PCBTok’s Supremely Engineered ENIG PCB

ENIG (Electroless Nickel Immersion Gold) is a metal coating used in the production of printed circuit boards. It is typically applied to copper contacts and plated through holes to prevent oxidation and improve solderability. Although there are several variations of this surface treatment, ENIG is the most popular and widely used. The main difference between ENIG and submerged gold is their surface finish.

On printed circuit boards, chemical nickel immersion gold is the most common surface treatment. This is due to its trend toward low-cost and high-density packaging. However, reliability issues have plagued electroless nickel immersion gold (ENIG). This is partly due to the poor wetting properties of the tin solder. Modern facilities are used to determine the root cause of this problem. While ENIG is a reliable surface finish, it has some drawbacks.

Although they have similar surface finishes, Immersion gold has several advantages. Its excellent chemical and physical properties make it ideal for electrical contact, lead bonding, and soldering. ENEPIG offers excellent solderability and corrosion resistance but is more expensive than ENSI. As a result, it is a better choice for a variety of applications. The key to success is choosing the right gold chemistry.

Is submerged gold the same as ENIG in IC manufacturing? It depends. ENEPIG is the next generation of ENIG and is an upgrade to the ENIG process. ENEPIG consists of a thin palladium layer that prevents immersion gold from corroding the nickel layer. Other benefits of this new generation of immersion gold include highly reliable lead bonding, excellent multiple reflow soldering, switching contact surfaces, and selective gold plating.

ENEPIG Surface Finish

Both ENIG and HASL are electrically insulating coatings. On the other hand, ENIG is more durable and corrosion-resistant. The difference between these finishes is in the way they are applied. HASL is more suitable for complex assembly tasks, while ENIG is more suitable for simpler assembly tasks. EnIG requires less environmental information, such as temperature, humidity, and condensing atmosphere, but it may not be the best choice for all applications.

ENIG is a superior surface treatment for printed circuit boards. It resists corrosion and inhibits dendrite growth and flux reactivation. It is also more expensive than HASL. On the other hand, ENIG is more expensive than HASL. ENIG is preferred by some engineers over HASL because of its higher quality and reliability. ENIG is best suited for corrosive environments, while HASL offers an excellent surface finish for high-quality PCBs.

HASL and ENIG are both chemical plating processes. ENIG is a better alternative to HASL, which is a cheaper and more convenient option. The ENIG process uses two layers of metal coatings. The first layer is chemically plated and the second layer is immersed in gold to prevent nickel oxidation. The nickel protects the base copper by acting as a barrier to the copper. In addition, ENIG has good flatness, making it an excellent choice for fine-pitch devices.

ENIG Surface Finish

There is a difference between ENIG and HASL, but the terms are often used interchangeably. The difference lies in the Electroless Nickel Immersion Gold (ENIG) process and the results. HASL, on the other hand, is more trustworthy. It can be used for both plating and soldering. In many applications, the difference between these two plating types is significant. If you are not sure which one to choose, it is best to seek professional advice.

Before we begin, it is important to define ENIG or Electro-Neural Interface Gold. ENIG is a gold coating applied to the pads of electronic components. Most users will not notice the gold coating on the pads, but it keeps the board solderable and improves its appearance. ENIG should always be stored in rust-proof packaging. You can even purchase a unique ENIG kit for your Arduino.

The reaction between gold and nickel drives the process. High gold thickness and aggressive gold baths exacerbate corrosion, leading to the formation of black pads. This structure is similar to brittle fracture, which creates a cracked structure in the nickel. Shock, vibration, and thermal stress can also weaken the metallurgical bond and lead to black pads. Therefore, ENIG is a critical process in semiconductor manufacturing.

ENIG Structure

ENIG finishes on PCBs are often stored in batches before loading the widgets. After loading the components, they are either soldered or lead bonded to the surface mount pads. Compound cleaning is the process of surface activation and chemical cleaning. This is the process of fine-tuning the surface chemistry style. Because plasma can be inserted into narrow spots, this method is often used to process small spaces.

First of all, ENIG is an expensive process. It requires concentrated work progress and relies on the synthetic miracle known as the dark pad. This type of plating creates an ideal surface for gold wire fixation, but it has three drawbacks. It also reduces the high optical density. Therefore, it is critical to understand the advantages and disadvantages of ENIG before deciding to use it. For example, ENIG plating can improve the appearance of metal surfaces.

Immersion gold has many advantages over chemical nickel plating. It has a lead-free surface finish. Since high levels of lead are harmful to humans and can cause kidney and brain damage, using a high-quality lead-free gold plating method is a good choice. In addition to being aesthetically pleasing, submerged gold contains no toxic chemicals. Here are the three most important benefits. They are lead-free electrodes and (ii) electrodes.

Immersion gold has excellent chemical properties, making it an excellent choice for electronic components. The material is also highly testable and has a long shelf life. The nickel layer also acts as a barrier to prevent the oxidation of the gold. The intermetallic compound also has excellent solderability, and the gold layer protects the copper layer from oxidation. It has excellent oxidation resistance and is easy to use.

Immersion Gold PCB

One of the most significant advantages of immersed gold is its durability. It is a more permanent layer of gold than electrolytic gold plating. It increases the shelf life of the parts waiting to be soldered. Some products using this process are used in electronics, such as PCB manufacturing and aluminum wire bonding. However, it is not suitable for electrolytic gold plating due to its low adhesion.

EnIG and submerged gold PCBs have excellent electrical properties. Electroless nickel plating and submerged gold are the two most common surface treatments used in the PCB industry, and ENIG plating is the best of the bunch. The best thing about ENIG PCBs is that they can be seamlessly integrated into almost any electronic product. Victory Professional PCB manufacturers can meet even the most difficult specifications. With our services, you get a high-quality surface finish and a cost-effective PCB.