Change Language
Affordable and Sustainable: PCBTok's Immersion Tin PCB
From design files to finished boards, we can handle every aspect of your project seamlessly. Our expert engineers will work with you every step of the way so that all you have to do is sit back and relax while we create top Immersion Tin PCB products for you!
- No minimum order quantity for your new order
- Provide WIP (work in process) report to you each week
- Files receive full CAM review prior to manufacturing
- Engineering questions(EQ) will be sending within 1-2hours
Steady Performance PCBTok’s Immersion Tin PCB
Immersion tin PCB is a kind of surface plating that can be used for PCBs. The immersion tin process is the most common process for immersion tin. The entire board is immersed in a bath containing tin salts and liquid or gaseous organotin compounds.
During the process, tin atoms are deposited on the surface of the copper substrate as a thin film. A major advantage of this process is that it does not require organic solvents to clean up after processing, so it has low toxicity compared with other processes such as electroless plating or electroplating.
With its ability to withstand high temperatures and resist corrosion, this board is ideal for applications that require consistent performance in extreme environments. It also comes with an improved solder mask design that provides better reliability, especially during soldering processes.
In order to improve the performance of PCBs, many people choose immersion tin process because it can prevent oxidation during processing and improve the quality of PCBs. However, as we all know, there are many different processes available on the market today, so how can we choose one that suits us best? Choose PCBTok to know what best suits you and your device.
Immersion Tin PCB by Type
Most widely used electronic materials which are widely used in communication, military and medical, measurement and control equipment field.
Our double-sided PCBs provide superior thermal and electrical performance, making them an excellent alternative to plastic or aluminum cases.
Multilayer Immersion Tin PCBs offer the lowest noise, highest throughput and lowest cost in high volume designs. These boards exhibit a very low propagation delay, which is practically the same as air.
Flexible PCB is manufactured by the process of soft electroplating, which is based on immersion tin bath and polyurethane resin as a solder resist. Can be bent up to 180 degrees.
High thermal conductivity, solder-resist, flexible conformal coating. Has thermal performance to support various high-end electronic devices with low thermal resistance and its dielectric strength is excellent.
Its high rigidity combined with its flexibility and light weight gives a unique benefit to OEMs who can now add the benefits of tin to their products without compromising on rigidity or weight
Immersion Tin PCB by Layer (6)
-
Suitable for immersion tinning and coating on a variety of printed wiring boards. It offers high quality, smooth and bright surface, easy patterning, low resistivity and good processability characteristics.
-
Teflon PCB is a high-quality, an ideal material for making solder stencils because of its high melting temperature, good electrical insulation properties, low surface tension and hydrophobic nature.
-
Made by high quality aluminum and tin. It has less density than the ordinary acrylic PCB. It is easy to process and repair. Ideal choice for a multilayer PCB design as it provides high stability and reliability.
-
Ceramic Immersion Tin PCB(CIT) is manufactured by the tin plating process, which has the characteristics of corrosion resistance, thermal stability, mechanical strength, low electric resistance and good insulation ability.
-
Rogers PCBs have a special tin coating that increases solder wetting and assembly reliability. Immersion Tin is ideal for automotive, medical and other high reliability applications.
-
The Isola Immersion Tin PCB is the perfect solution for a variety of applications, including power applications that require increased temperature and humidity resistance, greater dimensional stability and superior reliability.
Immersion Tin PCB by Features (6)
-
The main function of the semiconductor board. Semiconductor board has high heat dissipation and good performance, and it can be used in electrical equipment or electric appliances.
-
For this product, its immersion tin PCB is widely used in the high voltage power supply. Lowering the cost will be the main direction in future development of power supply industry.
-
Most essential components for mobile phones and tablets built with Bluetooth technology. It helps to reduce the electromagnetic radiation that may affect human health when using devices near a user’s head.
-
OEM PCB is a type of surface treatment, which is accomplished by immersion in liquid tin. This method is used to improve the properties of the corrosion resistance and the appearance.
-
The LED PCB applies to LED lighting, LED lamp and other industries. Due to its novel structure, if the current continuous working time reaches 5 hours, it is rare that the layer burns.
-
Microwave PCB is a product of high stability, non-toxic and health protection, with a good appearance, with plastic packaging or paper box package. It can be used in the microwave oven and refrigerator.
PCBTok’s Expertise in Immersion Tin PCB
PCBTok’s expertise in immersion tin PCB is unparalleled. PCBTok is proud to offer a full range of immersion tin PCBs. Our manufacturing process uses immersion tin plating with a hot plate and UV light, which provides exceptional adhesion and durability.
Our team is committed to delivering the highest quality products at the best possible price, and that means we don’t cut corners when it comes to our commitment to quality. We are proud to be able to offer a full suite of immersion tin PCB services, from design to manufacturing.
Our state-of-the-art facilities are equipped with some of the most advanced equipment available, which allows us to manufacture your product quickly and efficiently while maintaining a high level of quality assurance. Our focus on process control ensures that each product meets or exceeds industry standards for quality assurance as well as customer satisfaction.
PCBTok’s Immersion Tin PCB Production Process
PCBTok’s immersion tin PCB production process begins with our experienced engineers working with you to determine the best design to meet your needs. Our engineers will create a layout and design that is optimized for performance, while keeping in mind the constraints of your product.
Once you approve the layout and design, we start production. We begin by preparing a substrate for the PCB. This can be done by drilling holes in the board, or cutting out portions of it.
Next, we coat the substrate with a layer of copper and apply solder paste to it. After that, we place a photoresist on top of that and expose it to UV light so that only parts of it are clear and can be etched away during chemical processing.
Finally, we etch away any unwanted copper using chemicals or lasers before applying an immersion tin solution to protect against oxidation or corrosion over time; this also gives us a shiny finish that makes our product stand out from others on store shelves!
PCBTok’s Immersion Tin PCB Advantages
PCBTok offers the best immersion tin PCBs in the world. Our boards are made with the highest quality materials and are put together with care by our expert team of engineers.
Our boards use immersion tin plating, which means that we can offer our customers superior quality and performance. Immersion tin is an extremely durable finish that resists corrosion, oxidation, and other forms of degradation over time. The result is a product that lasts longer and performs better than competing offerings on the market today!
We also offer a wide range of customization options for your project: from color variations to custom labeling, we can help you get exactly what you want out of your next PCB order!
PCBTok’s Immersion Tin PCB Reliable Materials
PCBTok is a reliable PCB supplier in China, which offers many kinds of products, including PCB, PCB assembly, PCBA, and electronic components. As one of the leading PCB suppliers in China, our products have been exported to more than 100 countries and regions worldwide.
The quality of our products is guaranteed by the strictest quality control system. Our factory is located in Shenzhen, and we have an excellent production capacity. With our high-tech equipment and professional engineers, we offer a wide range of products at competitive prices.
You can find all of these features in our PCB manufacturing services. We are your one-stop shop for all your PCB assembly needs, we offer both PCB and PCBA. To find out more, or to request a quote please contact us today. Our sales staff is always happy to help.
Immersion Tin PCB Fabrication
When it comes to immersion tin PCB cost, PCBTok is one of the most affordable options on the market. Our pricing is set up to be as economical as possible, but it doesn’t sacrifice quality or service. In fact, our customers report that our immersion tin PCBs have a better quality than other companies’ standard products. We have a lot of experience in this field, and we’re dedicated to providing you with the best product possible at an affordable price.
Our immersion tin PCBs come in a wide range of sizes and shapes, which means you can get exactly what you need for your project without having to pay for extra space or features that aren’t necessary for your needs. We also offer custom designs and custom sizes if necessary, so if you need an odd shape or size for your project then we can make it happen!
We offer a wide range of colors so you can find the right one for your project. We also offer special effects, like metallic and matte finishes, so you can make your PCBs stand out from the crowd while still maintaining durability and reliability.
PCBTok’s immersion tin PCB soldermask colors are available in a variety of shades, including black, blue, green, red, white and yellow. We also offer a full range of color matching services to help you get the exact shade you need.
Immersion tin is a type of surface finish that is used in the manufacturing of printed circuit boards (PCBs). It consists of a thin layer of tin-plated copper that covers the surface of the board between the top and bottom layers.
OEM & ODM Immersion Tin PCB Applications
Immersion Tin PCB for Medical Devices is a reliable and efficient solution to provide a high-quality product. Immersion tin is used in medical devices because of its reliability, low cost, and excellent solderability.
Immersion tin PCB for industrial control is a kind of chemical/mechanical strength high temperature resistant PCB, which can be used in various high temperate applications. RoHs compliant and much more.
Our immersion tin PCBs have been designed to meet the high quality standards required for IoT, smart devices and wearables. We can cater to both simple and complex multi-layered designs with a wide range of materials including FR4, CEM3 and Rogers.
Immersion Tin PCB for Automobile Industry is made of high quality material, which ensure its corrosion resistance and good insulating performance. The immersion tin process ensures that no contamination will occur on the PCB surface during production.
We offer an excellent-quality PCB for aviation industry. Immersion tin PCB is very popular in aviation field and especially some specific fields, such as aircraft power supply, cabin entertainment system and cabin network control system.
Immersion Tin PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Immersion Tin PCB – The Ultimate FAQ Guide
Immersion tin PCB is a common material for communication PCB boards. Its surface finish is not as strong as that of immersed silver, but it has advantages. Its tin layer protects the copper layer from oxidation and short-circuiting, thus extending the overall shelf life. In addition, it is RoHS compliant, making it environmentally friendly. It also uses less water and chemicals than other materials.
Compared to immersion silver PCBs, immersion tin PCBs are cheaper and easier to manufacture. In addition, it has a shorter shelf life than immersion silver. Intermetallic compound diffusion and oxidation resistance are the two main advantages of dip tin PCBs. It is also compatible with a wide range of applications. Backplanes and press-fit pins can be inserted using tin-impregnated PCBs.
Choosing a surface finish is essential for a successful tin-plated circuit board. There are several types of finishes, each with its own advantages and disadvantages. Immersion Gold(ENIG), immersion tin, and immersion silver PCBs are the three most common types of surface finishes. You can choose the best type of coating for your needs.