PCBTok Makes Superior High-Frequency PCB
As a leading circuit board fabricator of High-Frequency PCB in China, we exceed the competition.
If you require a competitive provider of Rigid PCB, Rigid PCB with Flex components or high temperature (High TG) PCB. We duly guarantee:
- We make complex and simple circuit board orders quickly!
- An environmentally conscious Chinese company with global safety standards in place
- Our hardworking personnel handle your materials/orders with care
- Contact us right now and get a customer-friendly experience
High-Frequency PCB That Lasts
We can make the long-lasting high-frequency PCB you deserve.
We can speed up your High-Frequency board design if you have a Gerber file ready.
We may send you a weekly progress report if you want it done as part of your order.
This page contains details regarding the High-Frequency PCB, which we have provided for your review. We hope you find it useful, and we aim to assist you in discovering new features of about the PCB.
High-Frequency PCB By Feature
High-Frequency PCB By Material (6)
High-Frequency PCB By Color (6)
High-Frequency PCB Maximum Effect
Do you need multilayer High-Frequency boards that are both durable and appealing?
Then PCBTok can make PCBs for your organization using a variety of substrates that are commonly used in the 500MHz to 2GHz range.
If you require a customized/unique/extra-special PCB, simply let us know.
We can also create prototypes, loadboards, and one-of-a-kind PCBs without a hitch.
Any and all inquiries about our in-depth PCB capabilities are welcome.
PCBTok High-Frequency PCB Perks
Due to digital commerce, logistics sector activities, and worldwide industrialisation, the High-Frequency PCB is selling extremely well.
That is why you require a reliable source of this type of PCB for your organization to thrive.
PCBTok provides you with the best that money can buy without the headache of expensive brands.
Now is the best moment to order a PCB with exceptional high-frequency performance.
High-Frequency PCB Safety Assurance
We at PCBTok give you the best High-Frequency PCBs money can buy, but without the hassle of expensive brands.
- This business adheres to the RoHS regulations
- Strict Quality Control checks and processes
- Safe PCBs are ones that comply with ISO standards, such as ours
- We make certain that only IPC Class 2 and 3 products arrive at your address
Tell our helpful salespeople what High-Frequency PCB you want, and we’ll take care of it right away.
High-Frequency PCB Effectivity
We are always ready to collaborate with you utilizing the most advanced PCB software.
We can create commercial-grade PCBs thanks to our experience.
These High-Frequency PCBs will serve you well for a long time.
We are dedicated to ensuring that you earn maximum profit by using our products.
Because we only give genuine items, your High-Frequency PCBs will not fail during the critical moments when you need them the most.
Trust a brand leader—trust PCBTok.
High-Frequency PCB Fabrication
For your High-Frequency PCB, we’re excited to inform you that our Shenzhen Plant is equipped with the following machines:
- Cutting Machine
- Film Etching Machine
- Reflow Soldering machine
- Solder Paste Inspection (SPI) machine
- Soldermask Oven
- Wave Soldering machine
You can be assured that our manufacturing process is second to none.
High-frequency technology benefits mobile, communication, telecom infrastructure, and other digital communication applications.
As a result, Frequency PCB is becoming increasingly popular.
For PCB producers, this entails employing modern materials capable of meeting High-Frequency specifications.
These are graphics-oriented applications in technology, and HDI is a necessary complement to them. Contact PCBTok now for very dependable High-Frequency PCBs!
OEM & ODM High-Frequency PCB Applications
High-Frequency Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“The absence of good sense of communication is a fundamental disadvantage of internet enterprises. However, PCBTok employees are excellent at communicating with their consumers. They had the needed PCB part in stock and provided me with an estimate in a matter of minutes (sales staff had other customer service suggestions, so I had a lot of good useful info given to me that I did not know about). This is a recommended company from China.”Jonascz Trovic, Purchasing Manager from Poland
“These guys are incredible! I have a very special demand for a very unique PCB substrate. I contacted around a few places but received incredibly exorbitant quotes for just that type of HDI high frequency component. The salespeople were really knowledgeable! I was greeted pleasantly and informed of the procedure. I got my original requirement met, plus something more, for a fraction of the price of the other shop in my neighborhood. Thank you, PCBTok.”Mark Finn, PCB Assembler from Australia
“They go out of their way to understand your supply chain requirements. Their work is consistent and long-lasting. Strongly recommended! Their crew has over a decade of expertise, is quick, and knows what they’re doing. They are also, and maybe most significantly, honest and fair business people. This website named PCBTok comes highly commendable and memorable. I was very pleased for their prompt assistance, and I have no regrets with my first Chinese PCB purchases.”David Morison, Purchasing Agent from Northern Ireland
High-Frequency PCB – The Completed FAQ Guide
You may have many questions about high-frequency PCBs and the layout processes. A high-frequency PCB will typically have multiple layers, as will a reasonable design. A circuit can have as many as six layers or as few as two, depending on the circuit design and frequency. A middle layer is ideal for shielding and nearby ground implementation.
It has the ability to reduce parasitic inductance, shorten transmission time, and prevent cross-interference. Because high-frequency circuits must be reliable, selecting via structures wisely will assist you in designing and building a more reliable high-frequency circuit.
A high-frequency PCB is a type of printed circuit board used for signal transmission between two or more objects. These boards’ frequencies range from 500MHz to 2GHz, and their materials are appropriate for high-speed design applications. This PCB also includes laminates that aid in thermal heat transfer and improve board impedance. High-frequency PCBs, on the other hand, necessitates the use of specialized materials and processes.
To avoid potential problems, a high-frequency PCB requires specialized design techniques. A proper PCB design for a given application should be created, with a visual representation of subcircuits and documentation of the required voltage, power, and power planes. This design must also take into account different signals, trace length, and controlled impedance.
All of these factors must be considered for high-frequency PCBs, and the manufacturer will be able to advise on any additional PCB design requirements.
High-Frequency PCB Sample
A high-frequency PCB is a very costly and complex design. It necessitates the use of specialized materials and processes, making it more expensive than standard PCBs. It is critical to select a manufacturer capable of producing high-frequency PCBs. However, the process’s cost may be well worth the effort. However, it is critical to consider the quantity of high-frequency PCB needed for your project as well as international standards.
To ensure signal integrity, a high-frequency PCB should include a high-frequency choke link. This part is typically made of high-frequency ferrite beads with wires running through the center hole. Those interested in designing a high-frequency PCB should consider its dielectric constant. A material’s ability to store and transmit electrical energy is measured by its dielectric constant.
When selecting a material for your high-frequency PCB, keep thermal conductivity in mind. The thermal conductivity of standard PCB materials is 0.25 W/mK or less, and some materials are not suitable for high-frequency circuits.
Ceramic-filled high-frequency materials may be a better choice for these applications. These materials have excellent thermal management and can solve thermal problems in high-power PCB designs.
Another important factor to consider is signal performance. Signal loss becomes an issue as the frequency of the transmission line increases. Lower dissipation factors can be achieved with PTFE or enhanced epoxy materials. Dimensional stability is another important consideration in high-frequency designs. Thermoset hydrocarbon laminate materials are frequently an excellent choice. Look for materials with a low TCDK value for this application.
High-Frequency PCB Substrates
Engineers frequently fail to consider the physical limitations of circuit boards. This is especially important when designing high-frequency PCBs. High temperatures can compromise the mechanical stability of FR-4 materials, but thermoset hydrocarbon laminate offers the highest level of thermal stability and can withstand high temperatures. FR-4 can be used in hybrid construction depending on your needs. Check out PCBTok’s high-frequency circuit materials if you need a high-frequency PCB.
It is critical to consider temperature, environment, and signal speeds when designing a high-frequency PCB. Several newer substrates are more effective than FR-4 and can be used in place of it. When these materials are combined, the overall loss is reduced. If you want to save money, you can go with a hybrid design. This design typically makes use of both high-speed materials and FR-4.
The excellent thermal robustness of high-frequency PCBs is one of their most important properties. The coefficient of thermal expansion (CTE) describes how the size of a printed circuit board (PCB) changes with temperature.
High-frequency PCBs have excellent CTE and are ideal for use in temperature-varying applications. They are also resistant to corrosion and chemical attacks. As a result, they are a great choice for a wide range of electronic applications.
Properties of High-Frequency PCB
Many different materials are used in the production of high-frequency PCBs. The primary material is FR-4, which has high-frequency properties. Pure polytetrafluoroethylene (PTFE), ceramic-filled PTFE, and hydrocarbon ceramic are some other low-loss RF materials.
High-temperature thermoplastic (HTTP) materials are also used to make low-loss high-frequency PCBs. The loss factor of high-frequency PCBs is affected by several factors, including the type of laminate, surface contaminants, and the board’s hygroscopic nature. High-frequency PCBs generate a lot of heat, and their manufacturing temperatures are frequently higher than standard soldering temperatures.
The loss tangent is a critical property of high-frequency PCBs. It is caused by a change in the PCB material’s molecular structure. If the dielectric constant of a high-frequency PCB is too low, the signal will be absorbed and distorted, resulting in frequency drift, stop vibration, and poor electrical performance. The board should eventually be able to sustain a high-frequency signal.
Several factors must be considered when designing high-frequency PCBs. Circuitry, for example, must be capable of reducing electromagnetic interference. It is critical that parallel lines in the same layer remain perpendicular to their neighbors. Furthermore, high-frequency circuits frequently have dense wiring. If you intend to use such PCBs, consider using a multilayer board.
Furthermore, avoid putting components or vias between differential pairs. This will cause EMC issues as well as large discontinuities in the impedance. Furthermore, instead of 0603 capacitors, use symmetrical arrangements, which are less likely to produce large transients. Finally, large traces should be avoided because they increase capacitive crosstalk.
There’s one video about high-frequency PCB design:
The first step in designing high-speed PCBs is to determine the best ground plane. The ground plane should go beneath the signal layers. Furthermore, it should not be too far away from the signal layers. Signals will not reach the ground plane if the PCBs are too far away from the signal layer. It would be easier to identify the ground plane if the PCBs had ground planes.
Another step is to select a pad size. Many high-frequency designs require precise PCB footprints and pad sizes. Before you place the components, you should decide on these requirements. Changing the pad size after the board has been assembled could be costly. In this case, the only option would be to redesign the PCB. As a result, you should select the best PCB for your needs and budget.
If you’ve ever wondered what goes into making high-frequency PCBs, you’ve come to the right place. There are several steps involved in the production of these circuit boards. You design your circuit board first, and then use software to encode the information on it. Extended Gerber software is commonly used to create high-frequency circuit boards.
High-Frequency PCB Manufacturing Process
The board’s surface must then be prepared. Surface preparation is required for high-frequency PCBs in order for the layers to firmly bond to each other. Different substrates are prone to expansion and contraction, which can impact signal transmission quality. Then you must select the material that is best suited to this application. Many resin manufacturers employ materials with comparable CTE and Tg, ensuring that the layers contract and expand at the same rate.
Once you’ve completed your design, you must document the requirements. High-frequency circuit boards are typically made of four or six layers of FR-4. Plated-through holes connect the tracks on the first layer to the tracks on the next layer. If the structure is more complex, blind or buried vias can be used. Drilling vias improves layer connections, which is an important aspect of High-Frequency PCB fabrication.
Special materials are required for high-frequency PCBs. Depending on the signal speed, environment, and substrate, the substrate material will differ. While FR-4 is still the most commonly used substrate material, newer-generation materials outperform it. Panasonic produces Megtron materials, while Rogers produces Isola. The latter material has lower losses and higher temperatures than the first two. These substrates are more expensive, but they perform better electrically and thermally.