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HDI PCB Service
PCBTok Top High-Density Interconnect (HDI PCB) Manufacturer
- HDI PCB up to 40 layers
- Laser Blind Via can be Filling Plating on HDI PCB
- Provide IoT-capable boards and HDI boards for smart electronics
- HDI PCBs with blind, buried and microvia can be manufactured
- Competitive price with no MOQ
PCBTok offers top-tier HDI PCB manufacturing using premium materials such as High Tg FR-4, polyimide, and PTFE. As a leading fabricator in China, we specialize in multilayer HDI PCBs—up to 40 layers—delivering excellent quality with fast lead times. Our strong inventory ensures stable supply and cost-effective solutions tailored to your specifications. With no minimum order quantity required, we support your project from prototype to full production. Choose PCBTok for reliable HDI PCB fabrication, responsive customer service, and competitive pricing.
What Defies a HDI PCB?
HDI PCB delivers higher wiring density in a compact footprint. Designed for today’s advanced electronics, HDI (High-Density Interconnect) PCBs use laser-drilled blind vias, buried vias, micro vias, and fine-line routing to maximize component placement and performance.
| Feature | PCBTok’s Technical Specification |
| Layers | 2 to 40 layers |
| Capabilities | Multilayer and HDI PCB with microvias, blind/buried vias, via-in-pad, back drilling, impedance control, and stacked vias. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3, 4+N+4, any-layer HDI |
| Material Available | FR4, High Tg FR4, Halogen Free, Polyimide, Rogers, Arlon, Teflon, I-Tera, Taconic, Isola, Ventec, Shengyi |
| Finished Copper Weights | 0.5oz – 12oz |
| Track and Gap (Minimum) | 0.075mm / 0.075mm |
| Thickness | 0.2mm – 10.0mm |
| Max Dimensions | 500*600mm – 1100*500mm |
| Surface Finish | HASL, Lead-Free HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Gold Finger |
| Mechanical Drill (Min) | 0.15mm |
| Laser Drill (Min) | 4mil |
HDI PCB Advantages
HDI PCBs deliver more functionality in a smaller footprint. If you’re building compact consumer electronics or advanced communication systems, HDI PCBs give you a reliable and cost-effective edge.
Smaller and Lighter Boards – HDI PCBs support components on both sides, reducing board size and weight without sacrificing performance. Ideal for space-constrained applications.
Better Heat Dissipation – High-density layouts help manage thermal performance efficiently, reducing the risk of overheating in tightly packed systems.
Lower Material Costs – HDI technology uses less laminate and fewer layers. This is especially useful when working with premium materials, helping to cut costs significantly.
Stronger Signal Integrity – Shorter connection paths reduce signal loss and delay. This means better performance and fewer issues with interference or crosstalk.
More Reliable Connections – Micro vias replace traditional through holes, offering smaller aspect ratios and more stable connections. This leads to higher long-term reliability.
Faster Production Time – HDI boards streamline the design and testing process. The result? Quicker production cycles and faster delivery to your customers.
High Performance in Small Spaces – More interconnections in less space allow HDI PCBs to support advanced processing power, even in compact device designs.
Common HDI PCB Stack-ups
The right HDI PCB stack-up improves performance, saves space, and reduces complexity. Here are the most commonly used stack-up configurations in HDI PCB design.
1+2+1 Stack-up
This configuration features one HDI layer on each side of a central core. It’s ideal for moderate BGA densities where space and performance must stay balanced. With blind or through vias connecting layers, you get reliable routing and a compact board design.
2+2+2 Stack-up
Designed for higher pin-count devices, this structure includes two HDI layers on each side of the core. It supports greater routing density and improved signal integrity. Using blind, buried, and staggered vias, this stack-up handles complex layouts with ease.
1+4+1 Stack-up
This six-layer stack-up places microvias on both outer layers, with four internal core layers. It offers a strong base for power and ground planes, while supporting efficient signal routing on the HDI outer layers. It’s a smart choice for medium-complexity designs.
1+6+1 Stack-up
With eight total layers, this structure adds even more routing capability. You get one HDI layer on each side and six core layers in between. This layout supports high-density interconnects without compromising performance or board stability.
2+4+2 Stack-up
This eight-layer design includes two HDI layers on top and bottom, plus a four-layer core. It provides a robust foundation for power and ground while supporting fine-line routing above and below. It’s efficient, compact, and well-suited for advanced applications.
2+6+2 Stack-up
Ideal for high-performance systems, this ten-layer configuration combines two HDI layers per side with six inner core layers. The design supports complex circuitry, excellent thermal management, and reduced signal loss. It’s built for speed, space, and reliability.
Laser Drill Technology for HDI PCBs
At PCBTok, laser drill technology plays a vital role in advanced HDI PCB manufacturing. By creating the smallest microvias with precision, we enable more complex circuitry in less space. Using a laser beam just 20 microns wide, with minimum drill size of 4mil and maximum drill size of 6mil, we can drill cleanly through copper and glass-reinforced laminate materials.
This method is especially effective when working with modern low-loss laminates. These materials feature a low dielectric constant and excellent heat resistance. They support finer vias and are ideal for lead-free assembly processes. The result is a more compact, high-performance board.
Laser-drilled microvias form the key electrical connections between PCB layers. These vias save space, improve signal flow, and reduce electrical interference. Because the process allows greater freedom in interlayer design, it supports more efficient routing and denser layouts.
Lamination & Materials for HDI Boards
At PCBTok, we use advanced lamination methods to build reliable multilayer HDI PCBs. Our process lets you add more layers in sequence. This technique—called Sequential Build-Up (SBU)—adds pairs of layers using laser-drilled holes for precision connections. These holes are solid-filled, giving your board better thermal performance and stronger interconnects.
We also use Resin Coated Copper (RCC) to improve drill quality and reduce overall board thickness. RCC features ultra-thin copper foil with a smooth, anchored surface. It’s chemically treated for the tightest line widths and spacing.
For lamination, dry resist is still applied using heated rolls. However, for HDI builds, preheating the core material is key. It helps the resist adhere evenly by minimizing heat loss during roll contact. Stable temperatures from start to finish reduce trapped air and improve pattern accuracy.
HDI PCB Applications
HDI PCBs are found and important for modern electronics. They enable smaller, cost-effective devices without losing performance. Several industries rely on HDI technology for various needs:
Consumer Electronics
Used in smartphones, laptops, wearables, etc. HDI PCBs help these devices stay small but powerful.
Communications
Used in routers, switches, and semiconductors. They support fast internet, strong networks, and digital media connections.
Automotive and Aerospace
Enable compact, lightweight parts for cars and aircraft. These PCBs run WiFi, GPS, cameras, and sensors for better efficiency.
Medical Devices
Used in monitoring, imaging medical equipment. HDI technology reduces device size and improves performance.
Industrial Applications
Power IoT devices and smart sensors in manufacturing and warehousing. They boost connectivity and operational efficiency.
Why Choose PCBTok as Your HDI PCB Fabricator
Select PCBTok as your reliable HDI PCB manufacturer for high-performance HDI PCB boards at competitive prices.
Our team specializes in HDI technology and supports you through every stage of HDI PCB development, from PCB manufacturing to PCB assembly.
We have 20 plus years of experience of manufacturing HDI PCBs. Our specialized factory capabilities support 24-hour rapid prototyping for easy testing of your new projects.
Our professional engineers team is ready to provide FREE DFM Check to evaluate and optimize your project. You just need to upload your gerber file and wait for our team to give you a quick quote.
You can count on PCBTok to meet all your HDI PCB needs efficiently and reliably.
Related Products
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PCBTok offers a comprehensive range of PCB services, including flex, rigid-flex, and rigid PCB fabrication. This wide selection allows us to meet various project needs. We only use high-quality materials and cutting-edge tools to ensure your PCBs perform at their best and have a longer lifespan. Our dedication to quality, affordability, and customer satisfaction truly sets us apart. When you work with PCBTok, you experience seamless support and outstanding results. Reach out now for a quote for high-density interconnect solutions tailored to your needs.
Frequently Asked Questions
| Feature | HDI PCB | Traditional PCB |
| Size & Weight | Smaller and lighter. Fits tight spaces. | Bulkier and heavier. Takes up more room. |
| Wiring Density | High pad and line density. Tight spacing. | Looser spacing. Fewer wires and pads. |
| Hole Types | Uses micro vias, blind, and buried holes. | Only has regular through-holes. |
| Hole Making Method | Laser drilled for precision. | Uses mechanical drilling. |
| Line Width & Via Size | Narrow lines and small vias. Less than 76.2μm. | Wider lines and larger holes. |
| Dielectric Thickness | Very thin layers. Around 80μm or less. | Thicker layers. Less control over thickness. |
| Electrical Performance | Strong signals. Low noise. Handles heat and EMI better. | Weaker signal control. Less resistant to EMI. |
| Design Flexibility | Good for mini and high-speed designs. | Suited for basic functions. |
| Layer Count | Usually 6 to 12 or more. | Usually 2 to 4 layers. |
| Manufacturing Complexity | More difficult to build. Needs advanced tools. | Easier to produce. Standard process. |
| Plugged/Buried Hole Requirements | Must be clean and even. Affects performance and reliability. | No strict buried hole needs. |
| Cost | Higher initial cost. Long-term value for advanced builds. | Cheaper to produce. Lower upfront cost. |
When you build HDI PCBs, you need clear design rules. These rules help you avoid mistakes and make better boards. The standards for high-density interconnect boards tell you what to follow. Here are the main ones:
- IPC/JPCA-2315 – This one is a design guide. It helps you plan your vias and layout. It keeps your board clean and easy to build.
- IPC-2226 – Use this for material checks and design steps. It shows you how to form microvias and what to avoid. It helps keep your board reliable.
- IPC/JPCA-4104 – This tells you which dielectric materials to use. It also explains how they should behave under heat or stress. It helps your board last longer.
- IPC-6016 – This one looks at the full board. It checks if your HDI stack is strong and meets basic quality levels. It’s great for final review.
Copper Clad Laminate
This is copper foil pressed onto one or both sides of a solid base. That base is a cured, or fully hardened, insulating layer. Most common types are FR4, FR-5, and some PTFE versions. You’ll mostly see single-sided CCL used.
Resin Coated Copper
This is copper foil that’s coated with a thin resin layer. It sticks directly to your inner layers. RCC is great for microvia designs. Some types are made for wet processes, while others aren’t. If not wet-friendly, you’ll need plasma or laser to drill clean holes.
Prepreg
Also called B-stage or bonding sheet, Prepreg is fiberglass fabric filled with uncured resin. It’s not fully hardened yet. When heated in a press, the resin melts, flows, and bonds layers together. It holds copper, laminate, or other parts tight in your HDI stack.
HDI PCBs and multilayer PCBs might look similar, but they’re not built the same way. Multilayer PCBs use stacked copper layers bonded together. HDI PCBs go further by using tiny holes—called microvias—and advanced laser drilling. These holes help pack in more connections without needing more space. HDI boards also use buried and blind vias to keep the design compact. You get higher layer counts, tighter wiring, and smaller boards.
The minimum prepreg thickness for this is 0.06 mm. This thin layer allows precise laser drilling without damaging nearby materials. It’s just enough to support microvia formation while keeping the board compact.
Minimum core thickness for HDI PCB prototyping is 0.1 mm. This gives enough strength to support the vias while keeping the layers thin. It also helps maintain accuracy during laser drilling.