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A Brief Introduction to Gold Plating PCB
Gold plating PCBs have a high conductivity and low resistance, making them ideal for use in applications where heat or electricity is generated.
PCBTok’s commitment to quality is why we have been able to offer the best product to our customers for over 10 years.
We ensure that every Gold Plating PCB is manufactured using the highest quality materials and processes possible.
Quality Assured Gold Plating PCBs from PCBTok
Gold Plating PCB is a kind of circuit board that is plated with gold. The gold helps to improve the conductivity of the circuit board, which results in more efficiency.
The main advantage of using gold plating printed circuit boards is that they have good thermal conductivity. This means that heat can be transferred quickly from one point to another without being blocked by any kind of resistance. This helps reduce the amount of heat generated when there is high current passing through the board or when an electric device is switched on or off suddenly.
PCBTok is the leading manufacturer of gold plating PCBs and have been for over a decade. Our gold plating PCBs are made from only the finest materials, and we use a proprietary process to ensure that all of our PCBs are free from defects.
Gold Plating PCB By Types
ENIG Gold plating PCB is a type of gold plating that uses electroless nickel immersion gold as the base coating. It is a process where an electronic board is immersed in an electrolytic solution, which deposits a thin layer of nickel onto the copper surface.
A gold plating PCB is often used in the electronics industry because it provides excellent corrosion resistance. ENEPIG gold plating has been proven to have better adhesion to the copper core than other types of plating.
Gold fingers are the gold-plated pads on the PCB that conduct power and ground to your electronics. These are typically located in the corners of a PCB. Can be used to increase the electrical and thermal conductivity of the PCB, as well as to improve its durability.
Flash gold plating can be applied to the surface of printed circuit boards. It is a quick, easy and cost-effective process that involves applying a layer of fine gold particles to the surface of a PCB. Reduces corrosion and increases mechanical strength.
Castellation gold plating is a process in which gold is electroplated onto a printed circuit board to create an embossed pattern along the edges of the PCB. The process is used to create a rampart-like structure along the edges of a printed circuit board.
Gold Plating on the printed circuit board’s edge is a method of increasing the longevity and durability of your PCBs. Also provides an anti-corrosive coating that protects against oxidation, for applications that are exposed to humidity or other environmental factors.
Overview to Gold Plating PCB
A gold plating PCB is a printed circuit board that has been coated with a layer of gold. The process by which this occurs is called electroplating. As an electrical conductor, gold has many advantages, including its resistance to corrosion and oxidation.
The electrical properties of gold make it ideal for use in electronic components such as transistors and integrated circuits. The gold plating process can be used on both single-sided and double-sided PCBs, as well as multilayer PCBs.
There are several different types of gold plating that can be applied to a PCB. The most common type is immersion gold plating, which uses an electrolytic process to deposit gold onto the surface of the PCB. This kind of plating is used in industrial applications because it is reliable and produces high-quality results.
What is Gold Plating?
Gold plating is a process used to coat the surface of a printed circuit board with a thin layer of gold. This layer helps the board resist corrosion, improves its electrical conductivity, and provides a more durable finish that doesn’t flake off over time.
Gold plating is a process that can be used to coat printed circuit boards with a very thin layer of gold. This is often done to improve the electrical properties of the PCBs, or to make them more resistant to corrosion or oxidation.
The process involves submerging the PCB in an electrolytic solution that contains gold ions, which then bond to the copper on the board. The result is a thin layer of gold that can protect against corrosion and oxidation.
Why Is Gold Plating Used on PCBs?
Gold plating has been used on PCBs for a long time because it has many beneficial properties. It is an excellent conductor of heat and electricity, which makes it a good choice for electronic components. The gold can also act as an insulator when needed, and it is resistant to corrosion from many substances such as acids and alkalis.
The main reason that gold is used in electronics is because it does not oxidize easily. This means that the copper surface will not tarnish over time, which would lead to reduced conductivity and durability for the PCB. The main reason that gold is used in electronics is because it does not oxidize easily. This means that the copper surface will not tarnish over time, which would lead to reduced conductivity and durability for the PCB.
PCBTok | Dependable Gold Plating PCB Manufacturer
PCBTok is a PCB manufacturer that specializes in gold plating. We are a reliable PCB supplier with a commitment to quality, service, and affordability. Our mission is to provide our clients with dependable gold plating PCBs at reasonable prices.
We have been in the PCB industry for over 12 years and have worked with some of the biggest names in technology. We have experience working with companies who are looking for gold plating PCBs for their products, as well as businesses that need these boards for their own use.
Our team is made up of experienced engineers who specialize in creating high-quality circuit boards that are perfect for industrial applications. They will work closely with you to create a design that meets all your needs.
Gold Plating PCB Fabrication
Hard gold plating is a process that produces a more durable coating on a metal surface. Soft gold plating, on the other hand, provides a less durable coating with a lower conductivity.
Hard gold plating is used to provide an extremely hard, durable coating on a metal surface. This process produces an extremely hard, tough layer of gold that protects against wear and corrosion while providing excellent electrical conductivity.
Soft gold plating is used to provide a less expensive alternative to hard gold plating in situations where durability is not required. This process produces an extremely soft and thin layer of gold that will wear away quickly and may not provide adequate protection against corrosion or wear.
The first major difference between gold plating and immersion gold is the way that they are applied to the board. Gold plating can be done using a chemical bath or by spraying a layer of gold onto the board. Immersion gold is applied through an electroplating process where anodes are immersed in an electrolyte solution containing dissolved metal ions. The gold that is deposited onto the board forms a thin layer of pure gold on top of its base material.
In terms of quality, immersion gold tends to be more durable than gold plating because it has a higher melting point than regular 24-karat gold. This means that immersion gold will maintain its luster longer than other types of finishes available for printed circuit boards such as nickel plating or tin plating which tend to oxidize over time due to exposure to air and light.
OEM & ODM Gold Plating PCB Applications
Gold plating printed circuit boards leads to better performance of digital still cameras. Gold allows the board to have a low resistance because it is a good conductor of electricity.
Gold Plating printed circuit boards for Desktop Computers is a robust way to increase the durability of computer components. It also results in better performance with reduced power consumption.
Gold plating for printed circuit boards allows scanners to function at faster speeds and with increased efficiency. Reduces resistance, resulting in higher performance and faster data transmission.
Create a circuit board with a surface that will not corrode and is also much more durable than copper. We offer a wide selection of services to help you design and manufacture your televisions.
Excellent choice for high-end audio amps. By using special plating techniques and materials, we can add gold to the boards without compromising their integrity or the design of the board itself.
Gold Plating PCB Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
The gold plating process is a process that involves the application of a thin layer of gold on a surface. This process is done through electroplating, which is the process of applying an electric current to the item being coated and then allowing the metal ions to be deposited onto the object.
The process involves immersing an object in an electroplating solution containing very fine particles of gold. Once the object has been coated with gold in this way it must then be polished to remove any excess material so that only a very thin layer remains on its surface.
The gold plating process can be used for many different purposes; however, it is most used as a protective coating for jewelry and printed circuit boards. Gold plating also has many other uses including electronics, dental work and denture repair, medical devices, and even automotive parts!
PCB gold plating is a process that involves coating the electrical circuit board with a thin layer of gold. The advantages of PCB gold plating are numerous, ranging from increased corrosion resistance to better thermal conductivity.
The primary benefit of PCB gold plating is that it provides increased corrosion resistance and protection against oxidation, which can cause electrical shorts or damage to the surface of the circuit board. This is especially useful for areas where liquids may come into contact with the circuit board for applications where there are high levels of humidity or airborne particulates.
In addition, PCB gold plating makes the board more conductive, which can improve thermal transfer by allowing heat to dissipate more quickly from components and thus keep them cooler. This can help prevent overheating and better protect against fire hazards caused by excessive temperatures within a device or system.
Finally, PCB gold plating increases strength by making it harder for cracks or breaks to form in areas where they may cause problems such as short circuits or power surges that could damage other components within an electronic device (such as smartphones).