Make Your End Products Stand Out with DBC Ceramic

DBC Ceramic substrate for printed circuit boards that added to other substrates, such as copper clad laminates. DBC Ceramic used in combination with lead-free solders for electrical interconnections and thermal management applications, with reflow solderability.

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The Ultimate Manufacturer of DBC Ceramic | PCBTok

The DBC Ceramic substrate for printed circuit boards features a solid base and good thermal conductivity.

DBC Ceramic substrate is a high purity, low strain ceramic substrate material with a low thermal expansion coefficient. It provides excellent wear resistance, thermal shock resistance and electrical insulation properties.

Avail DBC ceramic substrate for printed circuit boards from PCBTok. We have made the ultimate effort to use the best kind of materials and advanced technique in manufacturing DBC Ceramic PCB.

PCBTok is a professional PCB manufacturer, with top quality DBC Ceramic substrate for printed circuit boards. We provide the most competitive price, fast delivery and reliable after-sales service to our customers.

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DBC PCB By Feature

High Temperature DBC Ceramic

The High Temperature DBC Ceramic is a PCB that has been designed to handle high temperatures. More durable than other materials and can withstand high temperatures without wearing down or breaking.

Low Temperature DBC Ceramic

The Low Temperature DBC Ceramic is made using a process that allows you to create it at lower temperatures than traditional ceramics, making it much easier to work with and more cost-effective.

Alumina DBC Ceramic

Alumina DBC Ceramic is a special type of ceramic that is made from aluminum oxide. Alumina DBC Ceramic is often used in many different industries, including the automotive industry and aerospace industry.

Aluminum Nitride DBC Ceramic

Aluminum Nitride DBC Ceramic is a type of ceramic that is durable and lightweight. It has a high thermal conductivity, which makes it ideal for use in space-based applications.

Silicon Nitride DBC Ceramic

Silicon Nitride DBC Ceramic is used in a wide range of applications. It has excellent thermal shock resistance and high strength at high temperatures.

Silicon Carbide DBC Ceramic

Silicon carbide DBC ceramic is a hard and wear-resistant material that can be used for all kinds of industries. It has high abrasion resistance and excellent mechanical strength.

Introduction to DBC Ceramic

DBC Ceramic for printed circuit boards is designed to provide the best combination of high thermal and electrical isolation, compact size, high dielectric strength and superior thermal shock performance. It’s specifically formulated for PCB applications where thermal management is a key consideration.

DBC ceramic is a revolutionary new way to create printed circuit boards that doesn’t require soldering. Instead, the copper is attached directly to the board with epoxy or other adhesives. This means you can have a completely non-soldered PCB! No more worrying about your solder joints breaking down over time.

Introduction to DBC Ceramic
DBC vs DPC Difference and Variation

Advantage of Using DBC Ceramic Boards

DBC Ceramic is a great choice for printed circuit boards because they are made with the highest quality materials. They are manufactured in a way that helps to reduce the amount of waste during production and their durability makes them an excellent choice for industrial applications.

  • Higher Thermal Conductivity – DBC Ceramic boards allow for faster heat dissipation, and thus faster cooling of printed circuit boards.
  • Low Thermal Expansion Coefficient – DBC Ceramic ‘s low thermal expansion coefficient means that it won’t expand when exposed to heat, like some other materials do. This makes it ideal for use in high-temperature applications.
  • High Strength – DBC Ceramic ‘s high strength means that it can be used in applications that require large amounts of pressure or force.

DBC vs DPC: Difference and Variation

DBC ceramic printed circuit boards and DPC ceramic printed circuit boards are both made of ceramic, which makes them strong and durable. They also have a low thermal conductivity, meaning they don’t transfer heat as quickly as other materials. These properties make these boards ideal for use in environments where heat or moisture is an issue.

DBC is a kind of high-temperature epoxy resin film that can be used to make electronic products, but it has limited strength and cannot be used in harsh conditions.

DPC is a kind of high-temperature resin film that can be used to manufacture electronic products, but it has low adhesion strength and cannot withstand harsh conditions.

Advantage of Using DBC Ceramic Boards

PCBTok | Leading DBC Ceramic Supplier for Digital World

PCBTok Leading DBC Ceramic Supplier for Digital World (2)
PCBTok Leading DBC Ceramic Supplier for Digital World

We are dedicated to providing high quality products and services to our customers. We know that you have high expectations, and as a leading DBC ceramic supplier, we strive to exceed them.

As a customer focused company, we understand that it takes more than just superior DBC Ceramic products and services to earn your trust—it also takes dedication and commitment. This is why PCBTok was founded on the values of integrity, honesty, innovation and teamwork.

At PCBTok we are committed to being a reliable partner in your business by creating long-term relationships based on mutual respect and trust.

We understand that your time is valuable, so we’ll get straight to the point: if you need DBC Ceramic services, we will be there to help you find exactly what you need and get it delivered on time. Whether you are a large enterprise or small startup, PCBTok can provide the best solution for your needs at an affordable price.

DBC Ceramic Fabrication

Directly Bonded Ceramic and Copper

Ceramic and copper are the two most common materials used in PCBs, but they’re also the least compatible. The problem is that they have different coefficients of thermal expansion (CTE). When they’re bonded together, they can cause cracks to form in the board.

That’s where PCBTok comes in. PCBTok’s directly bonded ceramic and copper technology that shares the same coefficient of thermal expansion as the original material—so there’s no risk of cracking.

And because it’s a direct bonding process, there are no traces or pads on the surface of your board: It’s just one smooth layer of pure copper with embedded ceramic tracks that connect everything together.

Electrical Isolation and Thermal Management

The reason why electrical isolation is so important is because it prevents short circuits. In other words, if there is no electrical insulation between two parts of a circuit board, then they could short out when they touch each other and cause an electrical fire or explosion!

Thermal management should be addressed early in design phases because can impact other aspects of electrical performance such as signal integrity and power consumption levels across multiple devices operating simultaneously within an enclosure.

That’s why it’s so important to use a material like DBC Ceramic for your PCBs—it can provide both electrical insulation and thermal management.

OEM & ODM DBC Ceramic Applications

IGBT

DBC Ceramic for manufacturing IGBT exhibits excellent creep resistance and thermal shock resistance, superior electrical insulation and high temperature endurance.

Automotive

The DBC Ceramic for manufacturing Automotive printed circuit boards can be used for the production of various electronic devices, such as cars and other vehicles.

Aerospace Industry

Developed in partnership with aerospace academics and industry experts to create the ideal ceramic material for highly demanding applications, such as thermal service and thermal cycling.

Solar Cell Component

Printed circuit boards for solar cells are expensive to manufacture and require costly equipment. DBC ceramic reduces cost and improves efficiency in solar power production.

Laser Systems

DBC Ceramic is the material When it comes to manufacturing Laser Systems printed circuit boards. Our high-quality ceramic yields the best performance for your lasers, resulting in a long and successful life cycle.

Reliable and Top Quality DBC Ceramics from PCBTok
Reliable and Top Quality DBC Ceramics from PCBTok

PCBTok provides the most reliable and top quality DBC ceramics for PCBs. Our DBC ceramics are used in a wide range of applications, such as high frequency, high voltage and power density circuits. Contact us today!

DBC Ceramic Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “I really appreciate the friendly and professional service at PCBTok. I love that the company is a very reliable business. I have been using PCBTok for a number of years and they are by far the most professional and hardworking manufacturer I have ever worked with. They have always exceeded my expectations. I am very pleased with their work on our latest project. It’s great to deal with people who offer good customer service and still take pride in their craftsmanship. I plan to do more business with them in the future.”

    Jim Brickman, Computer Hardware Professional from Casper, Wyoming USA
  • “PCBTok is a great and reliable company! I am in the US and they were able to get my boards shipped quickly, and they were very accurate. The boards look great as well. You can tell they take pride in their work. They are willing to take the time to talk with you on any questions or concerns you have. They are also very affordable!”

    James Morrison, IT Company Director from Seminole, Oklahoma USA
  • “If you have never worked with PCBTok, I highly recommend you give them a shot. If you need a quick turnaround on your PCBs, these guys are your best bet. They will always deliver on time and the quality is first class. They have saved us from many headaches and gone above and beyond to provide us with the best service possible. We trust PCBTok completely and they are now one of our most valuable resources in this industry.”

    Eric, Procurement Category Manager from Limerick, Ireland
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