Advanced Impedance Control PCB Solutions by PCBTok
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- High-quality circuit board items are available
- Wide range of types, sizes, and surface finish are options you can explore
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Dominate with the Superior Impedance Control PCB
PCBTok is China’s leading Impedance Control PCB manufacturer and PCB Quick-turn provider.
We will help you lead by bringing good business to your enterprise.
We enable the highest performing HDI boards with our supreme-grade Impedance Control PCB.
We have customers all around the world
We are the preferred supplier for large organizations in the EU, UK, and USA.
We doubt that anyone else can produce Impedance Control PCBs as well as we can.
Our PCB products may solely be made to your specifications.
Impedance Control By Feature
Impedance Control PCB By Special Function (5)
Impedance Control By Surface Finish & Appearance (6)
Impedance Control PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Bring You Value with Maximum Results
The relevance of impedance control is valid one.
The boards dedicated to this feature purchased from PCBTok will greatly help your business.
We learned a lot about circuit boards in the journey of building our company, founded in 2008.
As a result, we teach our expert personnel to ask smart questions.
They’ll also give you intelligent suggestions to help your business prosper.
PCB Inspections in Impedance Control Boards
The PCBTok brand is synonymous with stability and confidence.
This multilayer PCB is frequently used for RF and RF-related electronics.
It is a strong PCB used in PCB stack-ups.
The stack-up can frequently be 4-Layer, 6-Layer, 8-Layer, and so on.
For safety, PCB inspections we cover include Functional Testing and AOI (at the most basic level.)
We employ other PCB test too, if interested, just inquire.
Call right away to inquire about our whole range of Impedance Control PCBs!
Boost Profits with Impedance Control PCB
Perfectly suited to be your partner in electronics, PCBTok has a large-scale facility.
For sure, we can accommodate any amount/type of PCB order you want to be processed.
The Impedance Control PCB is favored by many commercial and industrial sectors since it is thought to be an impeccable solution.
We also manufacture 3 Layer PCBs, round-shaped PCBs, and long PCBs with Impedance Control, notwithstanding the fact that it is rare.
Impedance Control PCB to Answer Digital Needs
We manufacture the best impedance control PCBs using digital technology.
Our Impedance Control PCB in-house production is complete.
We can make your OEM pieces from end-to-end.
To ensure the greatest quality, our highly experienced engineers and employees oversee the entire manufacturing process.
They are internationally trained with global standards in mind.
Impedance Control PCB Fabrication
We will verify that the output is error-free for Impedance Control PCB orders.
This will allow you to maximize the potential of your purchase—without fault.
We never use professionals who are inexperienced or under-skilled in PCB manufacturing.
We understand that Impedance Control is intended for use in complex IT applications.
As a result, only the best PCB engineers are allocated to the project.
If you request it, we will provide you the whole CAM reports too.
We hope you find the information provided therein helpful. Most clients do.
We also hope to help you find new PCBs in the Impedance Control, High-frequency, and HDI product lines.
All of this work is being done to ensure that the product you purchase is of high quality.
We genuinely hope that things will perform as expected.
Please inquire today!
OEM & ODM Impedance Control PCB Applications
Impedance Control Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
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“PCBTok came to my aid with my PCB issue. To resolve the issue, they were able to return the original PCB design. I wholeheartedly suggest them because of their expertise and attention to detail. The crew are true professionals who exceeded my expectations. I expect them to return to assist me with my next PCB problem.”Emilien Orcel, Commodity Manager from Auvergne-Rhône-Alpes, France
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“Where do I even begin? PCBTok has been an incredible company with excellent customer service and work ethics. They have always been honest with me and have never lied or changed their price after the initial quote. When they were working really hard from Monday through Sunday, it was very wonderful. They also know how to be punctual.”Harry Sarode, Key Account Manager from London, UK
Impedance Control PCB: The Ultimate FAQ Guide
If you need help designing a custom printed circuit board (PCB) or just need more information, the guide is here to help! This guide will walk you through the basic steps involved in creating a custom PCB and will answer all your PCB-related questions. After reading this guide, you will be well on your way to completing your project.
Sending your design to CM is the first step. If some manufacturers can help you with the impedance control process, don’t be afraid to ask questions. Most manufacturers provide documentation to answer any questions you may have. If you don’t have any documentation, you can always turn to the online resources listed below. You can also contact the PCB manufacturer directly.
PCB Impedance Control: This is an important feature of digital devices because it regulates the amount of power flowing into and out of the circuit. Because it is a critical component of any PCB, designers must craft it carefully. This process will help prevent resonant energy pulses from interfering with adjacent components and potentially causing product failure. The next step is to select the right material.
What is the role of an impedance control PCB? PCB design tools can help you determine the exact impedance of your PCB. It is critical to use a PCB design tool with extensive design rules and constraints. You can specify network classes, signal requirements, differential pairs, and alignment width and spacing in some of the best PCB editors. The PCB Impedance Calculator can also be used to calculate the proper PCB control impedance.
To understand what impedance control means in a PCB, first define the board’s requirements for each layer. Each layer in the impedance table is specified as a single width with a single impedance value. In some cases, manufacturers will compare impedance to material inventories or stacking tables to achieve more precise impedance targets. To make it easier for the manufacturer to meet your requirements, including an impedance table in your manufacturing instructions.
Typical design considerations when designing a PCB include signal strength, noise sensitivity, and signal speed. You should also consider the width and height of the alignments to determine their sensitivity. Ribbon lines are the most predictable configuration and are usually the best choice for high-speed applications. If your PCB contains a large number of high-frequency signals, you may need to use impedance control features.
6-Layer PCB with Impedance Control
Choosing the right impedance control technique is an important aspect of PCB design. It is critical to use the correct material for the circuit to avoid signal loss and maintain consistent impedance levels throughout the conductive pattern. This will help ensure impedance matching throughout the network. Also, as the signal signals are transmitted to the transmission lines, their impedance must be consistent across the board. The impedance of each line is critical for proper termination.
“How is PCB impedance calculated?” You may want to know. If you are a designer. The answer is simple: to determine the impedance of a board, you must first understand how the various components on the board affect it. There are several situations where impedance control of the PCB is required, so make sure you include this information in your PCB design data. To pass signals, your circuit should have low impedance, etc.
If your board is designed with a circuit simulator, you can use it to determine the impedance of the PCB. The cost of using this method is a disadvantage. However, the benefits of using it are much greater. It is critical to evaluate the quality of the PCB design and identify errors before putting it into production operation. If you follow these three recommendations, you will be well on your way to the quality committee.
First, enter the target impedance and trace width. In the Target Impedance and Trace Width tabs, enter these values. You will also need to enter the relative dielectric constant of the PCB board material. After entering these two values, the calculator will calculate the impedance of the alignment for you. Then, you will get the exact impedance.
The signal is transmitted from the transmitter to the receiver via PCB transmission lines. These lines must have at least two conductors and a return path, usually a grounding layer. A dielectric material separates these traces. Controlled impedances are critical because they transmit signals that can be severely distorted by reflected energy. Controlled impedance ensures that the signal reaches its full potential. We will examine some of the different applications of this technique to understand why it is so important.
To get the best results with controlled impedance, you must specify the width of the alignment. PCB manufacturers use this technique to specify the width of each alignment. They can reduce the amount of work involved in building a board by specifying these measurements accurately and clearly. If you use this technique, be sure to include enough detail to give the manufacturer a clear understanding of the parameters that must be considered.
4-Layer PCB with Impedance Control
Controlled impedance is an important part of modern PCB manufacturing because it ensures that your devices operate properly and remain stable over time. Controlled impedance also adds value to the PCB and improves the control reliability of the device. If you are using USB signals, you will need a pair of alignments with an impedance of 90 ohms (+10%). Several factors must be considered when determining the correct impedance for USB signals, including the width of the alignment, the distance between copper features, and DK.
Controlled impedance is an important consideration when selecting the right PCB material for high-frequency applications. Controlled impedance is the characteristic impedance of a transmission line and is especially important for PCBs because high-frequency signals require precise impedance. The impedance of a PCB is determined by its physical dimensions and material composition and is measured in ohms (O).
When selecting a PCB for a critical application, it is important that critical components are thoroughly tested. This is not possible if the traces containing the controlled impedance are inaccessible or too short to be measured properly. In addition, additional pads or vias may be used to aid in testing, which may have an impact on the performance of the circuit. They also take up additional space. Controlled impedance is therefore critical to long-term performance.
The difference between impedance and resistance is that the former is a characteristic of high-frequency circuits. Ohms are used to measuring resistance. On the other hand, DC is characterized by resistance. Signals transmitted to the same impedance are usually optimal. On the other hand, signals transmitted to different impedances will experience attenuation or reflection.
Traditional wiring techniques alone cannot produce a PCB with controlled impedance. in addition to wiring, component impedances must be matched. The first step is to identify any networks that are experiencing signal integrity problems. Terminating components can also be used to achieve impedance matching. Prior to the board design process, it is critical to determine the source and target impedance of the network.
PCBs often use controlled impedance techniques. Controlled impedance techniques are essential to reduce the impedance of the board. When designing a circuit, it is critical to consider the impedance of the signal. The following article explains how to design a circuit board using controlled impedance techniques. This information will be useful for your next project.
Controlled impedance techniques are commonly used in RF communications, telecommunications, and high-speed signal processing. It is also required for calculations with signal frequencies greater than 100 MHz. For high-speed digital applications, controlled impedance techniques are essential. Another good example of high-speed digital applications is high-speed video. Controlled impedance techniques can simplify the design of high-speed video and signal processing.
Impedance Control Calculation
Before you start the PCB layout, you should fully prepare the schematic. This is because you will need to make changes based on impedance-sensitive signals. The schematic and PCB layout database should be synchronized. Check that your schematic contains the approved components and the latest controlled impedance signals. Then, specify the type of controlled impedance signal and classify it as a differential pair or a single-ended network. Remember that dielectric height is an important factor in controlling circuit impedance.
Impedance-sensitive circuits require different matching methods. The most efficient method is to match multiple circuits in parallel on a single trace. Two source lines are coupled with the same impedance in parallel matching, but match one in the middle. To ensure that your design is optimal for both types of impedance-sensitive systems, you can apply parallel matching to different parts of the circuit.
Controlled impedance routing requires calculating the board’s impedance distribution and configuring the board material. These parameters are set in the Layer Stack Manager of your PCB editor. The dielectric constant DK and dissipation factor Df of the dielectric material are key to understanding. You can avoid common routing errors by using these values correctly.
Make sure that the dielectric constant is constant along the entire length of the trace. Due to the uniform dielectric constant, the power is transmitted uniformly over the entire length of the trace. It is also important to ensure that the cross-sectional geometry of the traces is uniform. As a result, there will be less power attenuation and a more uniform impedance. Finally, avoid oversizing and breaking the signal path.
Check that all components, especially the alignment, are impedance matched. This prevents energy reflections while also ensuring proper coupling from source to routing to load. Controlled impedance is critical to enable specific component functionality. If the impedance of a component is not matched, the switching time will increase and random errors will occur.
If the impedance of a component does not match, you must add terminated components to achieve impedance matching. If you are unsure of the impedance of a particular component, seek advice from the printed circuit board manufacturer. A good manufacturer will be able to achieve the required impedance and manufacturing tolerances. If the impedance is not met, the manufacturer may recommend modifying the stack.
The importance of impedance matching in PCB design depends on the type of circuit being designed. Today’s analog and digital systems require impedance matching. They require fast rise times and low supply voltages. Analog and digital components also require higher frequencies. As the frequency increases, interconnects are more likely to fail. Therefore, proper impedance matching is critical to a successful PCB design.
Calculations to determine impedance are usually based on a perfect rectangular cross-section. The actual cross-section may be polygonal, with gaps or other impedances. This cross-section can vary greatly between board manufacturers. When calculating the impedance of a PCB, manufacturers often use their own proprietary formulas.
In short, impedance is the sum of reactance and resistance. Sometimes it is necessary to specify the impedance of a network or trace. When the impedance of a circuit is too high, reverberation may occur. However, in most cases, specifying the impedance of a trace is not necessary. This factor can have an impact on the overall performance of the circuit.
Impedance Control Tester
To design a PCB with proper impedance matching, you must first understand how your circuit is built. It is important to remember that impedance decreases as the distance between the signal lines and the virtual pattern decreases. For example, microvias can be used to create production-friendly PCB alignments. Then, using BGA escape routing or dogbone fan-out structures, you can achieve impedance matching in HDI.