PCBTok is Your Authentic HDI PCB Provider
PCBMay can create the HDI PCB to your specifications, from PCB design to assembly. We can do so without hesitation, offering all of the features you desire!
- Support for your commercial-use equipment
- Adequately provide your PCB needs without shortage
- Compatible with a wide range of electronic components and manufacturers
- Provide IoT-capable boards and HDI boards for smart electronics
- 100% client satisfaction is guaranteed
HDI PCB by PCBTok is Reliable
With PCBTok as your supplier, your HDI PCB will be cost-effective. We combine good value with excellent quality.
We are a company that has enough raw materials to supply bulk Multilayer PCB, FR4 PCB, FR5 PCB, and other circuit boards.
All of these sorts of boards will work for your HDI needs. Just inquire!
PCBTok is now taking orders for HDI PCBs.
One of our specializations is HDI PCB assembly. We’ll give you all the knowledge you’ll ever need in this complete feature piece.
HDI PCB By Feature
Our Multilayer PCB is dynamically capable of handling High Power demands and can survive heavy use. These boards are used in the military and service industry, they must be fully functional indeed.
HDI Multilayer PCBs are available, and they are produced using high-quality prepregs. FR4 sheets with a thickness of 75µm can be employed in a number of sophisticated electronics applications.
Because we have laser machines, making Microvia PCB is part of our industrial competence. We can create PCBs with 20 layers, 32 layers, and more. Digitalization is made possible by these numerous layers.
When you apply our Digital HDI PCB on your device, you can expect high compatibility with recently developed digital devices. We use the most advanced materials ultimately designed for the board construction process.
SMD PCB refers to the use of surface mount technology rather than plated through hole technology in the fabrication process. Because there is now a larger component density, the HDI function is optimized.
Through-hole component leads run through the board during the fabrication process, resulting in Plated Through Hole. PTH HDI PCB is hence claimed to be mechanically stronger than SMD HDI PCB.
HDI PCB By Layers (6)
HDI PCB By Surface Finish (6)
HDI PCB Benefits

PCBTok can offer 7*24h online support for you. When you have any PCB-related questions, please feel free to get in touch.

PCBTok can build your PCB prototypes quickly. We also provide 24-hour production for quick-turn PCBs at our facility.

We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.

PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
How Does PCBTok HDI PCB Work?
HDI PCB refers to a wide range of printed circuit boards. These can be multilayer boards, but also single-sided and double-sided boards.
What makes it HDI is better transmission quality, as well as thermal regulation. Most HDI boards are made with advanced prepreg and laminates like Rogers material.
Because there are more electronic connections per board, per layer, this type of PCB is considered cost-effective.
HDI PCBs are also noted for their ability to enable speed. This is one of our most popular items at PCBTok.
Mobile and telecom applications are particularly well-suited to HDI PCB use. For example, most cellphone PCBs are HDI.

HDI PCB Production Process
We make PCBs using the accepted multi-step process. This includes the following.
The substrate is impregnated with epoxy resin before being baked in its entirety.
The holes are bored after the curing process (if mechanical holes are used).
In the case of Microvia PCBs, laser drilling is also an option.
Next, patterns in the HDI PCB are created using additive and subtractive processes.
The final procedures, such as attaching PCB components, are then completed after the patterns have been prepared.
Advantages of HDI PCB Use
The key benefit of HDI PCB is that it has been tested by thousands of consumers.
When it comes to circuit boards, these are the best-sellers. We can assure you that your product from us is defect-free due to our excellent quality control.
The HDI PCB quality testing is rigorous. It is also the same with High Speed and High-Frequency PCBs.
In daily operation, we conduct Continuous Improvement in our facility, much like the greatest PCB firms.
Choose the HDI PCB, which is built to last. This type of PCB will take your business to new heights.

HDI PCB High Standards


HDI PCBs made of PCBTok’s genuine materials are built to last. In the end, this saves you money.
We create all types of PCBs for commercial usage as a trusted source by worldwide brands from the United States, Canada, and Europe.
We specialize in sophisticated industrial circuit boards, such as the 5G HDI PCB, and if that is part of your specifications, you can request any high-layer count HDI PCB for your order.
We have eager pros working with us if you require assistance with your PCB design.
Call us now to avail!
PCBTok HDI PCB Fabrication
We can handle sophisticated prepregs and laminates thanks to our wide manufacturing capabilities.
Rogers, Arlon, and Taconic materials are available.
We can make use of them to fabricate HDI PCBs: single layer, double layer, or multilayer.
One of the advantages of choosing PCBTok is our commitment to providing you with genuine PCB materials.
You’ll only get the best, so you can get the most out of your end products.
The reward of putting your trust in a good firm like ours is long-lasting items.
For the HDI PCB requirement, PCBTok is a good PCB maker with a large assortment of circuit board-related items available.
Since 2008, we’ve been producing HDI type of printed circuit boards.
Some customers want their PCBs to have distinct looks, thus they choose different soldermask colors.
You may count on us to provide you with whatever PCB color you desire: the most popular colors are red, blue, and black.
The majority of customers will purchase an HDI PCB with a green soldermask, but we have enhanced the fabrication of HDI PCBs with custom colors, including transparent ones. We’d be glad to offer any type of assistance.
OEM & ODM HDI PCB Applications
PCBTok develops new wireless PCB with HDI that incorporates radio frequency circuitry and wireless technology. Drone PCBs can also be built by us.
For our company, HDI PCB for Telecommunication Applications is quite popular. As a PCBA fabricator, we can fully incorporate Integrated Chips.
Because electric and internal combustion engines rely on electronics, HDI types of PCB can be manufactured. They can be exclusively for specific models.
Multilayer HDI PCBs are commonly used for surgical equipment, lighting equipment, and other medical applications.
As a result of recent climate changes, there have been numerous modifications in Power Applications. For example, we now need to create eco-friendly power PCB components.
HDI PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
HDI PCB: The Ultimate FAQ Guide
For those who have never heard of HDI PCB, you might be interested in reading the Ultimate FAQ Guide to HDI PCB. Listed below are some of the most common questions you will need to ask yourself. Once you have answered these questions, you will be well on your way to understanding this technology. There are also some things to know before you begin. You should know that this technology is not for beginners and there are some common mistakes you should avoid.
If you need a flexible and rigid PCB, you’ve definitely heard of an HDI PCB, but what exactly is an HDI PCB? This sort of board is a combination of the two, and its production process is significantly simpler than that of other types of boards.
However, understanding the needs of your application is critical in order to select the optimal alternative. HDI PCBs are available in a variety of layouts and designs, and the design you select must match your needs as well as the needs of your product.
This type of PCB has numerous layers and requires stack-up. HDI PCBs are classified into two types: sequential and blind. The surface of the former can be patterned with various patterns to aid with the arrangement. The latter is a suitable alternative for signal routing because it reduces the size of the holes.
It is, however, less prevalent than the former. This is due to the fact that HDI PCBs require micro vias on both sides of the board.
The process of producing HDI PCBs begins with the selection of a pre-preg. After that, the layer is laminated. The hole is then mechanically or with a plate bored. The micro-vias assist in connecting the layers of the PCB. This also enables the traces and pads to be linked.
HDI PCB
The price of this technique is determined by the number of layers and materials used. If a high-density PCB is not required, a more standard PCB can be used.
If you’re not familiar with the terms used in the PCB industry, you may be wondering: What is HDI PCB stackup? Here are some of the most common definitions:
High-density insulated (HDI) PCBs are multilayer printed circuit boards. Each layer is made of a different material. A build-up HDI has sequential layers, while an any-layer HDI uses an every-layer interconnect. Sequential laminations are usually composed of copper-filled micro via structures and involve a core construction. High-pin-count devices often use any-layer HDI PCBs. The cost of an overall board is determined by the number of laminations.
A high-density HDI PCB has a track layout with a high-density configuration. It first emerged in the 1990s and quickly became a popular type of PCB. The technology behind HDI PCBs is advanced and is a common feature of smartphones and tablets. Wi-Fi modules and Bluetooth devices are other high-end PCBs that use HDI technology. Developed by IBM in 1989, the technology has become a common component in smartphones and tablets.
Just have a look at this video:
HDI PCBs use buried, micro vias, and blind vias. These types of vias can be staggered and are ideal for dense multilayer PCBs. Because of their thin-dielectric nature, HDI PCBs are often more expensive to manufacture. If you’re wondering: what is HDI PCB stackup?, let’s examine some examples of the different types of HDI PCBs.
What exactly is the HDI PCB layout? This design has numerous advantages. For starters, it is more efficient. A conventional PCB has fewer components per inch. Furthermore, HDI’s reduced footprint makes it easier to handle and more adaptable.
HDI layouts are often simple to utilize, so there’s no need to be intimidated. Here are some pointers to help you with HDI PCB designs.
The technique of constructing circuit boards with fine pitch components and higher component density is known as high-density integration (HDI). High-density traces are made using the same procedures as standard PCBs, but with greater attention to detail.
The cost is also affected by the number of layers and stackup height. Furthermore, to avoid oxidation, HDI PCBs may necessitate laser drilling of vias.
HDI type II permits buried vias or blind holes but require at least one through-hole. Type III necessitates buried vias but is not a coreless structure. It also supports PTH holes and ground planes. It’s vital to realize that the more holes a PCB require, the more expensive it is. When selecting an HDI PCB layout, speak with your engineer or designer to ensure the layout is appropriate for your needs.
What exactly is the HDI PCB layout? HDI circuit boards are typically four layers thick, and the manufacturing process is identical to that of traditional PCBs. The sequential drilling of buried holes in each layer is required for this design approach.
In addition, HDI necessitates a mechanical through-hole and a single-blind hole in each layer. These holes can be formed by HDI PCB manufacturers using laser technology. They can be constructed with as few as two holes or as many as four layers.
There’s one video:
You may be wondering, “What is HDI PCB manufacturing?” when looking for a company to create your next printed circuit board. After all, there are numerous steps involved in the development of this type of board.
There’s one standard HDI PCB manufacturing process flow:
Core board production→ Inspection→ Resin filling PTH holes→ Grinding→ Surface treatment→ Superimposing prepreg and RCC→ Laminating→ positioning, laser drilling→ Plating through holes→ Pattern transfer→ Developing→ Plating copper → Removing protective film→ Etching→AOI inspection→ Coating protective film selective plating→ CNC Routing→ Electrical testing→ Final inspection→ Packaging
AOI for HDI PCB
The more layers there are on a PCB, the more expensive it is. As a result, HDI PCB manufacturers will provide you with higher quality, reduced costs, and shorter turnaround times.
The HDI method employs a 2-n-2 arrangement, which is more complicated than 2-n-stacking. Because the final HDI PCB design is more complex than typical PCBs, it is critical that the design team knows the device and layout requirements before the manufacturing process begins.
The main difference in manufacturing between HDI board and standard PCB is the laser drilling and plugging with resin. Others are almost the same.
You’ve come to the right site if you’re seeking the greatest HDI PCB. Micro vias, via-in-pad technology, and adaptable routing are used on this type of PCB to deliver optimal performance and save costs. Because the board employs via-in-pad technology, all functionalities may be crammed into a single board, decreasing the number of components.
This sort of PCB is also exceptionally dependable, with stacked vias giving an extra layer of protection against harsh environments. It also has laser drilling, which makes smaller holes and enhances the board’s thermal qualities.
The cost of HDI PCBs might vary, and designers must consider their demands while selecting a layout. The final price is affected by the number of layers as well as the number of them.
Types of HDI PCB
The more layers you select, the more expensive the HDI PCB. A 2+N+2 layout is more expensive than a 1+N+1 layout, and adding layers considerably increases the cost. As a result, regardless of the complexity of your product, it is critical to select a layer count that is ideal for your purposes.
HDI PCBs serve two key functions: cost reduction and component reduction. Thinner lines and a tighter circular ring characterize a conventional HDI PCB. The laminated and mechanically drilled cores are available for the HDI Stackup. Creating a high-quality HDI PCB, the latter requires laser drilling. For smaller boards, however, an HDI PCB is not required.
When it comes to HDI PCB fabrication, you must select a manufacturer who will give you high-quality items. International certification is the first item to search for.
Because PCB products are primarily exported to other nations, the manufacturer must have all of the appropriate certifications. If a production company is registered, its inspection certificates will be displayed on its website.
To maintain precision and accuracy, HDI PCB production necessitates the use of specialized procedures and equipment. For HDI vias, for example, a laser is necessary and can only drill so far.
Multiple drilling operations or consecutive layer boding may be required for HDI boards. This might add time and money to the production process. As a result, it is critical to select a manufacturer that is capable of handling delicate details.
Make sure to conduct your research before purchasing HDI PCBs from China. You want to avoid scams and low-quality products, so buy from trusted companies.
They may be a little more expensive, but they will be worth it in the long term. Look for high-quality, safe products that are delivered on time. Then, double-check the price. Consider how much you’re willing to spend on your project before deciding on an HDI PCB maker.
How many layers will be required? The more layers there are, the greater the price.
HDI PCBs are often made up of many layers. The number of layers will be determined by the design’s intricacy and the overall performance of your product. A larger layer count may result in improved performance, but it also increases expenses and processing time.
PCBTok can produce up to 30-layer HDI boards. If you have the Gerber files, please send them to us. We can offer you one reasonable price.