture, solvents, and consumables. It is also an excellent candidate for high-reliability applications such as semiconductor devices and high-temperature environments.
Ceramic PCB is suitable for manufacturing solar panels, which require a high level of thermal conductivity and toughness, in addition to its high resistance to moisture and chemicals.
Ceramic PCBs are made up of three layers. Copper is present in the circuit layer. A thermally transitive substrate serves as the insulating layer. The third layer is made of a copper-aluminum alloy.
Aluminum Nitride (AIN) is the most commonly used commercial ceramic material today. It has a low thermal expansion coefficient, good thermal transmission, and does not react with the majority of semiconductor manufacturing chemicals. Microwaves, heat sinks, molten metal processing machines, and insulators can all benefit from AIN boards.
This method entails sintering a thick layer of the ceramic material on a metal substrate at temperatures exceeding 1000 degrees Celsius. An organic binder is decomposed during this process, and resistors are formed. The circuit is then soldered and protected with a solder mask. Interchangeable conductors, resistors, and electric capacitors can be used by ceramic PCB manufacturers.
There are numerous advantages to using ceramic boards over standard boards. They are ideal for miniaturization due to their high thermal conductivity, low expansion coefficient, and flexibility. Ceramic boards provide excellent performance because they are a less complex material to manufacture.
Ceramic PCB Structure
Ceramic printed circuit boards are extremely versatile and can be multi-layered for more efficient electronics. These benefits are driving an increase in the use of ceramic PCBs among engineers.
They are more efficient and long-lasting than standard PCBs. They are extremely efficient in a wide range of industries, from consumer electronics to medical devices. Ceramics are worth the investment regardless of how they are used. You’ll be surprised how useful they are. If you’ve ever wondered how to make ceramic PCBs, now is the time to learn how.
Ceramic has numerous advantages as a base material for PCBs. Ceramics have excellent electrical properties and a strong bond between metal and ceramic layers. They can also be used on the same board for conductive layers. Through-hole connections are also possible, allowing for greater customization.
The advantages of using ceramic as a base material for PCBs are listed below. If you’re looking to buy a PCB, keep reading!
Ceramic PCBs have high thermal conductivity and a low Young’s modulus, among other advantages. Because ceramics are highly flexible and can withstand high pressures, they are an excellent choice for PCBs in industrial applications. They are also insulators and are less likely to conduct electricity and heat through the substrate of the board, making them ideal for heavy-duty applications. Ceramic PCBs are also less expensive than metal PCBs.
They are much easier to drill through than non-ceramic substrates due to these properties. Furthermore, they are free of flux smear, which can make it difficult to pass through ceramic substrates.
Furthermore, ceramic PCBs can be manufactured in a variety of PCB design configurations, including single-sided and multi-layered boards. They can be made with either small or blind vias.
The components must be rigorously inspected and tested to ensure high-quality ceramic PCB. Electrical and mechanical performance must be verified. Errors in the ceramic surface can be detected using optical inspection and computer-aided optical examination. A high-resolution image can reveal the sensitivity of a ceramic PCB to shear forces. Furthermore, an x-ray examination is used to detect any flaws. It is more accurate and efficient than manual inspection and can handle large quantities of ceramic PCBs.
You’re not alone if you’re wondering, “How Many Types of Ceramic PCBs Are Available?” These boards are used in a variety of applications in the electronic industry. Ceramic boards have excellent thermal conductivity and stability at high temperatures, as well as stable dielectric properties.
Ceramic boards are also extremely tough and long-lasting, with natural resistance to chemicals, solvents, moisture, and consumables.
Despite the numerous advantages of ceramic PCBs, many manufacturers and designers are unsure which to use. Ceramic boards are ideal for high-temperature applications. They’re also great for air sealing and dependability. Ceramic boards are an excellent choice for high-power circuits, chip-on-board modules, proximity sensors, and a variety of other electronic applications due to their low dielectric constant and high thermal conductivity.
Alumina ceramic PCB
While most ceramic PCBs are made of a single material, some are made of multiple materials. Ceramic PCBs can be made with a variety of metal bases, including Silicon Carbide, Boron Nitride, Copper, Gold, Silver, and Tin. Fabricators use a layer-by-layer screen printing process to apply these metal elements. The metal base on higher-quality ceramic PCBs is typically a thin film.
Aluminum Nitride Ceramic PCB
Despite the fact that ceramic PCBs are more expensive than conventional PCBs, they have numerous advantages. The main benefit is the high thermal conductivity. Thermal vias and metal planes are typically required on the inner layers of traditional PCBs. Thermal vias and thermal landings are not required on ceramic PCBs. This enables them to transport heat to an active cooling element, a thermal landing, and even the device’s packaging.
The end product’s durability is one of the benefits of ceramic PCB manufacturing. This material is well-known for its toughness and slow aging. This lessens the likelihood of replacement or repair. Furthermore, ceramic PCBs are resistant to high temperatures, which slows decomposition. Some of the advantages of ceramic PCB manufacturing are listed below. Continue reading if you want to learn more about this subject!
Ceramic has a higher thermal conductivity than FR4, which frequently has low thermal conductivity. This means that ceramic PCBs transfer heat more effectively, preventing hot spots from forming on the surface and between layers. Another advantage of ceramic PCBs is their low cost. Ceramic circuit boards are significantly less expensive than metal PCBs. However, if you need a high-performance board, this material may be the best option.
Low-temperature ceramic PCBs have greater mechanical and thermal intensity, as well as shrink tolerance. This material is preferred for products that require little heat dissipation and have a high thermal conductivity.
Ceramic PCB is also resistant to warping. Low-temperature ceramic PCBs have a higher thermal conductivity. Heat-emitting applications benefit greatly from LTCC circuits. There are numerous advantages to using ceramic PCBs.
High thermal conductivity: Ceramic circuits resist heat better than copper PCBs. They are also less electrically conductive than copper. Ceramic PCBs, on the other hand, are more resistant to shock, vibration, and electrical noise. They are also long-lasting and do not degrade over time.
Ceramic PCBs have this property, which allows them to be used in a wide range of applications. There are additional benefits to low-temperature PCB production, such as lower costs and higher reliability.