PCBTok’s FR4 PCB for Semiconductor Industry
Here are some advantages if you choose to get you FR4 PCBs here on PCBTok:
- 7/24 Sales and Engineering Tech Support
- 100% E-test and AOI inspection
- No minimum order quantity for new orders
- Certified with UL in US and Canada
If you’re looking for an FR4 PCB supplier, PCBTok can help. We offer high-quality FR4 PCBs at competitive prices, with a range of options available to suit your specific requirements. Contact us today to learn more about our services.
PCBTok’s Reliable FR4 PCBs
The letters FR means flame retardant, and 4 stands for woven glass-reinforced epoxy resin. The characteristics of FR4 differ tremendously from manufacturer to manufacturer, but it is known best for its structural rigidity and moisture resistance. In PCBs, this material provides insulation, separating nearby copper planes while also significantly strengthening mechanical properties.
FR4 PCB is the most popular material for any type or kind of printed circuit board, that is why it is readily available and inexpensive. You can get your FR4 PCB boards as short as 1-3 days, only here at PCBTok.
Here on PCBTok, we normally manufacture FR4 PCBs with a light coating of copper foil manufactured to one or both sides of an FR4 glass epoxy panel. Copper thickness or mass can differ slightly and can be specified individually depending on the client’s needs
Looking for an FR4 PCB that provides reliability, and dependability that will last for years and years to come? You’ll be able to get yours faster than ever before, thanks to the express shipping option! Get yours today and order your PCB here at PCBTok!
FR4 PCB By Feature
FR4 PCB by Material (5)
FR4 PCB by Surface Finish (6)
FR4 PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Accurate FR4 PCBs in PCBTok
When it comes to creating FR4 PCBs, accuracy is key. That’s why PCBTok offers a wide range of services to ensure that your PCBs are created with the utmost precision
Printed circuit boards are the backbone of every electronic device, from laptops to cell phones. They provide crucial support for essential components, and if they aren’t made with precision, the whole system can be thrown off. In this article, we’ll take a look at how FR4 PCBs are made with such accuracy in PCBTok.
Contact us today to learn more about our FR4 PCB services, or visit our website to request a free quote.
PCBTok’s FR4 PCB Process
At PCBTok, we use a unique process to create FR4 PCBs that are highly accurate and have a smooth finish.
First, we start with high-quality FR4 material. This material is then cut to the desired size and shape using a computer-controlled cutting machine.
Next, the FR4 is heated to a temperature that is just below its melting point. This allows the material to be molded into the desired shape.
After the FR4 has cooled, it is then coated with a thin layer of copper. This copper layer is what will allow electrical signals to flow through the board.
Finally, the board is covered with a protective solder mask and silkscreened with your desired design.
Worry-Free Devices Thanks to PCBTok's FR4 PCB
If you’re looking for FR4 PCBs that are accurate and of the highest quality, look no further than PCBTok. We use the latest technology and equipment to ensure that our products meet your expectations and requirements.
Our team of highly skilled and experienced professionals is dedicated to providing you with the best possible service. We understand the importance of getting your order right the first time, so we offer a 100% satisfaction guarantee on all of our products.
We also offer a wide range of customization options to make sure that your PCB is exactly what you need. Whether you need a certain size, shape, or color, we can make it happen.
PCBTok's FR4 PCB Dependability
As the world’s leading provider of high-quality FR4 PCBs, PCBTok is committed to providing our customers with the best possible products and services. Our FR4 PCBs are designed to meet the highest standards of quality and performance, and they are backed by our industry-leading warranty.
PCBTok’s FR4 PCBs are used in a wide variety of applications, including semiconductor packaging, automotive electronics, and telecommunications. They are also ideal for use in high-temperature environments.
Our FR4 PCBs are made with a high-quality dielectric material that is resistant to thermal and mechanical stresses. This material provides excellent electrical and thermal conductivity, making it an ideal choice for use in high-speed applications.
PCBTok's FR4 PCB Fabrication
There are many factors that go into choosing the right solder mask color for your FR4 PCB. The three most important factors are:
- The function of the circuit board
- The environment in which the circuit board will be used
- The aesthetic of the circuit board
The most common soldermask colors for FR4 PCBs are green, red, and black. However, there are other options available as well.
Here at PCBTok, we offer a wide variety of soldermask colors for your FR4 PCB needs. We have over 20 different colors to choose from! Whether you need a specific color for your project or you just want to add a bit of personality to your circuit board, we have you covered.
To learn more about our soldermask color options, contact us today.
At PCBTok, we offer our customers the option to have their printed circuit boards (PCBs) made from FR4 material with a custom thickness. This is a great option for those who need to ensure that their PCBs are of the highest quality and accuracy.
When it comes to choosing the thickness of your FR4 PCB, the first thing is the size of your components. You will want to make sure that your PCB can accommodate all of your components without being too large or too small.
Finally, you will want to consider the environment in which your PCB will be used. If it will be exposed to extreme temperatures or humidity, you will want to choose a thicker PCB so that it can withstand these conditions.ve heavier components, you will want to choose a thick
Choosing the right thickness for your FR4 PCB is important for ensuring the accuracy and quality of end products.
OEM & ODM FR4 PCB Applications
FR4 PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“One of most significant characteristic of PCBTok to our company was the pace with which everything was accomplished, which include responding e – mail queries, acquiring quotations, and fabricating the boards PCBs. PCBTok’s competences for small companies are also far better compared to all those of other Circuit board companies, and the cost for the specs that we needed was also realistic. PCBTok will be used for all of our high-tech PCBs now and in the future.”Daniel Lindberg, Procurement Staff of Electronics Start Up, Sydney, Australia
“My team and I did a quick check to the Prototype PCBs that arrived yesterday afternoon. I must say that the PCBs look amazing! You guys do incredible job! Thank you PCBTok, and I’m sure you’ll hear from us again soon to order our 2nd batch of Prototype PCBs. Thumbs up for PCBTok’s staff and engineers! “Mike Kauffman, Owner of a Tech-Company from Indiana, USA
“I am an IT professor at the University of California, and I recently ordered boards manufactured by PCBTok. You guys did a wonderful job on mythe student’s boards. The students told me that the boards were simple and easy to use since it doesn’t have flaws, that their projects were completed, and that the results would be presented for their final grade. Your team’s support and prompt guidance is gratefully received. I look forward to working with you once more in the near future.”Jeffrey Kirkwood, IT Professor, Australia
The Completed FAQ Guide for FR4 PCB
The complete FAQ guide for FR4 PCBs is a collection of articles covering the basics of FR4 circuit boards. FR4 PCBs are inexpensive and widely used for electronic prototyping. They are not suitable for high-frequency printed circuits or designs that require rigidity. FR4 thicknesses can range from ten inches to three inches, depending on the application.
FR4 PCBs are resistant to high temperatures, and higher Tg values do not mean that the module will fail. FR4 materials typically operate between 95 and 100 degrees Celsius, with a minimum Tg of 130 degrees Celsius. The Td value represents the “decomposition time” of the material, which is the temperature at which 5% of the material decomposes (evaporates and degasses) by mass.
Four different materials are used to make FR4 PCBs. because these materials have different dielectric constants, they produce smaller boards. FR4 boards are typically thin and flexible, which may or may not be advantageous depending on the application. When considering FR4 PCBs, please consider the following.
FR4 stands for “Fully Reinforced Copper”. It is the most widely used type of PCB material in the electronics industry. This substance is commonly used in the manufacture of circuit boards, relays, switches, and busbars. It is used in screw terminal strips, transformers, and gaskets. The thickness of the FR4 sheet is determined by the specifications of the project. It usually varies from ten inches to three inches.
FR4 sheet should not be used in high-temperature environments. The engine compartment of an aircraft is a common example. FR4 PCBs are not suitable for high-frequency designs because they cannot withstand high temperatures. However, if you need a high-frequency board, consider the performance of FR4 boards. These boards are capable of handling high-speed applications. However, it is not recommended to use them in high-temperature environments. FR4 PCBs, on the other hand, are ideal for prototyping and testing.
FR4 PCBs are the most cost-effective PCB material available today. Low to medium frequency devices are common applications for FR4 PCBs. They are robust and offer an excellent balance of electrical stability and manufacturability. FR4 PCBs can be manufactured using existing processes. Roger PCBs, on the other hand, are intended for high-performance applications in niche areas. Due to their low outgassing and temperature stability, they are particularly suitable for space applications.
When selecting PCB materials, it is crucial to understand the function of each material. Flame retardants are chemicals that are applied to materials to prevent fire. They also have excellent electrical, mechanical, and thermal properties. FR4 laminates and prepregs are suitable for a variety of manufacturing processes. This helps manufacturers choose the material that is best suited for the job at hand. If you have any questions about FR4 PCB materials, Twisted Traces can help you.
FR4 is a highly stable material that is commonly used in PCBs and circuit boards. This material is best suited for high-temperature applications. Moisture absorption refers to the resistance of the material to water. The percentage of moisture that a circuit board can withstand before it degrades is measured. FR4 absorbs very little water. FR4 absorbs only 0.1% of its weight after 24 hours in water. Therefore, it is an ideal material for electronics manufacturing.
FR4 is used to produce high-density multilayer films. It is suitable for the direct chip to attach and surface mount multilayers. It has unparalleled mechanical properties. It cannot be beaten because it is too strong, but it can be drilled. This material is also very difficult to cut with scissors and drills. Despite its strength and versatility, FR4 is more expensive than phenolic resin and has fewer applications than other materials. However, if your PCB will be exposed to harsh conditions, this material may not be the best choice.
Another disadvantage of FR4 is that it does not maintain a constant impedance at high frequencies, resulting in degraded signal integrity due to reflections. FR4 boards are also not suitable for high-temperature environments, such as the engine compartment of an aerospace vehicle. Therefore, care should be taken when selecting FR4 boards. Which components are suitable for use in such environments will be determined by the manufacturer’s FR4 PCB guidelines.
Would you like to know what FR4 stands for? There are many definitions available, but what is the full meaning of FR4? This acronym combines five different meanings. These definitions come from a variety of fields including technical, medical, electronics, and laminates. If you’re not sure, check out the FR4 definition to help clarify. FR4 stands for “Flame Resistant 4”.
PCBs are made from a base material, FR4. This material is very inexpensive to produce low-frequency laminates, but more expensive to produce high-frequency laminates. In general, it is the most cost-effective and high-quality material for PCB manufacturing. However, the dielectric constant of the solvent is important because it determines whether the solvent is polar or non-polar. The higher the dielectric constant, the greater the polarity and the ability to stabilize the charge.
In general, FR4 PCBs should not be used in high-temperature environments, such as the engine compartment of an aerospace vehicle. Therefore, it is best suited for prototyping and testing. If you need a more specific definition of FR4, please look in the dictionary. There are other resources that provide in-depth information on FR4 definitions.
The base material for high-speed PCBs is typically FR4. FR4 has a dielectric constant of about 4.5, making it a suitable material for PCBs. However, FR4 has limitations. It loses dielectric properties in high-temperature environments, reducing insulation and increasing conductivity. The dielectric constant of FR4 decreases with increasing temperature.
The Dk of an FR4 board can vary greatly across its surface. These distinctions are critical when designing boards for hot environments. As a result, high-frequency laminates have a lower Dk, which can be useful in hot weather. However, they may not be appropriate for all applications. For these reasons, before selecting an FR4 board for your projects, you should be aware of all of its properties.
The glass transition temperature of an FR4 substrate ranges from 115 to 200 degrees Celsius. This number can be greatly influenced by the manufacturing process and the resin used. Typical FR4 PCBs have an FR4 layer sandwiched between two thin copper layers.
Because of the presence of bromine, a halogen chemical element, it is fire resistant. Because of its excellent resistance-weight-dielectric properties and good insulating capacity in both dry and humid environments, FR4 has largely replaced the G-10 composite in many applications.
Stack-up for FR4 and IMS
FR4 PCBs are constructed from woven square-grid glass strands. The FR4 PCB substrate is then semi-cured after being impregnated with epoxy resin. Although this material has high electrical resistance, it is not suitable for high-frequency printed circuits. If you need a rigid circuit board, polyimide/polyamide is a better choice.
One of the most important factors to consider when selecting PCB materials is the operating environment. This includes temperature and humidity levels. High-frequency laminates offer increased heat and moisture resistance without sacrificing circuit functionality. This property is especially important if your PCB will be exposed to harsh industrial and outdoor conditions. If you are considering using FR4 for your PCB, make sure you are using a high-frequency laminate.
FR4 offers many advantages, including affordability, lightweight, and a wide range of thicknesses to choose from. However, it is not the best board for all applications. For example, HF laminate may be a better choice for radios. In other cases, you should compare Df values to see which one best suits your needs. Due to its electrical properties, FR4 is not suitable for high-frequency applications.
FR4 PCB material is also sensitive to heat. To prevent cracking, DuPont and Rogers use glass fibers impregnated with resin. Because of its extremely high glass transition temperature, glass fiber is not suitable for heat-intensive applications. Other limitations include its inflexibility or lack of chemical resistance, and inferior performance to more expensive materials.
Although FR-4 PCB material is cheaper than laminated copper, signal loss increases with frequency. Since FR-4 has a higher loss factor than high-frequency laminates, FR-4 circuits will have higher losses than high-frequency laminate circuits. A typical FR-4 value is 0.020, compared to 0.004 for HF laminates, which is one-fourth the value of FR-4.
FR4 is one of the most common materials used in PCB manufacturing. It has a dielectric constant range of 6 to 11. Therefore, using it in circuit boards makes them smaller. Due to its high dielectric constant, this material is also an excellent choice for high-frequency applications. For this reason, it is often used in laminated designs and FR4 circuit boards.
The type of application affects the choice of FR4 material in a PCB design. Thicker FR4 PCBs will increase the weight of the device, making it difficult to transport and limiting portability. Thinner FR4 boards will improve portability and appeal to buyers. When designing multilayer boards, the thermal properties of the material must be considered.
FR4 Wave texture
High temperatures and lead-free assembly processes are typical of FR4 materials. This is because they have the same dielectric constant as the speed of light in a vacuum. The dielectric constant of FR4 materials typically ranges from 3.8 to 4.8, depending on the glass weave pattern and resin content. Copper foil roughness also affects the dielectric constant, so look for one with a lower dielectric constant.
Since FR4 PCB material comes in many forms, you should do your research to find the best material for your project. It is a very popular material with a variety of features and specifications. Discuss your needs with the manufacturer to find the best solution. Twisted Traces is the leading manufacturer of FR4 printed circuit boards in the United States and has years of experience assisting customers in selecting the best FR4 material.