PCBTok is Your Notable High TG PCB Manufacturer
It has always been the goal of PCBTok to produce an exquisite High TG PCB that no other Chinese manufacturer can surpass; thus PCBTok is renowned for its appreciation towards their customers. Your inputs are always appreciated!
- PCB manufacturing expertise of over 12 years.
- Within 1-2 hours, technical queries will be sent.
- Sales and engineering technological assistance accessible 24/7.
- E-testing and AOI examination at 100%.
- Every PCB is IPC Class 2 or 3 compliant.
High TG PCB by PCBTok is Tried and Tested
The High TG PCB from PCBTok is constructed with high-quality materials and is meticulously treated throughout the production process. Nevertheless, we always will ensure that it is within your budget; a high-quality High TG PCB item, and exceptional service.
PCBTok guarantees that all of your items will arrive in perfect working order and that you will have a satisfactory experience with us.
Contact us today to place your first PCB purchase!
PCBTok’s capability to provide High TG PCB to our clientele has gained us a lot of recognition. Talk to us if you have any proposals; we’ll sort it out!
High TG PCB By Feature
The FR-4 is an epoxy fiberglass product category. While the TG130 pertains to the transition temperature of the glass, this indication will begin to distort at 130°C. The key materials in this PCB are pre-preg and core.
According to the established regulation, the greater the TG figure, the more reliable it is during the production and constructing process. Additionally, the typical TG midpoint is higher than the range of 150°C-160°C.
FR4 High TG170 PCBs can sustain distortion at temperatures reaching as 170°C; suitable for high-temperature applications. Thanks to excellent PCB services, FR4 pieces with greater thermal treatment are now feasible.
The Nelco N4000-6 is the most widely used component for High FR4 TG175 PCBs; it combines prepreg technology with a high-TG epoxy composite to provide a mix of performance efficiency and productivity gains for a wide range of demanding applications.
PCBTok produces High TG PCBs with temperatures ranging from 180°C. Generally speaking, the High TG180 PCB is ITEQ 180 and 370HR; if the purpose requires high-class components, use ITEQ IT180A (TG180), which is also RoHS accredited.
If you’re seeking a type of High TG PCB that’s compatible with high operations, it is advisable to utilize the PTFE PCB 280. The electrical characteristics of PTFE materials are ideal for getting over the slightly elevated restrictions of FR4.
High TG PCB By Materials (6)
High TG PCB By Types (6)
High TG PCB Benefits

PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.

PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.

We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.

PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
High TG PCB Properties
The following information will provide you with insights into what PCBTok has to offer in terms of High TG PCBs; if you require any additional bespoke specs, feel free to contact us!
- Copper, FR4, Aluminum, Halogen-Free Material, and CEM-3 are some of the base materials used.
- Copper thicknesses range from 0.3 to 6 ounces.
- HASL, Lead-Free HASL, OSP, and ENIG; surface finishes offered.
- CNC Routing, V-Cutting, Stamping, and Beveling; for the V-Cut process.
Get in touch with us with any concerns or queries. We have a team of experienced specialists ready to assist you!

PCBTok High TG PCB Production
We can help you with High TG PCB layouts since we have all of the necessary materials and expert personnel to help you. We also have PCB engineers with several years of experience in this area. As a result, you may rest assured that your ideas will be implemented.
We offer complete PCB assembly services, so you won’t have to worry if you might not have a Gerber file. We’ll gladly assist you in putting one together.
We have adequate supplies to ensure that the distribution system is not affected something which no businessman wants.
PCBTok: Reliable High TG PCB Maker
The High TG PCB from PCBTok is created with genuine components, has passed rigorous certification tests, and is treated with care. We’re doing this to ensure that you can maximize the value of your money.
For global firms functioning on various continents, PCBTok is a reputable provider. As a result, we endeavor to provide you with a PCB that is precisely tailored to your requirements; we embrace your thoughts and ideas.
We have qualified and experienced staffs that could assist you with your High TG PCB.
Kindly contact us straight away!

Opt for PCBTok’s First-Rate High TG PCB


If you’re seeking the most trusted PCB manufacturer in China, look no further. We are fully accredited to ISO9001, ISO14001, RoHS, REACH, and UL. Additionally, we have an adequate team to assist you and ensure that each phase meets your requirements.
Our mission has always been to offer you with the greatest High TG PCBs and superior customer satisfaction.
Should you require assistance with your High TG PCB prototype, we have a bunch of highly competent engineers ready.
Build your own High TG PCB with us right away!
High TG PCB Fabrication
Are you looking for a high-performance High-TG PCB?
Generally speaking, PCBTok can supply you with High TG PCBs that have undergone a rigorous quality control procedure.
As a reputable OEM manufacturer in China, we can develop 10 to 40-layer PCBs to your specifications or build your board from scratch.
As we’ve been doing this for around 12 years, we’re confident in our ability to actualize your ideas. Hence, if you have any questions in mind, tap on us!
Place your High TG PCB with PCBTok immediately!
PCBTok is known for treating its consumers with compassion.
After we finalize your board concept, we consistently conduct rigorous evaluations using the most modern PCB screening procedures.
We could provide documentation of our High TG PCB inspection. We also have extensive global recognition for mechanized PCB certification.
PCBTok provides later part service 24 hours a day, seven days a week for your comfort.
Hit us up by sending an inquiry today!
OEM & ODM High TG PCB Applications
Metal industry apparatus experiences tremendous temperature variations, hence high TG PCB must be used in those machines to keep them running smoothly.
Due to its capacity to tolerate extreme temperatures, High TG PCB is ideal for devices where the unit’s temperature increases rapidly, such as engine controllers.
When it comes to Automotive Applications, these are the perfectly suited PCBs to utilize. Since, engine of these automotive emits extreme temperatures to its surface.
During the production of electricity, a lot of heat is emitted. As a consequence, good thermal resistance management is essential, which High TG PCB can provide.
Industrial electronics encompasses not just computers, but also production facilities, machineries, and so on. Hence, it requires a PCB that can tolerate the heat they release.
High TG PCB Production Details As Following Up
- Production Facility
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NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
High TG PCB – The Completed FAQ Guide
High TG is the way to go when it comes to selecting the right PCB substrate for your application. While the Td of the average TG PCB is 260, the Td of the high TG is closer to 450. High Td PCBs are ideal for multilayer and high-density integrated circuits because they have a higher Td. They are, however, more expensive than standard PCBs.
You will know more about high TG PCB in this guide.
When a PCB is subjected to high temperatures, the components within it are vulnerable to damage. Thermal expansion rates can cause mechanical stress, resulting in inconsistency or complete failure. High-TG PCB and lead-free assembly are two methods for protecting your circuit boards from high temperatures.
When it comes to lead-free assembly, however, you must be cautious about the safety of your products. Always read the manufacturer’s specifications and seek the advice of a certified expert.
High Tg PCBs are used in many different applications. LED and radio-frequency (RF) technology are two common applications for high-TG PCBs. This technology is gaining traction in industries such as computers and telecommunications. Security and broadcasting equipment also use high-TG PCBs.
High TG PCB with Edge Plating
High-TG PCBs are also frequently thin and must be heat resistant. High-TG PCBs are frequently less expensive than standard PCBs.
A wide range of substrates, laminates, and other components can be used in high-TG PCB materials. Glass, paper weave, epoxy resin, and even ceramics can be used to create these materials. To meet Tg requirements, the substrates should be of high quality. Pyralux or Kapton can be used to make flexible substrates. Aluminum or polytetrafluoroethylene can be used to make rigid ones.
Electric drills and presses, as well as solar power cogeneration equipment, contain high-TG PCBs. They are also employed in automotive electronics, particularly radar. High-TG PCBs were heavily used in the development of radar technology in automobiles.
High-quality PCBs will also be long-lasting and durable. They can withstand the heat and humidity generated by these devices. The advantages of high-TG PCBs are numerous, and they merit further investigation.
Proper documentation is essential for the successful fabrication of a high-temperature-gradient PCB. PCB manufacturers can help you with these specifications. High-TG PCB materials include FR-4, Nelco, and Rodgers. High-frequency signals can be routed through their inner layers for protection against external radiation. For more information, visit the manufacturers’ websites. High-TG PCB material specifications vary, but the following are general guidelines:
The high Tg PCB material is perfect for applications requiring high power density. Excessive heat generated during operation can impair circuit operation. While it is possible to reduce heat generation, the process will be more expensive. High-Tg PCBs solve the heat generation issue while maintaining reliability. They are a cost-effective and reliable option for power supply and circuit boards. TG PCBs have different weights, but they are all characterized by high resistance to electrical interference.
High-TG PCB material is a type of FR4 PCB that can withstand extreme temperatures. It can withstand temperatures of up to 170 degrees Celsius. However, the temperature of the application must be lower than the PCB temperature by at least ten to twenty degrees Celsius. High-Tg PCB material is flame-resistant, flame-retardant, and highly flexible. It is critical to choose the right material for your application.
High TG PCB Material
Substrates and laminates are examples of high-Tg PCB material. Dielectric composite structures such as glass, paper weave, or epoxy resin are commonly used as substrates. To improve dielectric constants, some boards are made of ceramics. A high-Tg PCB material can also withstand high temperatures and humidity levels. It is critical in this case that the material meets specific Tg requirements.
In order to respond to the question, “What Are the Properties of High Tg PCB?” It is critical to understand the distinctions between TG and high TG materials.
A circuit board with a higher glass transition temperature is referred to as a “High Tg PCB” (Tg). Tg stands for “transition glass temperature,” and it is the temperature at which a substance solidifies but cannot be burned or softened. High Tg PCBs are designed to withstand these high temperatures. At high temperatures, their electrical properties and hole quality should not change, melt, or soften.
They are used in many electronic applications where heat and mechanical strength are required. Antennas, AC power supplies, and embedded computer systems are some examples. High Tg PCBs can also withstand a wide range of temperatures and energies. High Tg PCBs can withstand the harshest conditions when used in these environments. There are numerous advantages to using high Tg circuit boards.
Properties of High Tg PCB
A high Tg PCB has a high glass transition temperature (Tg). A PCB with a low Tg may be suitable for lower temperatures. A PCB with a high Tg can withstand temperatures of up to 300°F. High Tg PCBs can withstand higher temperatures than standard PCBs. This is because high Tg materials are more stable and can withstand temperature variations better than the norm.
These boards are well-suited for a wide range of applications, including heat-generating devices. The Tg value indicates the material and state of the PCB during its service temperature. High-TG PCBs also have mechanical, electrical, thermal, and chemical properties that make them more durable. This article will look at some of the main advantages of high-TG PCBs, as well as the applications that they are best suited for.
PCBs with a high Tg are used in high-temperature applications such as computers, communication equipment, and precision instruments. High-Tg PCBs necessitate greater heat resistance than standard PCBs. They are also suitable for use in high-density mounting techniques such as SMT and CMT. Furthermore, high-Tg materials aid in heat management, making them an excellent choice for a wide range of high-temperature applications.
Another common application for high-TG PCBs is in high-heat applications. These applications can range from antennas to AC power supplies. Embedded computer systems generate a lot of heat as well. When you use a high-TG PCB, you save time and money on manufacturing. You will also avoid solder-related hazards and rework. Aside from cost savings, high-TG PCBs can improve the performance of your products.
High TG PCB Assembly
If you need a high-TG PCB, you can choose between a single-layer and a multi-layer design. You can choose a custom-designed TG PCB that is specific to your application. Modules with high-TG PCBs are also available. Module-based PCBs are typically more expensive because they are designed by a manufacturer for a specific application.