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Making the Best ENEPIG PCB That Lasts
PCB items and PCB Assembly, that is what PCBTok is known for.
- Increase your revenue from high-density applications (HDI)
- Highly appropriate for communication devices
- We will produce OEM PCBs that are ENEPIG PCBs for your products
With all of these efforts from us, you only have to put in minimum effort.
We’ll do the rest.
Understanding Your ENEPIG PCB Needs
We have refined the production of ENEPIG PCBs as well as other gold-finished PCBs.
Every PCB that leaves our Shenzhen plant is defect-free.
We also take into account your requirements as an Electronics Manufacturing Supplier.
If you require a large order, we will accommodate you.
But, no matter how big or small your order is, we can fill it. As stated in this page, we have the entire product line for ENEPIG PCB.
We have customers all around the world, in addition to being the go-to supplier for major corporations in the United States.
This is why our sales crew is trained to speak with you clearly.
ENEPIG PCB By Material Type
The Multilayer PCB is a general term to describe highly functional PCBs for use in different digital devices.
With the HDI PCB, you have the chance to integrate your HDI designs with allthe designs you wish to implement.
A Rigid-flex PCB will be able to cope with specialized designs. The best advantage is possibly the longevity of the parts.
When it comes to providing the widest type of PCB needs, our company has the answer. Even 3-Layer PCB, round/ mini ones, we make them.
Advanced in nature, the Rogers PCB is preferred. There are variations for all types of devices, including military-grade ones.
If you need a Quick-turn PCB, High Tg PCB can be created quickly and with no loss of performance. It will be equally as good.
ENEPIG PCB By Feature (6)
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The Ceramic PCB is the result of using ENEPIG on ceramic laminate materials. When you use ENEPIG on ceramics, thermal conductivity is enhanced.
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The ENEPIG coating makes the IC Package ENEPIG PCB efficient. Due to less gold element on it compared to ENIG, this PCB is more reliable.
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ENEPIG PCBs are said to perform admirably with System-in-Package (SiP) components. This is due to the increased heat efficiency provided, which is vital to the board.
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ENEPIG is also recognized for its ability to attach to aluminum surfaces. This is the product known as Aluminum Wire Bonding ENEPIG PCB.
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Because ENEPIG is well-known for its capacity to create PCBs that are wire bondable, the name it is given is Gold Wire Bonding ENEPIG PCB.
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Lead-free ENEPIG PCB is usually regarded as acceptable among all surface treatments. This is because of environmental rules that are now necessary. If you sell in the EU, it is appropriate to use ENIG too.
ENEPIG PCB By Layer & Thickness (6)
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If 2 Layer PCB is considered, it is an improvement from the Double-layer HASL PCB boards. This is due to to ENEPIG’s resistivity.
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If you need a board that can carry medium currents, consider the 4 Layer ENEPIG PCB, which has very sound mechanical strength.
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The PCB known as 6 Layer ENEPIG PCB is excellent for wireless applications due to its compatibility with wireless goods.
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The 8 Layer PCB is suitable for ultra-precision instruments. We are certain that this type of temperature-resistant board is suitable for military machinery.
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The 20 Layer PCB has a high layer count. So, several varieties of it are used in advanced places such as airplanes and spaceships.
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We promise that different versions of 30 Layer PCB are environmentally sound because this product has a reputation for product safety and speed.
Credibility With Our PCB Processes
Your reliable ENEPIG PCB manufacturer has arrived.
With the dependable technology that we use for making the ENEPIG PCB, we provide a broad range of options
Via-in-pad, Blind and Buried Via PCBs, as well as Microvia—all are possible options.
When you need a reliable PCB provider, PCBTok can be counted on.
We will not leave you questions about ENEPIG PCB unanswered.
When you are unsure, we will show you how we can help.
Extensive Experience in ENEPIG PCB Manufacture
The applications of ENEPIG PCB range from digital technology to aeronautics to medical equipment.
It is a product you turn to again and again, that is why you need an energetic PCB supplier by your side.
At PCBTok, we have over 12 years of experience in the PCB industry.
Just let us know what kind of ENEPIG PCB you need.
We will fulfill any and all design requests. We make ENIG PCB, ENEG PCB too.
Complete Turn-key ENEPIG PCB Solution
You are our top focus, whether you are a PCB hobbyist, a semiconductor firm, employee, or an appliance provider.
ENEPIG PCB is becoming increasingly popular as digital business grows.
Purchasing this type of PCB from us as a complete turn-key solution provider is a comprehensive answer.
We will speed up your company’s inventory handling, as a boost.
By acquiring ENEPIG PCB, you may reduce business delays.
Call PCBTok right now to place your order!
Benefitting Your Company With Our ENEPIG PCB
The PCBTok is a well-known supplier of ENEPIG PCB supplies.
- Experience in the PCB business of 12 years and more
- For precision, computer-aided design (CAD) is used all the time
- To finalize the PCB design, upgraded PCB software will always be used.
- Your purchase will be delivered on time too.
ENEPIG PCB is a safe bet with us! So, inquire now!
ENEPIG PCB Fabrication
In our large plant, we manufacture a wide range of ENEPIG PCBs. They have the following advantages:
- Reduce hazards in hazardous substances (it is lead-free)
- With Organic Resin for insulation material too
- Specially calibrated boards for High-frequency products available.
- Can have different sizes to meet different purposes
You can be sure to find what you need. Just make an inquiry now!
Professional ENEPIG PCB manufactured by a professional PCB manufacturer will assist you in keeping up with the faster pace of business.
You would not trust a poor service, avoid them at all costs!
This is why you require our assistance—we are a genuinely hardworking company.
We include prototyping using ENEPIG PCBs (24/7). You can count on us, PCBTok China’s PCB leader.
OEM & ODM ENEPIG PCB Applications
Because of the widespread use of AOI, we always include the procedure when checking ENEPIG PCB for Communication & Internet Application PCB.
ENEPIG PCB is a popular item for commercial enterprise use. There, we use good Silkscreen PCBs to ensure that the goods strictly adhere to industry standards.
ENEPIG PCB for Renewable Energy & Power Generation is an excellent choice. In comparison to standard surface treatments, ENEPIG is naturally lead-free.
ENEPIG PCB is appropriate for multimodal lighting applications such as color-changing bulbs, various certification ratings for LED products, and dimming bulbs.
ENEPIG PCB for High Power settings has cutting-edge eco-friendly features. So you utilize power without harming nature.
ENEPIG PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy | |||||||
| Silkscreen color | White, Black, Blue, Yellow | |||||||
| Max hole size for via filled with Blue glue aluminum | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead-free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
ENEPIG PCB: The Ultimate FAQ Guide
If you have been working with ENEPIG PCB materials for some time, you may be curious about how the process works. Fortunately, there are many FAQs available, including the most frequently asked questions. Learn more about ENEPIG and how it works by reading this guide. It will help you make a more informed decision when choosing this material for your next PCB project.
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) is a PCB chemical metal plating process that overcomes the limitations of traditional PCB finishing methods. The finish is applied in two stages. First, the nickel layer acts as a copper barrier, making it a suitable solder surface. Secondly, the gold layer protects the nickel layer during storage. As a result, you can be sure that your finished PCB will be corrosion-resistant, oxidation resistant, and functional for many years to come.
ENEPIG PCBs: ENEPIG is the most expensive and highest quality type of copper-plated circuit board. It has very high oxidation resistance and low contact resistance. It also retains the solderability of palladium. In addition, it has a low coefficient of friction. This is an excellent way to protect PCBs from corrosion while maintaining their integrity.
ENEPIG’s final plating has excellent solder joint strength and is compatible with a wide range of alloys. In addition, ENEPIG supports the use of conductive adhesives to join components without the use of solder. It also has excellent bonding properties and is compatible with gold wire. For example, unlike other metals, palladium does not lose its luster, so you don’t have to worry about oxidation.
ENEPIG PCB is a PCB metal plating finish. This surface finish is thinner than soft bonded alloys. It is more commonly used in semiconductor applications than printed circuit boards. There are several advantages to using ENEPIG for PCB fabrication. Some of them will be discussed in this article. Let’s start with the advantages of ENEPIG boards.
The lead bonding and solderability of ENEPIG boards are very good. Its flexibility and freedom of circuit design make it ideal for high-density applications. This adaptable use of various packaging processes can help designers and engineers reduce the size of circuits and electronic components. In addition, the ENEPIG process can be applied to high-density circuits. The benefits of ENEPIG PCBs are listed below.
Multilayer Enepig PCB Sample
They are compatible with waterproof technology. This coating is very water and dust-resistant. The PCBs can also support chemical and immersion gold plating processes. In addition, ENEPIG PCBs are made of high-quality materials that meet the most stringent specifications. ENEPIG PCBs are available in a variety of finishes. Choosing one is a personal preference, but both have advantages.
They consist of a palladium layer sandwiched between gold and nickel plating. The base layer of the electroless nickel plating is approximately 118 micro inches thick. The immersion gold layer is approximately 2 micro inches thick. Due to the chemical stability of gold and palladium, ENEPIG PCBs have excellent corrosion and oxidation resistance. These properties make ENEPIG an excellent choice for high-density applications.
The structure of ENIG is the first thing to understand. On the surface of ENIG, four different layers of metal structures are deposited. Copper acts as a catalyst, while nickel protects it from negative interactions. This nickel layer is then applied to the copper surface as a barrier. Chemical plating of nickel and gold was then performed. An electrochemical reaction with sodium hypophosphite is used to produce the nickel film.
The final finishes of ENIG and ENEPG are also different. ENEPIG is more durable and ideal for applications requiring very fine pitch. However, it is less common on printed circuit boards. ENEPIG is a more suitable semiconductor material for ultra-fine pitches. It is cheaper and has better solderability. In the past, many people were confused about the difference between ENEPIG and ENIG.
Surface finish is another difference between ENIG and ENEG. ENEPIG is stronger and has a longer shelf life. It offers superior corrosion resistance, reduces the need for soldering, and extends the shelf life of the PCB. However, ENEPIG is more expensive because of the higher cost of the metals used in its coating, especially gold and palladium. In recent years, its value has fallen below that of gold.
The only difference between ENIG and ENEG plated boards is the amount of nickel or gold plated on the copper. ENIG has a more uniform gold or nickel layer, but a softer surface. Nickel oxidation reduces the wettability of the solder. As a result, the solder must be subjected to higher stresses than corroded nickel surfaces.
Comparison of Final Finish Performance：
| Characteristics | OSP | ENIG | ENEPIG | Immersion Silver | Immersion Tin |
| Shelf Life (controlled conditions) | < 12 Months | > 12 Months | > 12 Months | < 12 Months | 3 – 6 Months |
| Handling / Contact with Soldering Surfaces | Must be avoided | Should be avoided | Should be avoided | Must be avoided | Must be avoided |
| SMT Land Surface Planarity | Flat | Flat | Flat | Flat | Flat |
| Multiple Soldering Cycles | Fair to good | Good | Good | Fair to good | Fair to good |
| No Clean Flux Usage | PTH/via fill concerns | No concerns | No concerns | No concerns | No concerns |
| Solder Joint Reliability | Good | Good process control is required to avoid “black pad” | Good | Interfacial microvoid concerns | Good |
| Gold Wire bonding | No | No | Yes | No | No |
| Electrical Test Probing | Poor, unless solder applied during assembly | Good | Good | Good | Good |
| Corrosion Risk after Assembly | Yes | No | No | No | Yes |
| Contact Surface Applications | No | Yes | Yes | No | No |
The ENEPIG (Electroless Nickel / Electroless Palladium / Insulated Gold) surface finish system offers excellent solderability, especially with Sn-Ag-Cu-based solders. It is a popular surface finish material and is the surface finish of choice for highly reliable lead bonding. ENEPIG deposits were made using commercially available chemicals. In addition, the material was evaluated for its high-reliability soldering and bonding properties. The resulting metal alloys can be soldered into very thin layers and are compatible with gold and aluminum wire bonding.
Enepig Surface Finish Machine
ENEPIG is a multilayer surface treatment that protects the nickel underneath by preventing corrosion. When soldering, this metal dissolves into the solder joint, but too much ENEPIG metal can cause the joint to weaken, which can affect the reliability of the solder joint. ENEPIG is suitable for high-density SMT designs.
ENEPIG is a thin film that combines sputtering, etching, and plating processes into a single coating. This process is ideal for high-volume applications and is particularly cost-effective when compared to lead-free and ROHS-compliant gold. This premium material has a long shelf life, is easy to solder, and is extremely reliable. Can I solder to Enepig?
ENEPIG final coatings have high solder joint strength and are compatible with a wide range of alloys. ENEPIG can also withstand multiple reflow cycles. While ENEPIG is less expensive than ENIG, it is not as durable as gold wire bonding. Whether you are looking for a finished board or a prototype, PCB International can provide instant pricing.
The electronics industry can benefit greatly from the ENEPIG surface coating. It makes PCBs suitable for a variety of commercial applications and protects boards from serious damage. ENEPIG PCBs are capable of handling both RF and digital signals. Unlike other circuit solutions, ENEPIG PCBs are known for their excellent gold wire pull. In addition, they are more reliable when connecting PCB components.
ENEPIG, also known as chemical nickel plating or submerged gold, is a high-quality electronic plating technology. Palladium is a silvery-white metal that was discovered by William Hyde Wollaston in 1803 for this process. The high surface hardness of ENEPIG’s palladium allows for gold wire bonding and excellent solderability. As a result, it has earned the nickname “Universal Surface Finish”. Many electronics manufacturers already use ENEPIG extensively.
Compared to other precious metals, ENEPIG has a long shelf life, lead bonding capability, and performance reliability. The disadvantage is that it costs more than lead-free solder. However, compared to gold, this metal is no longer the most expensive. As a result, the advantages outweigh the disadvantages. Nevertheless, ENEPIG is still the best choice for a variety of applications, including high-tech devices and consumer electronics.
Double-sided Enepig PCB
ENEPIG PCB surface treatment is suitable for multi-layer PCB designs. It consists of useful materials, such as gold, palladium, and palladium. These materials have consistent dielectric properties that help improve thermal management in multilayer manufacturing. In addition, the ENEPIG PCB surface treatment facilitates PCB placement and promotes efficient high-frequency multilayer stacking. The benefits of this surface treatment include reduced manufacturing costs and costs.