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Ensure a Strong Connection with Edge Plating PCB from PCBTok
PCBTok is your go-to edge plating PCB manufacturer. With over 12 years of experience, we’ve mastered the art of creating high-quality PCBs with edge plating. We understand the importance of delivering on time and meeting your needs, so you can focus on what matters most.
- The expert team is accessible at all times; engineers, technicians, and sales.
- Our supply of high-quality parts is sufficient to meet your needs.
- 24h quick-turn service for your prototype PCB
- Updates on your product’s progress are sent on a weekly basis.
Metallized Sides with Edge Plating PCBs of PCBTok
PCBTok is one of the leading PCB manufacturers in China. We offer both standard and customized PCBs for a wide range of electronic products. Our products are made of high-quality materials, which ensure the stability and durability of your PCBs.
We have been producing PCBs for more than 20 years, so we have a wealth of experience in manufacturing Edge plating products with different requirements. This means that we can help you find the best solution for your needs.
We specialize in standard and customized edge plating, as well as providing our customers with excellent quality products at competitive prices.
We can provide them with small quantity or mass production orders of Edge Plating PCB with fast delivery time. If you have any inquiries about our products or services, please feel free to contact us at any time!
Edge Plating PCB By Type
Single-sided PCB with edge plating is a type of board is perfect for many applications, including industrial and commercial purposes. The single side allows for easy soldering and a stronger, more durable design.
The double-sided PCB with edge plating is made up of two layers, which are referred to as the top layer and the bottom layer. Connected vias, which allow electrical signals to pass from one side of the circuit board to another.
Multilayer PCB with Edge Plating uses edge plating to connect the inner layers to the outer layers of the board. A conductive material, such as copper or gold, that is applied to the edge of the PCB.
High voltage PCB edge plating is used to prevent short circuits and other electrical damage on the surface of the printed circuit board. The edge of the high-voltage printed circuit board is coated with tin, gold or nickel.
A kind of Rigid PCB with edge plating on all sides. Rigid PCB with edge plating board is ideal for use in areas where high-speed signal transmission is required or where the board will be exposed to harsh environments.
High power PCB with edge plating is a kind of industrial high power PCB, which can be used for the power transmission and distribution of the high voltage equipment. It is made by the high precision technology.
Edge Plating PCB By Color (5)
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Our Green PCB with Edge Plating is a great option for you. The PCB has an edge plated coating that protects it from moisture and corrosion, ensuring that it stays looking its best.
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Black PCBs with Edge Plating are made using only high-quality materials, coated with a thick layer of protective material that keeps them looking sleek and shiny for years to come.
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The blue PCB with edge plating is a board that has been coated with a layer of blue pigment. With an electrically conductive material. Used in various electronic devices.
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Our yellow PCBs are manufactured at our state-of-the-art facility in China. Available in both surface mount and through-hole, and can be made with a variety of edge plating options.
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Red PCB is a PCB with a red base and edge plating. The Red PCB is primarily used in the manufacturing of electronics and can be used in a variety of circuits.
Edge Plating PCB by Surface Finish (5)
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ENIG PCB with Edge Plating is a type of printed circuit board that is coated with a special layer of gold. This coating increases the durability and corrosion resistance of the printed circuit board.
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The OSP PCB with Edge Plating is made from high quality material and it is very durable and reliable. It is also easy to use and very affordable. Can be used in many different industries.
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Immersion tin PCBs with edge plating used to create electrical connections between conductors and components. Involves applying a layer of pure tin, creating a soldered joint on conductor and component.
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With our immersion silver PCB with edge plating, you can be sure that your product will be protected against corrosion, oxidation and other harmful elements which has its own properties and applications.
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The ENEPIG PCB with Edge Plating is a high-quality PCB that has been adapted to the needs of industrial customers. It is especially suitable for use in non-automotive applications and has a high reliability.
Thermal Distribution of Edge Plating PCB | PCBTok
Thermal distribution is the flow of heat through a material. This can be analyzed in terms of the number of “thermal paths” present, or it can be analyzed in terms of thermal conductivity and thermal resistance. When analyzing thermal conductivity and thermal resistance, it’s important to remember that they are both properties of solid materials
Edge plating is a way to provide thermal management for your circuit board. It is applied to the edge of the PCB, which is where most heat dissipation occurs. This makes it important to use edge plating when you are designing PCBs that need to be temperature-controlled, such as in automotive or medical devices.
The thermal distribution of edge plating PCB depends on the thermal conductivity of the edge plating material, as well as its thickness.
Top Grade Fabrication of Edge Plating PCB
The Edge Plating PCB is a technique used to provide corrosion protection for copper interconnects. The edge-plated layer of the PCB is applied to the edges of the circuit board, so that it covers only the exposed copper pads and not the pads that are connected to components.
This is a process that can be used on both hard-to-reach areas and those that are easier to access. It includes applying an electroless nickel coating over the exposed copper pads, followed by an electroplated gold finish. This process creates a protective oxide layer on top of each pad, which helps prevent corrosion from occurring over time.
Signal Integrity of Edge Plating PCB
Signal integrity is the ability of a signal to reach its destination without distortion or degradation. It’s important for PCB designs to have good signal integrity. The edge plating on a PCB can help improve the signal integrity of your design.
Edge-plated PCBs are made with a layer of copper that surrounds all of the layers in the board, which helps to shield the signals carried by each layer from each other. This means that when you’re designing a board with edge plating, you can use more layers without worrying about interference between them. This is especially important when using high-speed signaling protocols like Gigabit Ethernet or HDMI, where there is less margin for error in signal quality than with slower protocols.
Importance of Edge Plating PCB For Digital Era | PCBTok
In the modern era, we need to be aware that PCB is an important part of electronic and computer circuits. The importance of edge plating PCB for digital era is far greater than its own importance. It can be said that the edge plating PCB is one of the most important parts in all computer systems.
Edge Plating PCB is one of the most important parts of a circuit board. It makes sure that all of the components are connected together correctly and that none of them are shorted out. It also provides protection for any sensitive components on the circuit board.
Edge plating PCB also provides corrosion resistance for many products that are put outside or near water sources. This helps prevent corrosion from occurring on the circuit board and causing failures within the system.
Edge Plating PCB Fabrication
PCBTok offers a wide range of edge plating options. The soldermask color can be customized to create your own unique look.
You can choose from our standard colors or choose to customize your own color. We offer a variety of colors for you to choose from.
We have a large selection of standard colors that we can use to create your board’s soldermask color. You can choose from any of the following colors: black, red, blue, yellow, green, orange, purple, pink, white and brown.
If you would like to create your own unique color or want something different than what we offer on our website, give us call!
In addition to customizing your PCB’s edge finish, you can also choose between various finishes for your plating:
- Gold Plating: This classic look is used in many applications because it is both visually appealing and durable. It can be used on any type of metal or plastic surface where its durability is necessary.
- Nickel Plating: This finish has a bright luster that gives product manufacturing companies an option for creating a more modern appearance than gold plating offers.
- Silver Plating: Silver plating is another option for creating an attractive finish on an electronic product’s surface without sacrificing any durability or conductivity needed for its purpose.
OEM & ODM Edge Plating PCB Applications
The edge-plating PCB has excellent electrochemical and thermal conductivity, corrosion resistance and chemical stability properties. It can be used in medical electronic equipment such as the high-end computer monitor, medical laboratory medical equipment and so on.
Edge Plating PCB for Automotive provides a much higher electrical and thermal conductivity. Their broad temperature range makes them suitable for virtually all applications, including use around high heat sources or in extreme conditions.
This affordable edge plating PCB offers superior heat dissipation and abrasion resistance for industrial control applications. Board thickness can be thin, yet still offer excellent product reliability up to 94% effective yield.
Edge Plating PCB for Military Industry is designed to meet the needs of military customers, who often require high-speed and high-density signal circuits on a single board. Suitable for usage in a wide variety of military applications.
The PCB Edge Plating products are widely used in the consumer electronics, industry and communications. Our edge plating PCB products can meet your different requirements such as 1 mil to 15 mil thickness, high quality and easy use.
Edge Plating PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
