PCBTok Makes Superior High-Frequency PCB

As a leading circuit board fabricator of High-Frequency PCB in China, we exceed the competition.

If you require a competitive provider of Rigid PCB, Rigid PCB with Flex components or high temperature (High TG) PCB. We duly guarantee:

  • We make complex and simple circuit board orders quickly!
  • An environmentally conscious Chinese company with global safety standards in place
  • Our hardworking personnel handle your materials/orders with care
  • Contact us right now and get a customer-friendly experience
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High-Frequency PCB That Lasts

We can make the long-lasting high-frequency PCB you deserve.

As an OEM manufacturer or EMS supplier, we create PCBs to your stringent requirements. We can work with your design or modify your specs.

We can speed up your High-Frequency board design if you have a Gerber file ready.

We may send you a weekly progress report if you want it done as part of your order.

This page contains details regarding the High-Frequency PCB, which we have provided for your review. We hope you find it useful, and we aim to assist you in discovering new features of about the PCB.

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High-Frequency PCB By Feature

Multilayer High-Frequency PCB

Multilayer PCB, which ranges from 4 to 40 layers, is an extremely useful device. Because these are often High TG boards, any layer of this PCB can be used rigorously.

Embedded High-Frequency PCB

Customers admire the Embedded PCB because of its applicability. Embedded PCBs, which conserve space, have become more popular as the size of digital devices has shrunk.

Panelized High-Frequency PCB

V-cut or V-scored PCB are synonyms for panelized High-Frequency PCB. A large number of PCBs are panelized to save the customer money and time. Single-sided PCBs use a lot of panelization, and so do double-sided PCBs and rush-order kinds of PCBs.

Lead-Free High-Frequency PCB

When it comes to surface finish PCB, Lead-free PCB is widely acknowledged as the standard for EU countries. Lead-free HASL PCBs are available, or we can combine lead-free and halogen-free.

High Tg High-Frequency PCB

As a PCB expert, PCBTok can create High Tg PCBs using world-class materials including Isola 370HR, R-F775, and RO4450f. The purchase of thermally efficient products guarantees superior performance in aeronautics, mmWave, etc.

RF High-Frequency PCB

The RF PCB is commonly utilized in RF technologies such as RFID antennas and RFID transponders. RFID PCBs frequently include an RFID sticker, this makes the RF technology convenient for consumers. PET transparent film is key.

High-Frequency PCB By Material (6)

  • Rogers High-Frequency PCB

    Rogers PCB is a trustworthy source of advanced material. Depending on your device’s needs, you can specify a laminate thickness of 0.25 to 2 oz. We can develop Metal Core Rogers PCB.

  • Arlon High-Frequency PCB

    Arlon PCB is a popular product from Arlon, one of the most trusted names in prepreg and laminates. You require a high-performance PCB component from PCBTok that can enable energy efficiency.

  • Kingboard High-Frequency PCB

    The Kingboard PCB is created with materials by Kingboard Corp. We manufacture high-end, high-functioning circuit boards with this material.

  • NanYa High-Frequency PCB

    The NanYa PCB is utilized for devices that require microcontrollers, semiconductor business, or IC boards, with the purpose of reducing signal loss and maximizing signal integrity.

  • Taconic High-Frequency PCB

    Taconic materials are used to make Taconic high-frequency PCBs, HDI PCBs, and those with extreme thermal functions. They produce Copper Clad Taconic PCBs and other high-layer-count PCB materials with ease.

  • FR4 High-Frequency PCB

    We offer FR4 High-Frequency PCB, which is a multifunctional product with many lines. FR4 material providers of all kinds provide high-frequency materials. Panasonic, for example, specializes in high-performance laminates.

High-Frequency PCB By Color (6)

  • Orange High-Frequency PCB

    Customers that desire a brilliant color look can have the soldermask customized in the orange color. Furthermore, we guarantee that a variety of Orange High-Frequency PCBs are Halogen-Free/ Lead-Free and safe.

  • Green High Frequency PCB

    Green high-frequency PCB, particularly rigid-flex PCB, can be employed in medical devices. This level of space efficiency would be required with FPC, especially in applications requiring great precision.

  • Blue High-Frequency PCB

    When you need to connect numerous locations together, the Blue High-Frequency PCB comes in handy. With soldermask selection, it can be made blue rather than green. This color can also be used on extra thick PCBs.

  • Black High-Frequency PCB

    There are numerous similarities between black PCB, green PCB, and red PCB, which are all circuit boards that can be utilized in similar applications. The board’s functionality determines suitability of the color.

  • Red High-Frequency PCB

    Because of their low failure rate, our good Red PCB are important for sensitive PCB materials. Many forms of rigid-flex PCBs, including those with FR4 and FR5 substrates, are in stock.

  • Customized High-Frequency PCB

    The woven glass reinforced material is also used on the Customized PCB. You will get outstanding heat resistance and reliable performance if you get this from us.

High-Frequency PCB Maximum Effect

Do you need multilayer High-Frequency boards that are both durable and appealing?

Then PCBTok can make PCBs for your organization using a variety of substrates that are commonly used in the 500MHz to 2GHz range.

If you require a customized/unique/extra-special PCB, simply let us know.

We can also create prototypes, loadboards, and one-of-a-kind PCBs without a hitch.

Any and all inquiries about our in-depth PCB capabilities are welcome.

High-Frequency PCB Maximum Effect
PCBTok High-Frequency PCB Perks

PCBTok High-Frequency PCB Perks

Due to digital commerce, logistics sector activities, and worldwide industrialisation, the High-Frequency PCB is selling extremely well.

That is why you require a reliable source of this type of PCB for your organization to thrive.

PCBTok provides you with the best that money can buy without the headache of expensive brands.

Now is the best moment to order a PCB with exceptional high-frequency performance.

High-Frequency PCB Safety Assurance

We at PCBTok give you the best High-Frequency PCBs money can buy, but without the hassle of expensive brands.

  • This business adheres to the RoHS regulations
  • Strict Quality Control checks and processes
  • Safe PCBs are ones that comply with ISO standards, such as ours
  • We make certain that only IPC Class 2 and 3 products arrive at your address

Tell our helpful salespeople what High-Frequency PCB you want, and we’ll take care of it right away.

High-Frequency PCB Safety Assurance

High-Frequency PCB Effectivity

High-Frequency PCB Effectivity 2
High-Frequency PCB Effectivity 2

We are always ready to collaborate with you utilizing the most advanced PCB software.

We can create commercial-grade PCBs thanks to our experience.

These High-Frequency PCBs will serve you well for a long time.

We are dedicated to ensuring that you earn maximum profit by using our products.

Because we only give genuine items, your High-Frequency PCBs will not fail during the critical moments when you need them the most.

Trust a brand leader—trust PCBTok.

High-Frequency PCB Fabrication

High-Frequency PCB Equipment

For your High-Frequency PCB, we’re excited to inform you that our Shenzhen Plant is equipped with the following machines:

  • Cutting Machine
  • Film Etching Machine
  • Reflow Soldering machine
  • Solder Paste Inspection (SPI) machine
  • Soldermask Oven
  • Wave Soldering machine

You can be assured that our manufacturing process is second to none.

Strong & Reliable Materials

High-frequency technology benefits mobile, communication, telecom infrastructure, and other digital communication applications.

As a result, Frequency PCB is becoming increasingly popular.

For PCB producers, this entails employing modern materials capable of meeting High-Frequency specifications.

These are graphics-oriented applications in technology, and HDI is a necessary complement to them. Contact PCBTok now for very dependable High-Frequency PCBs!

OEM & ODM High-Frequency PCB Applications

High-Frequency PCB for Semiconductor Industry

Semiconductor businesses are one of PCBTok’s most important business partners. We support them in the availability of transistors, Systems on a Chip (SOCs), and Integrated Circuits (ICs) with our High-Frequency PCBs.

High-Frequency PCB for Industrial Use

Because high-speed wireless connections function substantially faster when implanted with High-Frequency PCB. This type of PCB dominates in industrial applications such as communications infrastructure e.g. WAN or LAN.

High-Frequency PCB for Mobile and Telecom Applications

Low signal loss and lower Dk make High-Frequency PCB ideal for Mobile and Telecom applications. These PCBs are routinely used in smartphones, tablets, and telecom equipment for wide area networks.

High-Frequency PCB for Microwave (1 GHz to 1000 GHz) Applications

Ceramic PBCs are beneficial to microwave components. As a result, ceramic/Teflon materials are frequently used in High-Frequency PCBS. We manufacture predominantly microwave-categorized Aerospace PCBs.

High-Frequency PCB for Digital Consumer Products

LIDAR, which is a laser-based tech used in automotive navigation systems, is an example of a digital consumer-targeted High-Frequency PCB.

High-Frequency PCB for banner 2
Dependable Value: PCBTok High-Frequency PCB

Our customers keep coming back, so you know it’s a fact:

Our High-Frequency PCBs operate exceptionally well.

High-Frequency Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

Quick Quote
  • “The absence of good sense of communication is a fundamental disadvantage of internet enterprises. However, PCBTok employees are excellent at communicating with their consumers. They had the needed PCB part in stock and provided me with an estimate in a matter of minutes (sales staff had other customer service suggestions, so I had a lot of good useful info given to me that I did not know about). This is a recommended company from China.”

    Jonascz Trovic, Purchasing Manager from Poland
  • “These guys are incredible! I have a very special demand for a very unique PCB substrate. I contacted around a few places but received incredibly exorbitant quotes for just that type of HDI high frequency component. The salespeople were really knowledgeable! I was greeted pleasantly and informed of the procedure. I got my original requirement met, plus something more, for a fraction of the price of the other shop in my neighborhood. Thank you, PCBTok.”

    Mark Finn, PCB Assembler from Australia
  • “They go out of their way to understand your supply chain requirements. Their work is consistent and long-lasting. Strongly recommended! Their crew has over a decade of expertise, is quick, and knows what they’re doing. They are also, and maybe most significantly, honest and fair business people. This website named PCBTok comes highly commendable and memorable. I was very pleased for their prompt assistance, and I have no regrets with my first Chinese PCB purchases.”

    David Morison, Purchasing Agent from Northern Ireland

High-Frequency PCB – The Completed FAQ Guide

You may have many questions about high-frequency PCBs and the layout processes. A high-frequency PCB will typically have multiple layers, as will a reasonable design. A circuit can have as many as six layers or as few as two, depending on the circuit design and frequency. A middle layer is ideal for shielding and nearby ground implementation.

It has the ability to reduce parasitic inductance, shorten transmission time, and prevent cross-interference. Because high-frequency circuits must be reliable, selecting via structures wisely will assist you in designing and building a more reliable high-frequency circuit.

What Is High-Frequency PCB?

A high-frequency PCB is a type of printed circuit board used for signal transmission between two or more objects. These boards’ frequencies range from 500MHz to 2GHz, and their materials are appropriate for high-speed design applications. This PCB also includes laminates that aid in thermal heat transfer and improve board impedance. High-frequency PCBs, on the other hand, necessitates the use of specialized materials and processes.

To avoid potential problems, a high-frequency PCB requires specialized design techniques. A proper PCB design for a given application should be created, with a visual representation of subcircuits and documentation of the required voltage, power, and power planes. This design must also take into account different signals, trace length, and controlled impedance.

All of these factors must be considered for high-frequency PCBs, and the manufacturer will be able to advise on any additional PCB design requirements.

High-Frequency PCB Sample

High-Frequency PCB Sample

A high-frequency PCB is a very costly and complex design. It necessitates the use of specialized materials and processes, making it more expensive than standard PCBs. It is critical to select a manufacturer capable of producing high-frequency PCBs. However, the process’s cost may be well worth the effort. However, it is critical to consider the quantity of high-frequency PCB needed for your project as well as international standards.

To ensure signal integrity, a high-frequency PCB should include a high-frequency choke link. This part is typically made of high-frequency ferrite beads with wires running through the center hole. Those interested in designing a high-frequency PCB should consider its dielectric constant. A material’s ability to store and transmit electrical energy is measured by its dielectric constant.

Which Material is Best for High-Frequency PCB?

When selecting a material for your high-frequency PCB, keep thermal conductivity in mind. The thermal conductivity of standard PCB materials is 0.25 W/mK or less, and some materials are not suitable for high-frequency circuits.

Ceramic-filled high-frequency materials may be a better choice for these applications. These materials have excellent thermal management and can solve thermal problems in high-power PCB designs.

Another important factor to consider is signal performance. Signal loss becomes an issue as the frequency of the transmission line increases. Lower dissipation factors can be achieved with PTFE or enhanced epoxy materials. Dimensional stability is another important consideration in high-frequency designs. Thermoset hydrocarbon laminate materials are frequently an excellent choice. Look for materials with a low TCDK value for this application.

High-Frequency PCB Substrates

High-Frequency PCB Substrates

Engineers frequently fail to consider the physical limitations of circuit boards. This is especially important when designing high-frequency PCBs. High temperatures can compromise the mechanical stability of FR-4 materials, but thermoset hydrocarbon laminate offers the highest level of thermal stability and can withstand high temperatures. FR-4 can be used in hybrid construction depending on your needs. Check out PCBTok’s high-frequency circuit materials if you need a high-frequency PCB.

It is critical to consider temperature, environment, and signal speeds when designing a high-frequency PCB. Several newer substrates are more effective than FR-4 and can be used in place of it. When these materials are combined, the overall loss is reduced. If you want to save money, you can go with a hybrid design. This design typically makes use of both high-speed materials and FR-4.

What Are the Properties of High-Frequency PCB?

The excellent thermal robustness of high-frequency PCBs is one of their most important properties. The coefficient of thermal expansion (CTE) describes how the size of a printed circuit board (PCB) changes with temperature.

High-frequency PCBs have excellent CTE and are ideal for use in temperature-varying applications. They are also resistant to corrosion and chemical attacks. As a result, they are a great choice for a wide range of electronic applications.

Properties of High-Frequency PCB

Properties of High-Frequency PCB

Many different materials are used in the production of high-frequency PCBs. The primary material is FR-4, which has high-frequency properties. Pure polytetrafluoroethylene (PTFE), ceramic-filled PTFE, and hydrocarbon ceramic are some other low-loss RF materials.

High-temperature thermoplastic (HTTP) materials are also used to make low-loss high-frequency PCBs. The loss factor of high-frequency PCBs is affected by several factors, including the type of laminate, surface contaminants, and the board’s hygroscopic nature. High-frequency PCBs generate a lot of heat, and their manufacturing temperatures are frequently higher than standard soldering temperatures.

The loss tangent is a critical property of high-frequency PCBs. It is caused by a change in the PCB material’s molecular structure. If the dielectric constant of a high-frequency PCB is too low, the signal will be absorbed and distorted, resulting in frequency drift, stop vibration, and poor electrical performance. The board should eventually be able to sustain a high-frequency signal.

What Are the Guidelines for Designing High-Frequency PCB?

Several factors must be considered when designing high-frequency PCBs. Circuitry, for example, must be capable of reducing electromagnetic interference. It is critical that parallel lines in the same layer remain perpendicular to their neighbors. Furthermore, high-frequency circuits frequently have dense wiring. If you intend to use such PCBs, consider using a multilayer board.

Furthermore, avoid putting components or vias between differential pairs. This will cause EMC issues as well as large discontinuities in the impedance. Furthermore, instead of 0603 capacitors, use symmetrical arrangements, which are less likely to produce large transients. Finally, large traces should be avoided because they increase capacitive crosstalk.

There’s one video about high-frequency PCB design:

The first step in designing high-speed PCBs is to determine the best ground plane. The ground plane should go beneath the signal layers. Furthermore, it should not be too far away from the signal layers. Signals will not reach the ground plane if the PCBs are too far away from the signal layer. It would be easier to identify the ground plane if the PCBs had ground planes.

Another step is to select a pad size. Many high-frequency designs require precise PCB footprints and pad sizes. Before you place the components, you should decide on these requirements. Changing the pad size after the board has been assembled could be costly. In this case, the only option would be to redesign the PCB. As a result, you should select the best PCB for your needs and budget.

What Is the Fabrication Process for High-Frequency PCB?

If you’ve ever wondered what goes into making high-frequency PCBs, you’ve come to the right place. There are several steps involved in the production of these circuit boards. You design your circuit board first, and then use software to encode the information on it. Extended Gerber software is commonly used to create high-frequency circuit boards.

High-Frequency PCB Manufacturing Process

High-Frequency PCB Manufacturing Process

The board’s surface must then be prepared. Surface preparation is required for high-frequency PCBs in order for the layers to firmly bond to each other. Different substrates are prone to expansion and contraction, which can impact signal transmission quality. Then you must select the material that is best suited to this application. Many resin manufacturers employ materials with comparable CTE and Tg, ensuring that the layers contract and expand at the same rate.

Once you’ve completed your design, you must document the requirements. High-frequency circuit boards are typically made of four or six layers of FR-4. Plated-through holes connect the tracks on the first layer to the tracks on the next layer. If the structure is more complex, blind or buried vias can be used. Drilling vias improves layer connections, which is an important aspect of High-Frequency PCB fabrication.

Special materials are required for high-frequency PCBs. Depending on the signal speed, environment, and substrate, the substrate material will differ. While FR-4 is still the most commonly used substrate material, newer-generation materials outperform it. Panasonic produces Megtron materials, while Rogers produces Isola. The latter material has lower losses and higher temperatures than the first two. These substrates are more expensive, but they perform better electrically and thermally.

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