The Complete Guide in Knowing IC Programming | PCBTok

IC stands for integrated circuit. An IC is used for many different applications, including computers and other electronic devices. The programming service can be used to program a single IC or multiple ICs at once. The programming service will allow you to create your own program for the ICs that you want to use.

PCBTok offers the best IC programming services. PCBTok has a team of professionals, who are experts in their field. PCBTok can help you with your project and provide you with the best quality services that meet your requirements.

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Customer Centric IC Programming Services of PCBTok

PCBTok is an IC programming service provider offering customer centric IC programming services to the PCB industry. PCBTok has been in business for over 12 years.

PCBTok prides itself on its ability to meet customer demands and requirements with speed, accuracy and efficiency. Our goal is to provide customers with a complete solution that addresses all their needs from one source, allowing them to focus on other aspects of their business rather than having to manage multiple suppliers for different services.

PCBTok have the experience and expertise to deliver high quality, reliable and cost-effective solutions. Our proficiency in the area of IC Programming has helped us to become one of the most trusted names in this domain.

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IC Programming By IC Types


Microcontrollers and Microprocessors. MCUs are designed to be lightweight, meaning that they’re built to handle small amounts of data. MPUs, however, are more powerful than MCUs and designed for more complex tasks.


EPROM (erasable programmable read-only memory) is a type of chip that retains stored data even when power is turned off. EEPROM (electrically erasable programmable read-only memory) can be erased electronically.


Flash memory keeps data stored without needing a power source. When you save data on flash memory, you are actually telling the computer to turn certain transistors on or off to store digital information.

Nand Flash

NAND flash is a type of non-volatile memory that’s used in USB sticks and SD cards. NAND flash is programmed, erased, and reprogrammed in large blocks. Similar to the logic function NAND.


Complex programmable logic devices (CPLDs) are a class of programmable logic devices with complexity. Contains logic implementing disjunctive normal form expressions and more specialized logic operations.

SD Card

SD cards are small, but they’re also incredibly powerful. They’re designed for high-capacity memory and various portable devices. The SD card has become popular due to its versatility and its ability to hold large amounts of data.

What Is IC Programming?

IC programming is a process that transfers a computer program into an IC chip or also called an integrated circuit. Integrated circuits are tiny, complex circuits that are usually made up of millions of transistors. They are used to perform many different functions in electronic devices, including storing data, performing calculations, and controlling other components.

The integrated circuit industry is one of the most important sectors in all of technology, as it has helped make possible the rapid growth of computing power over the past few decades. As computers become more powerful, they’re able to perform more tasks at once and process information faster than ever before—and all thanks to IC programming!

What Is IC Programming
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How to Program an IC Chip?

Programming an IC chip is a complicated process, so here’s what you need to check in programming your IC

  • Make sure your chip is ready for programming. To do this, you’ll need a socket and a programmer that can read the chip’s current state.
  • Check your chip’s voltage requirements. If your chip requires more than 3 volts, then you’ll need a special programmer and programmer software that can handle high voltages—otherwise, it might not work properly or cause damage to your computer during programming!
  • Check whether your programmer has the correct software required for programming specific chips—different chips require different kinds of programmers and software programs in order for them to be programmed correctly and without mishap.

What Language Does IC Programming Use?

In order to program an integrated circuit (IC), you need to use a programming language. This language is usually known as a hardware description language (HDL). HDLs are used by engineers and developers to create digital circuits in the form of software code. HDLs are designed to be processed by computer systems, so they must be translated into machine code before the final design can run on hardware.

The most common HDLs include Verilog, VHDL, C/C++, and Ada. These languages are used to describe how a circuit should operate and perform its desired function. The language you choose will depend on your personal preferences and skillset as well as what kind of IC you’re trying to program.

What Language Does IC Programming Use

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IC Programming Fabrication
How to Program an IC Chip

PCBTok is a company dedicated to providing the best quality IC programming services. We offer our customers the highest possible level of service at an affordable price. Our experienced technicians are highly trained and capable of handling any job, no matter how complex or difficult it might be.

Our team has been working in this field since 2012 and we have completed successful projects during this time. We have received numerous awards from our clients for our excellent work and dedication to quality. We are always striving to improve ourselves and meet the needs of our customers better than anyone else does.

We have expertise in a wide range of programming types, from simple memory programming to complex logic and digital designs. We make sure that each project is completed on time and within budget, so you can be confident that your work will be done right.

IC Programming Fabrication

How Does IC Programming Work

IC programming is the process of writing and saving the code for a program on an Integrated Circuit (IC). It’s also called FLASH programming, because it involves using a flash memory device to store the code.

The IC programming process begins when you write a program in a language like C or assembly language on your computer. The program itself must be converted into hexadecimal format.

Once converted into hexadecimal format, the program is loaded onto a compiler that converts it into binary form, which is what actually gets stored on the chip. Then you use an in-circuit emulator to write your code onto the IC. Finally, you can use an emulator to load your code onto other chips as well.

Why Do you Need IC Programming

You may be wondering why you need IC Programming. The answer is simple. If you want to be able to program a microchip, then you need IC Programming. This is because the programming language that is used for microchips is not the same as other programming languages. The one used for microchips is called machine language, which is a binary code that does not have any punctuation or formatting. It looks like a bunch of numbers and letters on the screen.

The IC programming process involves creating a set of instructions for each function that needs to be performed by the IC. This can include things like reading data from one place on the network and then sending it somewhere else on another network; or it could mean performing calculations on information received from an input device.

OEM & ODM IC Programming Applications

Power Tools

The IC Programming for power tools is an extension to the basic programming language. It allows you to customize your tool and optimize its functions based on usage.


Basic electronic components such as resistors and capacitors are used in every circuit. Examples include toys, robots, and even smaller home appliances.

Engine Control Systems

IC Programing for Engine Control Systems introduces the programmability of central processors, control modules, and application-specific ICs.


IC Programing for the functioning of the main components in modern pacemakers, how to interpret these signals and how to program them.

Industrial PCB for Computers

The IC programming for a computer that has been designed to perform one specific task, such as controlling the mouse, image on the monitor, etc.

Client-Oriented IC Programming Services of PCBTok
Client-Oriented IC Programming Services of PCBTok

PCBTok is a leading provider of customized and cost-effective IC programming services. We specialize in providing customer-centric solutions to meet the needs of our customers.

IC Programming Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

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