Superior Quality Copper Clad PCB from PCBTok

Copper Clad PCBs are boards that have a thin layer of copper covering the entire board. It is also known as a PCB with a thin layer of copper attached to it. Copper cladding is a process in which the surface of a PCB is plated with a thin layer of copper after the board has been manufactured.

PCBTok has a range of copper clad printed circuit boards to choose from. We offer high quality copper clad PCBs with a variety of options for you to build your next electronic project.

Get Our Best Quotation
Quick Quote

All About PCBTok’s Copper Clad PCB

Durable and versatile copper clad printed circuit boards are the popular choice for many electronic applications. Copper clad PCB offers a number of advantages over other types of PCBs, including better heat dissipation characteristics, improved electrical integrity and interference suppression through shielding properties.

PCBTok is one of the best Copper Clad PCB manufacturers. PCBTok is a China based factory that provides quality products using state of the art technology, we offer a wide range of products including PCBs, PCB assembly service and electronic components. Our mission is to provide excellent service and quality products at an affordable price.

PCBTok guarantee our customers that all our copper clad PCBS are manufactured with strict quality control from raw material to finished goods, so you can trust us for high-quality PCBs and PCBs assembly service.

Read More

Copper Clad PCB By Types

Rigid Copper Clad PCB

A neoteric assembly of rigid substrate and thin copper clad laminate. The copper is deposited on one or both sides of a rigid base material, usually glass epoxy resin.​

Flex Copper Clad PCB

Made for applications involving demanding mechanical constraints, high-temperature environments, and exposure to chemicals. Ideal for sensors, displays, etc.

Metal-Based PCB

Our metal-based copper clad PCBs are ideal for high-power and high-frequency applications. Metal-based means that the offers superior heat dissipation and better durability.

Ceramic-Based PCB

Made using a unique process that combines the attributes of epoxy and ceramic components to form a fiberglass-reinforced structure with pure copper cladding.

Paper-Based PCB

Manufactured using a low cost, environmentally friendly process and can be used in the same applications as traditional FR4 epoxy boards.

Organic Resin Based PCB

For applications where low signal loss, high speed and good dielectric properties over a wide temperature range are required. It offers excellent electrical characteristics.

What is a Copper Clad PCB?

Copper clad PCBs are a type of circuit board that is made up of two layers: a copper layer and another layer on top. The main difference between a copper clad PCB and other types of PCBs is that a copper clad has an outer layer of copper.

Copper clad PCBs are typically used for high-speed applications because they have multiple layers for electricity to pass through. This means that there are fewer restrictions on the movement of electrons in this type of circuit board than in others.

Copper cladding also improves heat dissipation on your board by increasing surface area and allowing air flow around components like chipsets or memory modules. This can allow you to lower operating temperatures without having to install larger fans or heatsinks than you would otherwise need on a non-copper-clad board—which could save money in both hardware costs and installation time/effort for technicians who have to install these components into computers or other devices like smartphones or tablets

What is a Copper Clad PCB
PCBTok Copper Clad PCB

Materials Used in Copper Clad PCB

Copper Clad PCB is made up of many different materials. Some of these materials are more important than others, but all of them are necessary to make a good product.

The most important material used in Copper Clad PCB is copper. Without this metal, there would be no conductivity between components and no way to keep electricity flowing through the device. Copper is also very malleable and can be shaped easily into different forms.

Another important material used in Copper Clad PCB production is epoxy resin. This substance is what holds everything together after it has been molded by the manufacturer. It also provides protection against corrosion and environmental damage for the long term use of these devices.

Copper Clad PCB Features

Copper Clad PCBs are a type of substrate that has copper layer on both sides. It is used for high-frequency circuits, especially as the signal line in high-speed communication networks. The advantages of copper clad PCBs are:

• High efficiency, good power dissipation capability, and low thermal resistance.
• High electromagnetic interference (EMI) shielding performance.
• Wide operating temperature range.
• Good chemical stability.
• Long service life

Materials Used in Copper Clad PCB

Reasons to Use PCBTok’s Copper Clad PCB

Reasons to Use PCBTok’s Copper Clad PCB
Reasons to Use PCBTok’s Copper Clad PCB

PCBTok’s copper-clad PCBs are a great option for those who want to make their own PCBs, but don’t have the tools or know-how.

The advantages of using PCBTok’s copper-clad PCBs include:

• The boards are made in a cleanroom, so you know they’re made with the highest quality materials.
• You can get your design done quickly, since you don’t have to wait for special equipment or parts to be made.
• The copper-clad PCBs are reasonably priced, especially considering the high quality and convenience they offer.

Copper Clad PCB Fabrication

What to Know in Manufacturing Copper Clad PCBs

Copper clad PCBs are made using two different processes: etching and laminating.

The etching process involves applying an acid solution to the copper surface, which removes all other materials except for the copper itself.

The laminating process involves applying a thin layer of adhesive tape to the copper surface before applying another layer of plastic film over it.

One thing that sets copper clad PCBs apart from many other types of printed circuit boards is their flexibility—they can withstand high temperatures without warping or bending out of shape like most other types do under similar conditions (like acrylic or phenolic substrates).

What to Know in Manufacturing Copper Clad PCBs

You will want to make sure that the board has enough clearance between components and traces. Make sure that your design doesn’t have any overlapping or shorted traces, which can cause problems with your circuit’s performance.

You should pay attention to the thickness of the copper on your board. The thicker the copper layer, the more reliable your circuit will be. However, this also makes it harder for components to fit into their allotted spaces on the board.

Make sure that your components are placed correctly and that they are placed close enough together so that they don’t interfere with each other’s operation.

OEM & ODM Copper Clad PCB Applications


The best option for building electronic devices, Copper Clad PCB is a sturdy and reliable product. It can be used in computers, modems and smart phones.


A cost-effective PCB for television that is ideally suitable for projects involving high temperature, shock, vibration and corrosive environments.

Radar PCB for Radio Communication

Our high-quality copper clad printed circuit board is designed to support a wide variety of electronics applications, including radio communication systems.


The copper clad printed circuit board for smartphone helps to connect the electronic components together. One of the most advanced copper clad PCB.

Consumer Electronics

An excellent choice for creating sensitive circuits that require fast data transfer. Used in consumer electronics because they’re highly durable.

PCBTok’s Top-of-the-Line Copper Clad PCBs
PCBTok’s Top-of-the-Line Copper Clad PCBs

PCBTok‘s top-of-the-line copper clad PCBs are a unique offering which provides an ideal solution for many advanced engineering applications. Call us now to inquire about your copper clad PCBs.

Copper Clad PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

Quick Quote
  • “PCBTok is the best PCB manufacturer I had ever worked with. We have been working with PCBTok for several years now and we are very happy with the service that they provide. They always meet our deadlines and provide us with high quality products. They helped me deliver my PCB orders on time and without any delays or problems. Their customer service is excellent. They answered all my questions and concerns in the fastest time possible. I’m definitely going to work with them again and again.”

    Antonis Daglis, Electronics Technician from Greece
  • “Anyone in need of PCBs can contact PCBTok, a business I endorse. They are a real partner in your project, not merely a PCB maker. They will respond to your queries or complaints in a timely and effective manner. They effortlessly assisted me with every element of my PCB order and never left me in the dark about anything. They take great delight in their work, have a very competent workforce, and check to see that you’re satisfied before sending your purchase.”

    Barry Peter Prudom, Project Engineer from North Yorkshire, England
  • “The finest location to purchase high-quality PCBs and PCB assembly services is PCBTok. They were really helpful with my project specs and gave me samples before mass producing my PCBs, which I bought from them. They are a highly recommended Chinese firm who provided extremely fantastic assistance with my project’s criteria. Choose PCBTok if you’re still having trouble deciding where to get high-quality boards because they are constantly there to help with your purchases and projects.”

    Richard Trenton Chase, Design Engineer from San Quentin, California
Update cookies preferences
Scroll to Top