Professionally Created Digital PCB by PCBTok
Nearly every aspect of the world markets and our daily lives depend on digital technologies to function; thus, a Digital PCB is necessary to satisfy these demands.
PCBTok performs complete AOI and E-Test to your orders. Moreover, we can provide COC reports, micro-section, and soldering samples for your purchases.
Apart from that, all our boards possess IPC Class 2 or 3. Additionally, we provide weekly work-in-progress reports and offer a versatile payment method.
Get the most significant deals we have by availing of our recently enhanced Digital PCB instantly!
Dedicated to Bringing You Exceptional Digital PCB
PCBTok has been in the professional industry for over twelve years; we are highly capable of meeting your demands and desired purpose efficiently.
In producing your Digital PCB, it is crucial to have a manufacturer with extensive industry knowledge since it requires a thorough production process.
Hence, by choosing us, you can guarantee an excellent performing product. Moreover, we constantly offer the best deals without sacrificing the quality of the product.
We have dedicated, skilled and experienced engineers to work out your purchases.
All of these are for the benefit of our consumers; we want them to experience the finest service and products we have. Obtain your Digital PCB with us today!
Digital PCB By Feature
The Single-Sided PCB that we incorporate this particular board into is ideal for radio and stereo equipment, sensor devices, and digital microwave. Furthermore, they are simple to design, thus, having a low probability of error on them.
The Double-Sided PCB that we integrate this particular board into can be an exceptional choice for professionals that seeks flexibility and ease of use in their applications. Additionally, it has increased circuit density at an affordable rate.
The Multilayer PCB that we incorporate this particular board into has a simple way of employing impedance control features; thus, they can be ideal for aerospace applications. In addition, they are the perfect option to reduce cross-talking.
The Flexible PCB into which we integrate this particular board can be applied in laptops, digital cameras, and even smartphones; it can be specifically designed depending on desired applications. In addition, they are ideal for high-stress settings.
The Rigid-Flex PCB that we incorporate this particular board into is frequently utilized in radar equipment, GPS, and radio communication systems due to its extreme reliability with fewer wires. Moreover, it can be relatively inexpensive.
What is Digital PCB?
Similar to conventional PCBs, a Digital PCB denotes a piece of equipment used to handle and link electrical components using conductive channels, plates, and other features engraved on laminated copper and positioned amid non-conductive substrate layers.
Nevertheless, unlike other PCBs, such as the Analog PCB, a digital PCB has a digital design and is frequently produced and integrated using digital techniques; thus, it will have noticeable distinctions from PCB devices with an analog orientation.
Moreover, these PCBs have numerous microchips and other high-performance board modules that can handle a few billion activities per second.
Call us right away to order our reasonably priced, high-quality PCB items!

Capabilities of a Digital PCB
In order to produce high-speed Digital PCBs regularly, PCBTok keeps investing in technologically advanced equipment and manufacturing.
We provide the following support for high-performing digital boards:
- We provide improved and elite stack-up engineering.
- Our focused design guideline suggestions assist in achieving both financial and operational goals.
- As PCBs are used in high technology, we offer component procurement and pre-booking, which facilitates quick turnaround.
- We conduct strict supervision to prevent overlooking during production, thus, resulting in high-quality boards.
Immediately contact us for any queries you have; we’ll be delighted to assist you.
Benefits of Digital PCB
We have the following advantages of a Digital PCB:
- They aid in maintaining the power distribution’s noise levels under control.
- They assist in minimizing crosstalk among neighboring channels.
- They lessen the impacts of the base reference’s bounce.
- They facilitate impedance equalization.
- They safeguard the authenticity of the signal.
- They provide an extreme tolerance to EMI occurrences.
These are all the benefits you can enjoy on this particular board. Contact us immediately if you’re considering buying one for quicker assistance.

Select PCBTok's Top-Notch Quality Digital PCB


PCBTok is a professional PCB Manufacturer; we are recognized worldwide because of our top-tier quality Digital PCBs. We are highly capable of satisfying your demands.
In addition, we offer various types of this board from its dimensions, solder mask, surface finish, etc. We built this board to satisfy almost every application you have in mind.
We are your best alternative to enhance your business revenue; we offer a one-stop service for your boards from prototyping, fabrication, and assembly. We are in full possession of different certifications, including ISO9001 and ISO14001.
All of our PCB products have undergone meticulous inspections. Moreover, we offer affordable price deals without compromising the quality of the output.
Send us a message right away with your requirements, and we’ll take care of them.
Digital PCB Fabrication
There are many similarities between Digital and Analog PCBs, especially in design and technological aspects; in this article, we’ll concentrate on cabling strategies.
The first similarity that they have is the decoupling or bypass capacitance. Secondly, the pins must be as near the power supply for both setups and kept as short as possible.
Third, preceding capacitors are required for both digital devices and simulators, particularly for wiring purposes. It is connected near the power pin.
Fourth, the possibility of electromagnetic interference (EMI) is reduced by proper coordination, particularly on the surface wire and power cable.
Call us right away if you have any queries about this.
Before its assembly process, it is essential to comprehend that digital signifies an electronic signal kind that is produced instead of naturally occurring.
The first kind of manufacturing involves production that prioritizes cost-effectiveness and effectiveness, regardless of whether it is produced in high volume or low volume.
Then, the PCBA prototype is a repetitive method vital for a contemporary and sophisticated PCBA design and demonstrates critical development quality.
The assembling procedure includes meticulous processes, much like the fabrication of a board; choosing an experienced manufacturer is vital.
We are capable of flawless production; contact us today!
OEM & ODM Digital PCB Applications
Since this particular board can minimize the occurrences of crosstalk from nearby channels, they are highly preferred in 5G base stations.
Due to the capability of this board to minimize noise occurrences from power distribution, they are widely deployed in medical equipment.
One of the capabilities of this particular board is the impedance matching that is crucial for consumer electronics; they are deployed in such.
It is essential to have a high degree of immunity to electromagnetic interference in automotive radars; thus, they are utilized in this industry.
In the military industry, preserving signal integrity is highly important; therefore, they require a board capable of providing it, such as this board type.
Digital PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
In terms of Digital PCB Materials, there are countless options you can take depending on your purpose and desired specifications. Here are the materials you can choose:
- FR4 – It means “flame retardant,” and standard boards frequently employ it. It has two TG levels, the first of which is 135°C and the latter of which is suited for high-density usage and ranges from 150°C to 210°C.
- G-10 – It is a fiberglass laminate made under extreme pressure. During electrical and electronic needs, insulators like FR-4 and G-10 are utilized.
- PTFE – They are ideal for high-frequency, high-power, and microwave boards due to their High TG value that ranges from 160°C to 280°C.
- CEM-1, CEM-2, and CEM-3 – It has a TG value of 122°C, 125°C, and 125°C, respectively, which is ideal for high-density applications.
- Polyimide – It has a TG value of 250°C and higher for high power purposes.
In order to guarantee a flawless and working PCB, it should be precisely designed. Thus, we have the following rules that are essential to be followed:
- Default Values – To ensure they are not navigating with the wrong tracing widths or positioning the elements too near, the designer should double-check the parameters before commencing.
- Classes – To make configuring rules and restrictions easier, several design tools offer a method for establishing categories of nets and pieces.
- High-Speed Design – By designing distinctive trace topologies for particular net properties, differential couples can be set up at a range so that the traces are together at defined discrepancies.
- Board Spacing – The required electric output can be improved by choosing the proper distance between the circuit’s pieces and the PCB connections.
- Protection Against Electrostatic Discharge – To prevent problems brought on by electrostatic discharge, PCB designers must incorporate ESD protectors.