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The Rank of PCBTok’s High Power PCB in Electronics Industry
PCBTok has been ranked as one of the leading manufacturers of High Power PCB and components over the past few years. The company has been providing high quality products at competitive prices for many years.
- 24h quick-turn service for your prototype PCB
- Offer COC report, micro-section, and soldering sample for your order
- Attending the trade shows such as Electronica Munich and PCBWest
- Over 500 workers in our facility
PCBTok’s Exceptional High Power PCB
PCBTok is a high-power PCB manufacturer. Offers exceptional high-power PCB solutions, thanks to our advanced manufacturing process. We provide power solutions for your business in the form of PCBs, offering superior quality and reliability.
Our exceptional high-power PCBs are designed to meet the needs of your business. Our products can be used in a wide range of applications, including renewable energy, LED lighting, and more.
We have extensive experience in the design and manufacturing process for high-power PCBs, which means we know how to get them right. We have an experienced team that understands what it takes to make sure that our clients get exactly what they need from us.
PCBTok is a high-power PCB manufacturer that has been in business for over 10 years. We are committed to providing our customers with exceptional quality, exceptional customer service, and exceptional delivery time.
High Power PCB By Type
The single-sided high-power PCB is an innovative product that has been designed for the purpose of providing the best possible experience to our customers.
This board is made out of high quality materials, which makes it durable and resistant to wear and tear. You will be able to use this board for many years without any problems.
Multilayer high power PCBs are designed to meet the requirements of high power applications. They can be used in commercial, industrial and military applications.
It has high power density and low profile, which makes it ideal for handheld devices such as smartphones and tablets. Allows you to design a circuit board that can be bent or curved.
It is used in high power applications such as power supplies and high-power amplifiers. Rigid High Power PCB is thick, which ensures that the PCB can withstand higher voltages.
A printed circuit board that can be used for high-power electronics, such as those found in power supplies, switching power supplies, and medical equipment.
High Power PCB by Feature (5)
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Utilizes non-halogenated flame retardants in its design. Halogen-free high power PCB’s characteristics of high power, low resistance, high temperature, good thermal conductivity, small size and light weight
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The board has been designed to be used with a high voltage power supply, which will be used to power various electronic components. This will increase the efficiency of the product and reduce costs.
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It has excellent high temperature resistance, low thermal expansion coefficient and good mechanical strength. The electrical performance of the lead-free high power PCB is more stable than that of the traditional one.
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A heavy copper high power PCB has a thick layer of copper and is used to conduct high power. It is mainly used for high frequency operation, for example, in the automotive industry.
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PCB for prototypes and other projects that require high power connections. Can be used for testing and development of prototype circuits in applications such as power amplifiers, power supplies, etc.
High Power PCB by Use (5)
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This is a High power PCB for LED lighting. It is a perfect choice for your LED lighting product. This PCB can be used with many kinds of LEDs and provides a stable current to the LEDs.
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This is a high power PCB for IGBT Control Board. The control board has been designed to be used in the high power applications of DC-DC converters and battery chargers
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Our high power PCB for electric cigarette provides the power that you need to get the most out of your e-cigarette. Will work with almost any type of e-cigarette.
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High power PCB for Amplifier is specially designed to meet the needs of the audio equipment, and it is widely used in the amplifier circuit. It has a high performance, good reliability, and long service life.
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Made from top-quality components and materials, and it is built to last. Can be used in a variety of applications both commercial and industrial purposes.
High Power PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Fast Facts About PCBTok’s High Power PCB
PCBTok is a high power PCB developer that has been in business since 2010. They specialize in developing high-power circuit boards that can withstand harsh conditions like heat and humidity. They also develop low-noise, high-speed PCBs for sound systems, as well as other customizations for different industries.
PCBTok’s High Power PCB is a high-quality board with a wide range of applications. It can be used to power up all kinds of electronics, and it works well with both AC and DC power sources. The PCB is made from copper-clad laminate, which provides superior conductivity and heat dissipation. It’s also durable enough to handle being transported from one place to another and even being dropped occasionally.
Is It Really Worth to Buy PCBTok’s High Power PCB?
When you are looking at buying PCBTok’s high power PCB, you might be wondering if it is really worth it.
The good news is that the answer is yes!
There are so many reasons why you should buy PCBTok’s high power PCB that we don’t know where to start.
We will begin with quality, as this is one of the most important aspects when it comes to buying any product. The great thing about quality is that it lasts a long time so you can count on it for years to come.
When you buy PCBTok’s high power PCB, and something goes wrong with your order, or if there are any issues with the product itself, then you can send it back without paying anything extra than what was originally paid for delivery and return shipping costs.
Which High Power PCB is Right for You?
The answer to this question may seem simple, but there are many factors that go into deciding which high power PCB is right for you.
First and foremost, you should consider what your goal is with the high power PCB. If you need it to be able to handle more current, then a higher-power board will be better suited for your needs. However, if you’re looking for something that can handle more voltage, then you might want to consider a different type of board.
Another factor to consider is how much space you have available in your project. The larger the area that needs to be covered by the PCB, the larger the board will need to be in order to accommodate everything properly. For example: if your system requires a lot of surface area and only has room for one layer of components, then using a four-layer board would make sense; however, if the system only uses one layer and has plenty of room inside then using an eight-layer board would make more sense because there’d be no reason not to use all eight layers!
PCBTok: Things We Learned from Manufacturing High Power PCBs
If you’re looking to make a PCB that can handle high power, there are a few things you need to consider.
First, your circuit design must be able to handle the high voltage. If the voltage is too low, then your board will not function properly and may cause permanent damage to your hardware.
Second, make sure that the heat sinks on your board are large enough for the amount of power being dissipated by the chips on it. If there isn’t enough surface area for heat transfer, then your board will overheat and fail prematurely.
Thirdly, make sure that you are using proper insulation for any wires or connectors attached to your board so as not to cause a short circuit.
High Power PCB Fabrication
If you’re looking for a high power PCB, you’ve come to the right place.
Here at PCBTok, we’ve got all the information you need to find the perfect high power PCB for your application.
A high power PCB is an electronic device that converts electrical energy into direct current (DC) or alternating current (AC). It’s made from multiple layers of conducting material, such as copper and aluminum, which are insulated from one another by an insulator like plastic or glass. A high power PCB is typically used in industrial applications like manufacturing plants, where it helps machines run more efficiently.
PCBTok is the ultimate company for high power PCB needs. We provide services that include designing, prototyping, and manufacturing PCBs. Our services are customized to meet your requirements. We offer our clients with a wide range of PCBs which include RF, Power Distribution and Control, Power Management and High Current/High Voltage.
Our team of professionals is highly experienced in the field and is always ready to assist you with any queries or concerns you may have regarding your project. We have gained extensive expertise by working with a variety of clients from different industries such as automotive, telecom, medical, military and aerospace among other.
OEM & ODM High Power PCB Applications
Our High Power PCB for Solar Power Distribution is designed to maximize the efficiency of solar panels, allowing your power supply to run at peak performance.
High power PCBs are used in military applications and other demanding environments where high voltage and high current must be maintained.
High Power PCB for Industrial Applications are designed to handle the high current requirements of this application. Resistant to heat and corrosion.
Power distribution in aerospace industry is a critical factor to consider. It can be used to develop high power PCB that can withstand the extreme environment of space.
The high power PCBs are used in satellites due to their high reliability and high performance. The high power PCBs are used in satellites due to their high reliability and high performance.
High Power PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
High Power PCB – The Ultimate FAQ Guide
There are many questions that must be addressed when designing a high-power PCB. First, where should the components be placed? Components should be placed near the edge of the board so that they can efficiently conduct heat from the board to the surrounding air. This allows the heat to be distributed throughout the board while keeping critical components safe. The next question is, “What is the best thermal management technique?”
Copper bus bars allow you to carry more current. These busbars are typically thicker than standard traces, which allows them to carry more current. They are also the same width as the board’s alignments. These busbars have the greatest carrying capacity, but they may not be as thin as you need them to be. In addition, they can be used for high-current devices such as electric vehicles.
The thickness of the copper depends on the type of copper used in the PCB. The thickness of copper is usually measured in ounces per square foot. On the other hand, high-power PCBs may require 2 or 3 ounces of copper per square foot, which is equivalent to a thickness of 35 micrometers. The soldermask layer is responsible for the green color of the PCB. It also acts as an insulator between copper traces, preventing solder jumps.
Finally, power generation circuits should be kept away from sensitive circuits to avoid PCB warpage or overheating. In addition, it is critical to evenly distribute heat-generating components in order to maximize thermal balance and protect sensitive circuits and signals during operation. Both passive and active components generate heat, and this heat must be properly dissipated into the ambient air for maximum efficiency.