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Top-Notch Insulated Metal Substrate (IMS) PCB of PCBTok
If you’re looking for an insulated metal base circuit board, look no further than PCBTok. Our IMS PCBs come in a variety. We can make IMS PCBs in any size you need, and we’ll ship them quickly so you can get your project done on time. We have a large inventory of IMS PCBs in stock and ready to ship out to you today!
- Certified with UL in US and Canada
- 7/24 sales and engineering tech support
- No minimum order required
- Over 500 workers in our facility
- Flexible payment terms
Insulated Metal Substrate PCB: Perfect Choice for High Power Device
When you’re designing a product that requires high power components, it’s important to choose the best substrate. An Insulated Metal Substrate (IMS) PCB is an excellent choice because it provides superior thermal conductivity and electrical performance to other substrates. It’s also easier to manufacture, which means you can save time and money while still creating the best possible product.
An IMS PCB is an electrically isolated copper foil laminate that has an insulating layer on both sides. It has a high thermal conductivity and can withstand high temperatures and electrical charges. It is also resistant to wear and tear and has excellent mechanical properties. This makes it ideal for any application that requires high heat resistance or requires parts that are exposed to high voltage or current loads.
If you’re looking for a material that can handle the high power requirements of your components, insulated metal substrate (IMS) PCB from PCBTok is the perfect choice. Learning more on how can we help you with your next project, please contact us today!
IMS PCB By Type
Popular in LED and power converting electronics due to their heat-conductive properties. Aluminum boards also extend the lifespan of an LED device by directing heat away from components.
IMS with copper substrate is an excellent conductor of electricity and heat, making it a perfect choice for your high-performance PCB. Our products achieve higher processing speeds with less rise in core temperature for better reliability.
Single-sided IMS PCBs provide an excellent solution for simple circuit boards that do not require the need for separate top and bottom layers. The other side remains bare, and is usually reserved for component placement of the circuit boards.
Great way to make the most of your circuit or product. It’s important for engineers to maximize their space using smart design. Double sided IMS PCB allows to build circuits that are compact and consume less power.
Multilayer IMS PCBs are circuit boards that have more than two layers of conductive material. These circuits can be made with up to 8-40 conductive layers. Allows a high degree of precision manufacturing.
Stainless steel IMS PCB is a great alternative to copper for your PCBs. It is lighter, stronger and has a better resistance to corrosion than copper. It does however require slightly more heat to solder than copper.
IMS PCB by Material (5)
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Bergquist IMS PCBs are used as reliable heat sinks in many circuits. Our Bergquist-manufactured products provide substantial EMI shielding effects for circuits, and are also used as solder floats in many circuits.
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Ventec IMS PCB’s high performance flexible foils, laminates and prepregs are used in a wide variety of applications. Produced to extremely high quality standards and are compatible with a wide range of processes.
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The high thermal resistance base material for this board provides excellent reliability for high layer count and high-temperature applications. Shengyi IMS PCB material is durable and can withstand temperatures.
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Thermally conductive insulted metal PCB substrate system is used for heat dissipation in IMS circuit boards, to enhance cooling and prolong component life. Specific applications include thermally demanding environments.
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Doosan PCB’s high-end materials are loaded with top-tier electronic materials. With a robust range of substrates available for our in-house processing capabilities, we have a solution for any application of IMS PCB.
IMS PCB by Surface Finish (6)
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Perfect for extreme conditions, the IMS PCB with immersion silver can withstand difficult operating conditions such as high temperatures and high humidity.
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IMS PCB with Immersion Tin is a copper clad laminate board with an immersion tin surface. Has excellent solderability, plating adhesion and electrical conductivity.
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IMS PCB with ENIG is an electroless plating option that coats your circuit board while also improving its current carrying capacity by improving the surface roughness.
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An IMS PCB with HASL is the process of applying a protective layer to the surface of a trace, which is then soldered. Will form a smooth surface with great leveling quality.
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IMS PCB with Organic solderability preservative or OSP, a water-based organic compound that selectively bonds to copper and protects the copper until soldering.
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This IMS printed circuit board process allows for better adhesion between immersion gold and epoxy, which produces a thinner and more electrically conductive layer.
Advantages of IMS PCB
IMS PCB is a revolutionary PCB material that offers several advantages over traditional PCB.
IMS PCB has increased thermal conductivity, which means that it can dissipate heat more effectively than traditional PCB. This is important for any electronic device that generates a lot of heat, like computers and other electronic appliances.
IMS PCB also has improved mechanical properties, which means it’s more durable. This makes it ideal for applications where there is a lot of stress on the PCB material, like in cases where an electrical component might come into contact with another part of the device or with the user’s hands.
Additionally, IMS PCB has improved fire resistivity and electromagnetic shield properties. This protects against both fire and electromagnetic interference (EMI). These properties make it ideal for applications where safety is paramount—such as medical devices—or where there is potential for EMI to disrupt operation of other electronics nearby.
Finally, IMS PCB is more SMD component friendly than standard boards; this means that more components can be fitted onto one board without compromising performance.
Assembly of IMS PCB
The IMS assembly process begins with a single sheet of metal, which is then cut and placed in a chemical solution. The metal is then etched, cleaned, and etched again to remove all unwanted material. Next, the remaining metal is oxidized—this creates an insulator between layers that helps prevent electrical shorts.
IMS PCBs are used because they are thin and lightweight, but also because they provide excellent electromagnetic shielding. This makes them perfect for use in applications where there is a high level of interference or where electrical components need to be protected from outside forces.
Because IMS PCBs are so thin, they can be easily bent into any shape required by the design of the device they are being used in. This makes them easy to manufacture and assemble into final products.
Applications of IMS PCB
IMS PCBs are an excellent choice for high-power and high-frequency electronic devices. They have a high thermal conductivity, which makes them a good fit for products that need to transfer heat quickly.
In addition, IMS PCBs are well-suited to rugged environments, making them ideal for commercial and industrial applications. They can also be used in harsh environments like those found in aerospace, military, and automotive applications.
IMS PCB is used to make computers, laptops, mobile phones, game consoles, smart watches and other electronic products that usually has LED lights. IMS PCB has many advantages, including heat dissipation and stability.
PCBTok’s Most Reliable IMS PCB
PCBTok is the most reliable and professional IMS PCB manufacturer in the industry. Our team has more than 12 years of experience in the field of PCB, and we have been providing high-quality products to our customers all over the world. We have a very strict quality control system and we strictly adhere to it.
We also use only high-quality materials, so you can be sure that our products are durable and long lasting.
Our customers are very important to us, which is why we always pay attention to their needs and requirements. If you need a custom IMS PCB at an affordable price, then please contact us today!
IMS PCB Fabrication
PCBTok IMS PCB’s Standard Inspection Process is a comprehensive process that ensures the quality of our products. We use this process to ensure that the PCBs we manufacture meet the highest standards for performance, reliability and safety. The inspection procedure begins with incoming material inspection, which includes visual inspection, dimensional inspection and mechanical property measurement tests for each material.
Following this inspection, all raw materials are first cut into sheets before they are laminated onto a substrate using thin film technology. The laminating machine has several sensors that measure the thickness of each sheet as well as determine if there are any defects present on the surface of it. Once these sheets have been laminated onto substrates, they are cut into individual boards using automatic laser machines which ensure accurate cuts every time! These boards are then inspected again for any defects before being packaged individually for distribution worldwide!
Most IMS PCBs are made with a metal substrate, which is the material that is actually connected to other components. The main types of metal substrates are aluminum, copper, and stainless steel.
Aluminum is a very common material for IMS PCBs because it is lightweight and flexible. It can also be easily bent into different shapes without breaking or becoming damaged.
Copper is another popular choice for an IMS PCB because it has many positive attributes: it conducts electricity well; it is very durable; it doesn’t corrode easily; and it has excellent thermal conductivity.
Stainless steel is a strong alloy that resists corrosion due to its chromium content. It is often used for plumbing applications because it does not corrode easily when exposed to moisture.
OEM & ODM IMS PCB Applications
Our Insulated Metal Substrate PCB is designed to be used with LED backlighting in illuminated signs. It is available in a variety of sizes and thicknesses and last longer than it would.
LED headlights are used in vehicles to provide high-quality lighting with low energy consumption. IMS PCBs are used in these applications because it has good thermal conductivity.
An insulated metal substrate PCB is a kind of printed circuit board that is used to connect and protect electrical components, such as resistors, capacitors and high-performance electronics.
When it comes to engine control boards, insulated metal substrate (IMS) PCB is made with a thin layer of copper sandwiched between two layers of epoxy insulation for durable circuit board.
Used to provide a low resistance path for the current flow. This can be used for DC power supplies, as well as other applications such as LED lighting, automotive electronics and more.
IMS PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
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- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
