PCBTok’s Supremely Engineered ENIG PCB
PCBTok’s ENIG PCB is the highly recognized surface finish in the PCB industry, and we are also renowned for producing superior products of it internationally.
- We provide several various payment alternatives.
- Updates on the product progress are sent every week.
- We are ensuring full support for your PCBs.
- Our supply of parts is sufficient to meet your requests.
- Constant access to knowledgeable, expert assistance.
Superior Quality ENIG PCB Products by PCBTok
PCBTok continuously aims to supply you with flawless ENIG PCB that will function for a long time without facing any issues.
We constantly seek your satisfaction with the ENIG PCB products and the services you deserve. We are always motivated by your fulfillment.
These are all made possible by our more than a decade of experience and highly-trained experts in our facility to perfect your products.
PCBTok will persistently thrive to provide you with the best.
We genuinely care for our clients; thus, we are always striving to improve our skills to continually serve you the highest quality ENIG PCB possible.
ENIG PCB By Feature
The Multilayer PCB is highly preferred in applications such as mobile phones due to its compact size that can integrate a number of components into a device. In addition, due to its capability to produce high-speed performance in devices.
The HDI PCB are preferred by consumers seeking to decrease their overall power usage since the HDI material can fulfill this. These are also popular in various applications because they can offer long battery life in devices.
The Rigid PCB is one of the most famous types of PCB because of its inexpensive cost, and they are widely used by most electronic devices nowadays. Therefore, they have higher demand and supply in the PCB industry.
The High TG PCB is recognized for its extraordinary stability due to its resistance to chemicals, moisture, and heat. Through this, it can achieve a longer life span and prevent short circuit occurrences and failures in the PCB.
The Heavy Copper PCB is well-known for its exceptional dissipation factor; it can prevent overheating overall components. They are popular in military applications such as power supply, and radar systems.
The Flexible PCB is popular because of its affordable costs and versatility. They are perfectly suitable for applications that have a limited amount of space. It is also known that this type can be easily installed and maintained.
ENIG PCB By Layer (5)
ENIG PCB By Gold Thickness (6)
Pros of Casting PCBTok’s ENIG PCB
The ENIG PCB has a number of benefits to provide. Here are some of them:
- Resistance to Oxidation – The occurrence of oxidation was minimized due to the immersion gold layer.
- Lead – No trace is deployed in the production process of an ENIG PCB.
- Thermal Management – It can resist enough amount of heat due to the electroless nickel component.
A few of the benefits that an ENIG PCB of PCBTok can provide are those that were just discussed. There are more advantages it can offer to your applications. Please submit an inquiry to us for further information on these.

Materials Deployed in ENIG PCB
An ENIG PCB only deployed a few materials, all of which are unquestionably created with the utmost precision and superior characteristics.
The ENIG PCB is composed of Nickel and Gold materials on it. The Nickel layer is commonly found in the copper surface of the board. In addition, we made sure that this layer is resistant to corrosion through the help auto-catalytic liquid bath.
The ENIG PCB is made to be extremely durable and has a longer total shelf life because it not only prevents corrosion to the board but also helps with the oxidation of the electrical components.
For an in-depth explanation about this; you can direct message us.
Appropriate Handling of ENIG PCB
It is regarded that an ENIG PCB is prone to corrosion and oxidation; thus, proper handling of the board and choosing the right manufacturer will be beneficial.
We at PCBTok execute all the necessary means to prolong the life of your products. However, it’s still essential to properly handle it to fully use its utmost performance.
Once oxidation and corrosion occur, it can damage the overall performance of your board. We recommend utilizing gloves when touching the board because using bare hands can also promote the occurrence of tarnishing.
If you want to perfectly handle and maximize the potential of your ENIG PCB, you can directly message us more about this.

The Capability of PCBTok in Delivering Deluxe ENIG PCB


With our sophisticated process, the ENIG PCB by PCBTok is free from any errors. PCBTok is fully aware of the measures needed to be taken to improve the quality of the ENIG PCB; hence, we are only using the advanced materials on it.
PCBTok also considers improving the skills of our expert team to be suitable to our modern technologies to properly produce a quality ENIG PCB.
Additionally, we continually test the products that we develop to ensure that they are reliable and can perform their designated roles in your operation.
We are doing our utmost best to provide you with the best product and services you deserve; with PCBTok, you’ve genuinely cared!
ENIG PCB Fabrication
In order to obtain a perfect output of an ENIG PCB, we deploy the following three basic phases in the process.
The following processing steps are copper layer activation that including cleaning, micro-etching, and rinsing. The goes through the application of nickel and gold.
Apart from these three basic processing phases, you have the freedom to design, control, and monitor your board for a commendable output.
The mentioned processing steps and the additional ways in perfecting your ENIG PCB are specially designed to produce a high-grade output.
Should you have any questions about this, you can mail us.
It is well-recognized that an ENIG PCB aims to assist in shielding and protecting the entire circuit to improve the board’s overall performance.
There are varieties of phases that an ENIG PCB undergoes to attain its maximum potential without any issues. It includes the consideration of its essential features.
PCBTok considers the RoHS Compliance, Coefficient of Thermal Expansion (CTE), and the Dielectric Constant (DC) for the ENIG PCB.
It has o lead content; we constantly abide by RoHS. We constantly monitor its CTE to make sure it’s matched with conductive layers.
If you wish to have in-depth knowledge about this, message us.
OEM & ODM ENIG PCB Applications
Most Consumer Electronics are prone to heating since they are used for quite a long time; thus, ENIG PCB utilization is beneficial in this matter.
Automotive components can be prone to moisture occurrences; through ENIG PCB, there’s no need to worry about such situations.
It is recognized that an ENIG PCB is exceptionally reliable; hence, they are highly preferred in medical equipment for longer usage.
One of the advantages of using ENIG PCB is its capability to resist heat efficiently; thus, they are extremely suitable for computers that emit heat.
Security and Military Applications require versatility and longer shelf life in their applications; an ENIG PCB is capable of doing such.
ENIG PCB Production Details As Following Up
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NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy | |||||||
Silkscreen color | White, Black, Blue, Yellow | |||||||
Max hole size for via filled with Blue glue aluminum | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead-free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
ENIG PCB – The Ultimate FAQ Guide
ENIG PCB is a printed circuit board (PCB). In consumer electronics, well-made PCBs are essential. They must have the proper number of vias to allow electronic signals to pass through each layer. A common problem with ENIG is black pads. The best way to avoid it is to maintain an acceptable pH in a nickel bath. If you are unsure how to perform this operation, the Ultimate FAQ Guide will explain everything.
The ENIG PCB has several distinguishing features. It can be available in single-layer or multi-layers. It is also lightweight, making it ideal for small to large devices. However, one of the drawbacks of this type of PCB is its high cost. Because of the high cost, ENIG PCBs can be difficult to repair and update. Therefore, it is crucial to carefully check the specifications of the device before purchasing.
Immersion tin and immersion gold are two materials commonly used in PCB production. The former is an excellent choice for fine-pitch products. The latter is an excellent choice for backplanes. Both are corrosion-resistant and environmentally friendly. However, ENIG is not suitable for all applications. In some cases, the gold coating may corrode the nickel, resulting in black pads. This problem can easily be solved by placing another material on the ENIG PCB.
On the pads of the PCB, this coating is gold. Unless you are using the board as an Arduino HAT, most people will not know what the coating is. However, it makes the board solderable and gives it a more professional look. But how does ENIG work in a PCB? Here’s what you should know. It is chemically similar to gold.
ENIG (Electroless Nickel Immersion Gold) is a high-quality PCB surface treatment. It has the added benefit of being RoHS compliant. It also provides excellent solder joints and is extremely resistant to environmental conditions. ENIG is available for all PCB configurations (r) except ValueProto.
Rogers PCB With ENIG
PCB manufacturers use ENIG to coat copper solder pads with a thin layer of gold to protect them from corrosion and unwanted spreading. Because gold and nickel are compatible, a P-rich nickel layer is formed when the two materials come into contact. In other words, ENIG is a necessary part of the PCB, but it should not be ignored. The other advantages of ENIG are too important to ignore.
The coating process is the most obvious difference between ENIG and HASL. ENIG is more expensive than HASL, but it has many benefits. For example, ENIG creates a flatter surface on the board, which is critical when using large ball grid arrays for packaging. In addition, ENIG is safer and more environmentally friendly than lead plating, eliminates air knives, and slightly improves thermal durability.
ENIG (Electroless Nickel Immersion Gold) is a metal coating used in the production of printed circuit boards. It is typically applied to copper contacts and plated through holes to prevent oxidation and improve solderability. Although there are several variations of this surface treatment, ENIG is the most popular and widely used. The main difference between ENIG and submerged gold is their surface finish.
On printed circuit boards, chemical nickel immersion gold is the most common surface treatment. This is due to its trend toward low-cost and high-density packaging. However, reliability issues have plagued electroless nickel immersion gold (ENIG). This is partly due to the poor wetting properties of the tin solder. Modern facilities are used to determine the root cause of this problem. While ENIG is a reliable surface finish, it has some drawbacks.
Although they have similar surface finishes, Immersion gold has several advantages. Its excellent chemical and physical properties make it ideal for electrical contact, lead bonding, and soldering. ENEPIG offers excellent solderability and corrosion resistance but is more expensive than ENSI. As a result, it is a better choice for a variety of applications. The key to success is choosing the right gold chemistry.
Is submerged gold the same as ENIG in IC manufacturing? It depends. ENEPIG is the next generation of ENIG and is an upgrade to the ENIG process. ENEPIG consists of a thin palladium layer that prevents immersion gold from corroding the nickel layer. Other benefits of this new generation of immersion gold include highly reliable lead bonding, excellent multiple reflow soldering, switching contact surfaces, and selective gold plating.
ENEPIG Surface Finish
Both ENIG and HASL are electrically insulating coatings. On the other hand, ENIG is more durable and corrosion-resistant. The difference between these finishes is in the way they are applied. HASL is more suitable for complex assembly tasks, while ENIG is more suitable for simpler assembly tasks. EnIG requires less environmental information, such as temperature, humidity, and condensing atmosphere, but it may not be the best choice for all applications.
ENIG is a superior surface treatment for printed circuit boards. It resists corrosion and inhibits dendrite growth and flux reactivation. It is also more expensive than HASL. On the other hand, ENIG is more expensive than HASL. ENIG is preferred by some engineers over HASL because of its higher quality and reliability. ENIG is best suited for corrosive environments, while HASL offers an excellent surface finish for high-quality PCBs.
HASL and ENIG are both chemical plating processes. ENIG is a better alternative to HASL, which is a cheaper and more convenient option. The ENIG process uses two layers of metal coatings. The first layer is chemically plated and the second layer is immersed in gold to prevent nickel oxidation. The nickel protects the base copper by acting as a barrier to the copper. In addition, ENIG has good flatness, making it an excellent choice for fine-pitch devices.
ENIG Surface Finish
There is a difference between ENIG and HASL, but the terms are often used interchangeably. The difference lies in the Electroless Nickel Immersion Gold (ENIG) process and the results. HASL, on the other hand, is more trustworthy. It can be used for both plating and soldering. In many applications, the difference between these two plating types is significant. If you are not sure which one to choose, it is best to seek professional advice.
Before we begin, it is important to define ENIG or Electro-Neural Interface Gold. ENIG is a gold coating applied to the pads of electronic components. Most users will not notice the gold coating on the pads, but it keeps the board solderable and improves its appearance. ENIG should always be stored in rust-proof packaging. You can even purchase a unique ENIG kit for your Arduino.
The reaction between gold and nickel drives the process. High gold thickness and aggressive gold baths exacerbate corrosion, leading to the formation of black pads. This structure is similar to brittle fracture, which creates a cracked structure in the nickel. Shock, vibration, and thermal stress can also weaken the metallurgical bond and lead to black pads. Therefore, ENIG is a critical process in semiconductor manufacturing.
ENIG Structure
ENIG finishes on PCBs are often stored in batches before loading the widgets. After loading the components, they are either soldered or lead bonded to the surface mount pads. Compound cleaning is the process of surface activation and chemical cleaning. This is the process of fine-tuning the surface chemistry style. Because plasma can be inserted into narrow spots, this method is often used to process small spaces.
First of all, ENIG is an expensive process. It requires concentrated work progress and relies on the synthetic miracle known as the dark pad. This type of plating creates an ideal surface for gold wire fixation, but it has three drawbacks. It also reduces the high optical density. Therefore, it is critical to understand the advantages and disadvantages of ENIG before deciding to use it. For example, ENIG plating can improve the appearance of metal surfaces.
Immersion gold has many advantages over chemical nickel plating. It has a lead-free surface finish. Since high levels of lead are harmful to humans and can cause kidney and brain damage, using a high-quality lead-free gold plating method is a good choice. In addition to being aesthetically pleasing, submerged gold contains no toxic chemicals. Here are the three most important benefits. They are lead-free electrodes and (ii) electrodes.
Immersion gold has excellent chemical properties, making it an excellent choice for electronic components. The material is also highly testable and has a long shelf life. The nickel layer also acts as a barrier to prevent the oxidation of the gold. The intermetallic compound also has excellent solderability, and the gold layer protects the copper layer from oxidation. It has excellent oxidation resistance and is easy to use.
Immersion Gold PCB
One of the most significant advantages of immersed gold is its durability. It is a more permanent layer of gold than electrolytic gold plating. It increases the shelf life of the parts waiting to be soldered. Some products using this process are used in electronics, such as PCB manufacturing and aluminum wire bonding. However, it is not suitable for electrolytic gold plating due to its low adhesion.
EnIG and submerged gold PCBs have excellent electrical properties. Electroless nickel plating and submerged gold are the two most common surface treatments used in the PCB industry, and ENIG plating is the best of the bunch. The best thing about ENIG PCBs is that they can be seamlessly integrated into almost any electronic product. Victory Professional PCB manufacturers can meet even the most difficult specifications. With our services, you get a high-quality surface finish and a cost-effective PCB.