Professionally Fabricated Isola370HR by PCBTok

Our Isola370HR can provide your applications with numerous advantages and exceptional properties. We guarantee you a product that can perform to a greater extent.

PCBTok’s Isola370HR has gained superiority over the FR4 material because of its exceptional results in thermal and mechanical inspections.

Furthermore, designs that demand sequential design lamination can benefit significantly from this particular PCB product. If you have any questions concerning the functionality of this board, please don’t hesitate to contact us. We’ll be pleased to help.

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We're Eager to Give the Best Isola 370HR Products

PCBTok has adequate facilities to ensure that the manufacturing process of your Isola370HR is up to the established standard guidelines.

Moreover, we are a manufacturer fully accredited in both US and Canada with UL Certification. Thus, you can be sure of the product quality that we produce.

In terms of raw materials, we only utilize the highest quality in the market to produce a remarkable output. Therefore, we guarantee you error-free items.

We always prioritize our client’s satisfaction with our products over anything else.

Our Isola370HR is constructed to last for an extended period without experiencing any blemishes and offers you complete performance satisfaction during its operation.

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Isola370HR By Feature


The HDI PCB that we integrate this particular material into is ideal for automotive, medical, wearable technology, and military and aerospace applications because of its numerous advantages. This includes its excellent versatility and reliability.

Prototype PCB

The Prototype PCB that we integrate this particular material into can be your suitable option if you’re planning to mass-produce this specific product since it can detect flaws during the early phase of production and correct them effectively.

Multilayer PCB

The Multilayer PCB that we incorporate this particular material into has numerous applications, such as industrial applications, due to its exceptional perks. Some of its advantages are enhanced durability, increased flexibility, and improved power.

Rigid PCB

The Rigid PCB that we incorporate this particular material into is among the most popular product in the market because of its wide array of uses, including industrial electronics and automation. In addition, they can be easily maintained and repaired.

Rigid-Flex PCB

The Rigid-Flex PCB into which we incorporate this particular material is popular among radar equipment, control tower systems, and many other applications because of its High TG ability. Additionally, it is highly reliable and relatively affordable.

Backplane PCB

The Backplane PCB that we integrate this particular material into is recognized to be the backbone of every device since it is responsible for communication among the connected boards. In addition, they are usually found in control panels.

What is the Isola 370HR?

In the PCB industry, it is recognized that an Isola370HR is the leading lead-free product that is ideal for high-reliability applications in a wide array of markets.

An Isola370HR has gained popularity worldwide because it is a High TG laminate; it can tolerate up up-to 180°C of temperature. Moreover, they are specially designed for Multilayer PCB applications requiring high thermal performance and reliability.

It is well-known for its advanced specifications, including UV Blocking and CAF Resistance. Furthermore, it provides better thermal expansion with low CTE and has properties that are highly resistant to moisture and chemicals.

If you’re interested in possessing one, kindly message us for better assistance.

What is an Isola 370hr?
Features of the Isola 370hr

Features of the Isola370HR

The following are the features you can enjoy in an Isola370HR:

  • Thermal Performance – It has a TG value of 356°F and a TD value of 644°F.
  • Industry Recognition – It is RoHS Compliant and UL’s MCIL Program Accredited.
  • Performance Attributes – It has resistance to CAF.
  • Processing Advantages – It has UV Blocking and AOI Fluorescence, is capable of multiple reflows and is compatible with HDI technology and the FR4 process.
  • Core Material Standard Availability – It has a thickness of 0.002” (0.05 mm) up to 0.125” (3.2 mm).
  • Prepreg Standard Availability – It can be roll or panel form.

These features are merely the tip of the iceberg; thus, if you’re interested in learning more, get in touch with us immediately.

Advantages of Isola370HR

One of the crucial factors to look at before purchasing a product is its benefits; thus, we’d like to share some of the advantages of an Isola370HR.

  • Prepregs and Laminates – It has exceptional thermal results with low CTE.
  • Resistance – It has surpassed the ability of an FR4 material in terms of moisture, mechanical, and chemical tolerance.
  • Optical Positioning and Soldermask Imaging – Due to its laser fluorescing and UV impeding, they are perfectly suitable for such operations.
  • Handling and Accuracy – It surpassed the capability of an FR4 due to its excellent handling processes. Also, it has exceptional production precision.

Feel free to contact us today, and we’ll provide you with our best offers!

Advantages of Isola 370hr

Manufacturing High-Grade Isola370HR is PCBTok's Expertise

Manufacturing High-Grade Isola 370hr is PCBTok's Expertise
Manufacturing High-Grade Isola 370hr is PCBTok's Expertise

If you’re seeking quality, but affordable PCB products, then PCBTok is your ideal option. We guarantee you a product that is cost-efficient but isn’t mediocre quality.

All our PCB items, including Isola370HR PCB products, have passed ISO and UL certifications.  It is undoubtedly crafted using top-tier materials and advanced technologies.

PCBTok has been operating in the industry for over twelve (12) years; we have fulfilled numerous customer requirements worldwide. Thus, we are competent in providing you with your desired PCB specifications.

Additionally, all of our products are thoroughly tested and inspected by our expert team. Kindly call us today to avail our top-tier PCB products at their best deals!

Isola370HR Fabrication

Types of Copper Deployed in an Isola 370hr

There are two (2) different types of copper we deployed in your Isola370HR. We have the Reverse Treat Foil (RTF) and the HTE Grade 3.

In terms of RTF, it strictly demands treating the surface with electrodeposited copper making it smoother. But, it can be expensive and poor peel strength.

While the HTE Grade 3 has an anti-tarnish capability to restrict the formation of corrosion and oxidation. It has enhanced prepreg adhesion.

Both have their advantages when deployed and have their own recommended applications. Thus, we suggest contacting us for further details on this.

Why is 370hr used for Controlled Impedance than FR4?

At first glance, this question can be challenging to answer. However, surprisingly, the answer to this question is relatively simple.

Since the 370hr is categorized as a specific laminate product by Isola Group, it has its own particular dielectric constant (Dk) that has an approximate value of 4.04.

While the FR4 is generic, it usually has a dielectric constant (Dk) value that ranges from 4.0 to 5.0, depending on the manufacturer.

Thus, if you choose FR4 from a different producer, they will always provide you with the one they currently have. Then, its impedance control will not be constant.

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PCBTok – Highly Capable Isola370HR Chinese Producer

We only use circuit boards that have received IPC Class 2 or 3 approval.

In order to ensure the reliability of your board, we do 100% AOI and E-Test on it.

Isola370HR Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

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  • “I’ve been in the PCB business for more than a decade, but I haven’t found any PCB Manufacturer who did better than PCBTok. I’ve constantly received quality PCB products since I started using them five years ago. Also, they are the number one supplier of my boards during those times, and I haven’t experienced any problems with them ever since; all of it is in their superb performance. I strongly recommend them for any PCB concerns and requirements you may have; they are very professional in their jobs.”

    Devin Stanley, Supply Chain Director from Surrey, British Columbia
  • “All of the products I received from PCBTok are of superior quality; they work efficiently without any blemishes. Moreover, I’d like to extend my gratitude to Ms. M, who assisted me and updated me concerning my ordered products; she provided me with all the means she has to address all of my concerns. I highly appreciate the professionalism you’ve shown to me, PCBTok Team! I look forward to our future business transactions; I am extremely pleased with the outcome you’ve given to me and my entire company. Thanks a lot!”

    Xavier Thornton, Process Engineer from Derry, Northern Ireland
  • “It was early 2022 when we discovered PCBTok; we were searching for a reliable company to be our top supplier of PCBs, and we found this amazing manufacturer. They have the friendliest and most accommodating environment; I’ve never experienced such treatment with our previous suppliers. After testing their services and products, we decided on our team to be their constant purchaser. We are highly delighted with the product’s performance and quality that made us make this decision. We hope to experience the same treatment in the future, PCBTok!”

    Richard Chase, Co-Founder of Electronics Company from Gloucester, England
What are the Different Techniques for Isola370HR Thermal Analysis?

We perform various techniques for Isola370HR Thermal Analysis; the DSC, TMA, TGA, and the DMA. We’ll break them down into the following:

  • Differential Scanning Calorimetry (DSC) – It is a highly recognized technique in the industry and is crucial in monitoring the material’s TG value.
  • Thermal Mechanical Analysis (TMA) – It is known to be the simplest way of measuring the TG value of this particular material through an extension.
  • Thermal Gravimetric Analysis (TGA) – It estimates the material’s temperature breakdown; the higher the breakdown, the more stable it is thermally.
  • Dynamic Mechanical Analysis (DMA) – It is responsible for estimating the exerted energy or damping and verifies the Young Modulus properties of the material.
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