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PCBTok's Best Immersion Silver PCB in the Market
We are a professional PCB manufacturer and have been dedicated to providing customers with high-quality products and services for more than 12 years. Our new immersion silver PCB is made with high quality material and has a top notch finish. We have worked hard to make sure that this product is the best on the market.
- Provide WIP (work in process) report to you each week
- No minimum order quantity for your new order
- Engineering questions(EQ) will be sending within 1-2hours
- Files receive full CAM review prior to manufacturing
Reliable Capability of PCBTok’s Immersion Silver PCB
PCBTok’s Immersion Silver PCB is the best quality product in the industry, we can make all kinds of circuit boards according to your requirement, such as FR4, Aluminum, Multilayer Board and so on. We also can design the layout according to your request.
Immersion silver is a reliable material to use for your PCB because it has numerous benefits over other types of metal. For example, it has an extremely low resistivity, which means that it can handle higher currents and voltages than other metals.
It also has a much lower contact resistance than other metals, so you will get more current through your connections. This makes it especially useful for power supplies or high-current applications where you need to transfer power from one place to another with minimal loss of energy along the way.
When you want a dependable and effective PCB, you need a reliable manufacturer. And if you’re looking for a solution to your PCB needs, it’s no surprise that PCBTok is the company to turn to.
Immersion Silver PCB by Type
Designed specifically for customers who value size and efficiency. The board offers unmatched performance when it comes to thermal performance, electromagnetic interference (EMI) shielding, and EMI suppression.
Adopts a two-layer structure, with the first layer as an immersion silver anti-static conductive layer and the second layer as a base material. Used in the process of oxidization to form a conductive layer.
Engineered for long-term reliability, with better ESD and RFI protection than standard boards. The high density material makes it easier to create a thinner and lighter product without sacrificing strength or durability.
Designed to be flexible and used in products such as smartphones, televisions, etc. The conformability makes it suitable for use as an interconnect in most electronic products.
Rigid Immersion Silver PC Boards offer the performance advantages of immersion silver technology with a lighter weight and greater flexibility, ideal for high-temp applications.
Made using thick silver boards that combine higher current densities and lower thermal resistance than other PCB materials.
Immersion Silver PCB by Material (6)
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The high efficiency of dissolving the aluminum-based constituents of the silver provides the highest level of cleanliness in terms of dissolution.
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World’s first water-resistant, nano-coated, non-allergenic and anti-static PCB. Designed for a total solution for cooling devices.
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Used to prevent corrosion of conductive surfaces. Helps to protect costly electrical systems from the damaging effects of electrochemical degradation.
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An electrically conductive, free-machining and solderable proprietary material that allows you to create high performance interconnects for your PCBs.
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Highly conductive, silver plated copper laminate for demanding applications where high heat dissipation and reliability are important.
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Innovative, next-generation thermal interface material that minimizes heat transfer to your CPU and significantly improves cooling efficiency.
Immersion Silver PCB by Features (6)
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The power supply immerses the circuit board in silver, which decreases corrosion and increases conductivity by providing the perfect electrical environment for the components.
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It has superior thermal conductivity, or heat transfer properties, meaning it can dissipate heat away quickly to any heat sinks on the printed circuit board.
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Widely used in module, equipment and chip antenna. It has excellent conductivity, high hardness and good corrosion resistance, thermal conductivity and so on.
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Provide maximum thermal conductivity, reliable interconnects and improved reliability compared to standard bulk boards. This OEM-grade PCB is designed for applications such as industrial and embedded programs.
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This product allows you to easily install LED lights in your home, office or where ever needed. This product has a beautiful design and can be placed on vanity tables, book shelves, in bathrooms or even kitchens.
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Bluetooth Immersion Silver PCB also comes with an innovative design, which makes it more suitable for wearable devices, smart watches and other electronic products.
PCBTok’s High-Caliber Immersion Silver PCB
The PCBTok’s Immersion Silver PCB is a high-quality, high-performance board that can be used in a variety of applications. It features a low noise, high frequency response and an excellent signal to noise ratio. The immersion silver coating also helps to reduce impedance so that you can get the best performance out of your circuits.
Our PCBs are made with a special silver-based immersion process that makes them more robust than regular PCBs. The process involves immersing the board in a bath of silver particles and then heating it on a hotplate at high temperatures. The particles fuse with the copper traces on the board, creating an extremely durable outer layer.
This is great for anyone who needs to protect their electronics from corrosion or other contaminants. If you have any questions about how we can help you with this process, please contact us today!
PCBTok’s Mastery in Immersion Silver PCB Manufacturing
PCBTok is a leading full-service PCB manufacturer with years of experience in manufacturing immersion silver PCBs. Our expertise lies in the ability to produce high-quality, reliable circuits from start to finish.
Immersion silver PCBs are used in many electronic devices due to their superior conductivity and performance. They are typically found in automotive electronics and medical devices, as well as industrial equipment such as power supplies and LED lighting.
The process for manufacturing immersion silver circuits starts with a single piece of copper-clad FR4 substrate material that is then coated with a layer of nickel followed by another layer of copper. The metal layers must be applied precisely so that they do not overlap or touch each other.
After this step, the entire board is immersed in an electrolytic solution containing tin particles so that it can be plated with pure silver metal without any additional chemicals or compounds added into the mix.
PCBTok’s Immersion Silver PCB Superiority
PCBTok is a leading provider of immersion silver PCB services. We are confident that our high-quality boards, precise processing techniques and state-of-the-art equipment can meet your needs. Our products are 100% free from defects and meet the highest industry standards. We offer a wide range of specifications and sizes to accommodate your requirements.
Our Immersion Silver PCBs have been widely used in various industries, such as medical electronics, telecommunication and military industries. They are widely used by customers who need to use these boards for their applications or projects. Our boards are of the highest quality and provide excellent performance for your products.
PCBTok’s Immersion Silver PCB Reliable Functionality
When you need a reliable, functional PCB that will stand up to the rigors of the real world, there’s no substitute for immersion silver. With its high conductivity and resistance to tarnishing and oxidation, this is the go-to material for many industries.
The benefits are clear: when you’re working in an environment where reliability is paramount, you need a material that can withstand harsh conditions and still provide reliable data transfer. That’s what makes immersion silver so appealing to our customers. It’s not only highly conductive and resistant to tarnishing and oxidation—it also has exceptional thermal conductivity, which makes it an excellent choice for applications where heat dissipation is key.
When you want your product to be reliable and function with minimal interruption, there’s no better choice than immersion silver PCBs from PCBTok!
Immersion Silver PCB Fabrication
The PCBTok’s Immersion Silver PCB Advance Materials are made of a special silver alloy, which is easy to process and has excellent conductivity. This product has many advantages, including high conductivity, good oxidation resistance and low thermal expansion coefficient, which can be used in various fields such as high-frequency circuits and large-scale integrated circuits (LSI).
This technology utilizes the properties of silver to provide a conformal coating that protects the copper from oxidation and corrosion. The silver coating is applied through a vacuum deposition process at elevated temperatures. After applying the coating, the PCBs are placed in a bath of molten solder for wetting and bonding.
With years of experience in this field, we are experts in providing customized products to meet your requirements.
Our company was founded in 2010 and since then has been dedicated to the production of high-tech equipment for circuit board processing. We have always focused on providing customers with top-quality products at the most competitive prices possible. Our immersion silver plating equipment has been sold around the world, including Europe, North America, Asia and so on.
If you’re interested in our products or would like more information about our services, please feel free to contact us at any time!
OEM & ODM Immersion Silver PCB Applications
This PCB is highly durable, which means that you won’t have to worry about replacing it or repairing it for years at a time, which makes it ideal for use in the medical industry.
Has a unique PCB that has the ability to withstand high temperatures and pressures. This makes it an excellent choice for industrial applications.
Created to provide a reliable and affordable option for those who need a high quality PCB with excellent durability and heat dissipation properties.
This makes it easier for signals of automotive to travel through circuits and for components like capacitors and inductors to perform their functions properly.
Aviation products are used in an environment with high pressure, high temperature and other extreme conditions. Must be resistant to corrosion caused by water, humidity, and oxygen.
Immersion Silver PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Immersion Silver PCB – The Ultimate FAQ Guide
Immersion Silver is a process in which copper is coated with a layer of pure silver to improve solderability. The immersion silver process is a displacement reaction to prevent silver from reacting with sulfides and is also combined with an OSP finish. Other advantages of immersion silver include low cost, lead-free and short assembly windows. In this guide, we will introduce the basic principles of immersion silver and its advantages.
What is an immersion silver PCB and how is it used? Immersion silver is a surface finish used to protect exposed copper solder pads. It is often used in the EMI shielding industry and is not harmful to the environment. It is low cost and has a long shelf life, but is not as durable as ENIG finishes. The only drawbacks to immersion silver are the limited assembly window and the difficulty of electrical testing.
Electroless nickel plating is a cutting-edge surface treatment that offers many advantages over traditional silver and copper. It consists of two layers: The first layer of nickel, which acts as a barrier to copper, can be soldered. During storage, the second layer of gold protects the nickel layer and the second layer of silver covers the copper. As a result, the surface is very smooth and suitable for a wide range of applications.
Compared to the latter, immersed silver is a more environmentally friendly option. Immersion silver has obvious environmental benefits and is cheaper than ENIG. In addition, this method consumes much less energy than ENIG and is more environmentally friendly. It can also withstand multiple reflows while still looking good. So if you are looking for a solution related to PCBs, you can find the right immersed silver for your specific application.