DPC Ceramic and Its Uses in Digital Era

Direct plated copper (DPC) in ceramic has a wide range of applications. It has been used in manufacturing of electrical components, such as capacitors, resistors, and inductors.

Direct plated copper ceramic is popular due to its ability to withstand high temperatures without losing its physical properties or breaking down.

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Tried and Tested DPC Ceramic Fabricator | PCBTok

Direct Plated Ceramic (DPC) from PCBTok is used in the digital era, and it has many advantages over traditional materials.

If you’re looking for a tried and tested DPC ceramic fabricator, look no further than PCBTok. We have been in the business of making printed circuit boards since our inception in 2012, and we have been providing high-quality services to our customers all along.

We have the experience, know-how, and expertise to make sure that your Direct Plated Ceramic are designed and fabricated perfectly, and we can do it at a price point that is affordable for any size business.

PCBTok is committed to providing our customers with quality products that meet their needs and standards. Our mission is to provide our customers with high quality products that meet their needs and standards.

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DPC Ceramic By Substrate Thickness

0.25mm

The DPC Ceramic comes with a substrate thickness of 0.25mm, which means that it can withstand high temperatures without cracking or deforming.

0.38mm

DPC Ceramic with 0.38mm substrate thickness is a ceramic with high thermal conductivity, high hardness and high strength fro better dependability of devices.

0.5mm

We’ve taken our 0.5mm DPC Ceramic and paired it with a 0.5mm substrate thickness for an ultra-durable and long-lasting printed circuit boards.

0.635.1.0mm

One of the most commonly used DPC Ceramic in electronic devices, such as mobile phones, computers and other consumer electronics products.

1.5mm

High-quality, high-performance DPC ceramic with a substrate thickness of 1.5mm. Made from a material that is resistant to moisture and corrosion.

2.0mm

The ceramic substrate is made of high quality, highly durable materials that can withstand any type of weather or environment you can throw at it.

Identification of DPC Ceramic

Direct Plated Copper (DPC) ceramic PCBs are the best option for high-speed, high-power applications.

DPC ceramics are made by plating a thin layer of copper on top of the ceramic, followed by a thick top layer of nickel, which forms the outermost layer of the final product. This process is completed in a single step, making these boards much more cost effective than other boards like FR-4 or Rogers sheet metal products.

These products have excellent thermal conductivity due to their low resistivity and high thermal conductivity values. They have much higher current density capability than other ceramic substrates due to their high power handling capabilities.

Identification of DPC Ceramic (1)
DPC Ceramic for High-Power Applications

DPC Ceramic for High-Power Applications

Direct Plated Copper (DPC) is a  developed technology that can be applied to high-power PCBs. The DPC process allows for the fabrication of high-power semiconductor devices with increased power density and higher reliability.

The Direct Plated copper ceramic PCB also has a high thermal conductivity and excellent electrical insulation performance. It is suitable for high-power applications such as inverters, power supplies, and electronic components.

In addition, the material is highly stable with good mechanical strength and corrosion resistance. The electrical properties of direct plated copper ceramic are superior to those of other types of dielectrics such as glass epoxy or other ceramics.

How to choose between DBC and DPC?

Choosing between a Direct Plated Copper PCB and a Direct Bond Copper PCB can be difficult, but the decision really comes down to what you want your final product to look like.

A DBC board is made by coating copper onto an epoxy-based board before applying a thin layer of solder. This makes it ideal for prototyping and small-batch production runs because it costs less than other methods, and it’s also easy to work with.

A DPC board is made by applying solder directly onto an epoxy-based board before applying another layer of solder over top of that. This method creates a more durable product with more consistent results than other methods, which makes it great for large-scale production runs or projects where reliability matters.

How to choose between DBC and DPC?

PCBTok | Your One-Stop Shop for DPC Ceramics

PCBTok Your One-Stop Shop for DPC Ceramics
PCBTok Your One-Stop Shop for DPC Ceramics (1)

PCBTok have been in business for over 12 years and are well-known for our quality work and fast turnaround times. We pride ourselves on being able to meet the needs of our customers, whether they are looking for large-scale production or just a few pieces to try out a new design.

PCBTok is a leading fabricator of DPC ceramic. We provide our customers with the highest quality materials and services, ensuring that they are always satisfied with their purchases. Whether you’re looking for a new supplier or are interested in learning more about how we can help you, please don’t hesitate to reach out to us today!

DPC Ceramic Fabrication

Superior CTE and High Thermal Conductivity

The thermal conductivity of a material is the ability of that material to conduct heat. The higher the thermal conductivity, the better it will be at transferring heat away from a device or system.

DPC ceramic printed circuit boards (PCBs) have superior thermal conductivity compared to other PCBs, which means they can dissipate heat better.

This means that devices using DPC PCBs can run cooler and with less risk of malfunction or damage due to overheating.

The combination of high thermal conductivity and low CTE means that DPC PCBs are an excellent option for devices that need to operate under extreme conditions such as high temperatures or in space where there is little air pressure.

Low Cost and High Performance DPC

DPC ceramic printed circuit boards (PCBs) are an excellent choice for a wide range of applications, because they are both low cost and high performance.

DPC ceramic printed circuit boards are made from ceramic material, which is highly resistant to heat and flame. They also offer the best electrical insulation properties in the industry. As a result, they can be used in applications where other PCBs would be damaged or destroyed by heat or fire.

DPC ceramic printed circuit boards are also very durable and long-lasting, so you don’t have to worry about replacing them too often. This makes them an excellent choice for many different types of electronic devices that require regular use over long periods of time.

OEM & ODM DPC Ceramic Applications

HBLED

DPC ceramic printed circuit boards are used in high-brightness LED lighting applications. They are a great alternative to glass fiber-reinforced epoxy boards and aluminum boards.

Microwave Devices

DPC ceramic printed circuit boards are a great choice for microwave devices. They have excellent thermal, electrical, and mechanical properties that make them perfect for this type of application.

Automobile

Ceramic printed circuits boards are used in automobiles for various purposes such as controlling engine functions, monitoring performance, air conditioning and regulating fuel consumption.

Solar Cell Component

DPC ceramic printed circuit boards for Solar Cell Component are the most popular and widely used in the world. They are mainly used in solar cells, space satellites, power generators, and other fields.

Packages for RF

We can provide custom-made – DPC ceramic printed circuit boards for RF packages such as those used in cell phones, GPS devices, satellite radios, and more.

Lowest Cost and Highest Throughput DPC Ceramic
Lowest Cost and Highest Throughput DPC Ceramic

PCBTok offers a wide range of DPC ceramic. It has been designed to optimize throughput and reduce costs, without sacrificing quality or safety.

DPC Ceramic Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “Quality products and service! PCBTok has the best price for the quality. I have been ordering from PCBTok for a few years now. They always have had the best price on my boards and the delivery is fast and reliable. I am looking forward to doing business with them in the future. It was an error-free product and having a good quality control department is needed. They have it.”

    Patrick Griffiths, Electrical Technologist from Alaska
  • “I had been looking for a reliable PCB manufacturer for a while, but I couldn’t find any high-quality manufacturers that would provide me with the services I needed. Luckily, I found PCBTok; they’ve supplied me with the best quality PCBs and laminates I could ask for. I’ll definitely do business with them again in the future.”

    Armi Millare, Supply Chain Director from Singapore
  • “I am a new customer of PCBTok and I just want to share my experience with you. Since I frequently needed PCBs and other laminates, I decided to use them as my top manufacturer. The printed circuit boards I bought are of great quality and can function so well even in high-power settings that I am using nearly all of them. It was also a relief to have someone checks on the supplied goods even after my transactions with them were complete because they kept checking it.”

    Unique West, Procurement Category Manager from France
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