Perfectly Tailored Kapton PCB by PCBTok
The Kapton PCB falls under the polyimide sector. In comparison to traditional PCBs, it is more rigid, resilient, inert, and temperature-tolerant.
PCBTok conducts thorough CAM file reviews before production, sends weekly work-in-progress status reports, and all circuit boards are IPC Class 2 or 3.
We also frequently participate in trade events like Electronica Munich and PCBWest. Furthermore, we allow third-party factory audits and inspections.
Avail of our great deals today by sending us your Kapton PCB specifications directly!
Dedicated to Delivering Superior Quality Kapton PCB
Since we stepped into this industry, PCBTok has constantly provided its consumers with the finest quality products and exceptional product performance.
Along with that continuous objective, we can produce all sorts of high-performing Kapton PCBs at a relatively affordable rate without compromising the item’s quality.
We are continuously enhancing the skills of our personnel to deliver our consumer’s innovative outputs. We are capable of customizing Kapton PCB for your purposes.
PCBTok provides timely service and shipment with high-quality output worldwide.
We are an advanced company that can satisfy all of your OEM purchases. Kindly write us your specifications, and we’ll be more than pleased to assist you in achieving them!
Kapton PCB By Feature
The Flexible PCB that we incorporate in this particular board is among the most popular ones in the market because of its wide array of benefits in applications, including easier installation and repair, better thermal management, and reliability.
The Rigid-Flex PCB that we integrate into this particular board can be an ideal option for confined or compact-size devices since they are capable of miniaturization. Moreover, they are commonly found in industrial and military apparatus.
The Multilayer PCB that we incorporate in this particular board has become popular in the medical sector due to its improved functionality and compact design. Additionally, it can offer high capacity and high speed at a smaller footprint.
The HDI PCB that we integrate this particular board into is highly reliable possesses enhanced signal integrity that can be useful for transmitting data and has high reliability. In addition, they are widely utilized in automotive and wearable technology.
The Polyimide PCB that we incorporate in this particular board is among the commonly utilized board type in the market because of its exceptional resistance to heat, chemical, and physical stress. Thus, they are ideal for harsh usages.
The FR4 PCB we integrate into this particular board offers an exceptional resistance-weight ratio. Moreover, it is moisture resistant and has excellent mechanical strength and better insulating capacity which are ideal for various electronic applications.
What is Kapton PCB?
In a simple definition, a Kapton PCB is recognized to have a sturdy electronic circuit. It is also comprised of polyimide polymers, renowned for managing temperature in extremely hot or cold conditions.
Amide and anhydride interact at extreme temperatures and pressures to generate these compounds through a polycondensation reaction. Moreover, this bonding’s tolerance to chemical contamination and stiffness are two significant advantages.
As a consequence. you can utilize this circuit board for various demands, including High-Volume PCB operations. Nevertheless, what makes it the most popular circuit board in the present time is its excellent temperature regulation.
Do not hesitate to contact us if you’re interested in getting one for quicker service!

Primary Characteristics of Kapton in PCB
Below are some significant features of a Kapton PCB:
- It can withstand a range of temperatures, from low to extremely high.
- It can maintain its physical, mechanical, and electrical components between -268.9 to 400 degrees Celsius.
- Its properties have excellent insulation and resistor making it useful in the aerospace industry.
- It can display hot and cold tolerance.
- Due to radiation management, it is utilized in the chemical industry.
- For labeling purposes, it can be essential.
Advantages of Kapton PCB
This particular board has been widely popular in numerous fields of electronics due to its exceptional features and benefits. In this article, we’ll provide you with some of its benefits.
- It is frequently used in a variety of applications. Due to its versatility, it works well in a broad range of product performance.
- It helps increase the flexibility of various electronic devices and can shorten the construction process.
- It is possible to enhance the flow of signals between the various devices.
- The adaptability of Kapton circuitry leads to improved power efficiency; its constant dielectric ensures the smooth transmission of electrical information.
- It is possible to reduce the footprint of the circuitry required for most applications using this board.

Select PCBTok's Premium Grade Kapton PCB


PCBTok has been operating in the professional industry for over a decade, so we are fully equipped with knowledge and experience in producing superb Kapton PCBs.
Furthermore, we fully possess different certifications established by the international guidelines; IPC, ISO, UL, RoHS, and many other accreditations.
Since we are strict with the product’s quality, we are continually investing in upgrading our facilities and enhancing the skills of our engineers. Additionally, we offer 24/7 customer, technical, sales, and engineering services.
In terms of the rates that we offer, we can deliver you a Kapton PCB at a reasonable price without compromising its quality; we can meet your desired budget for your projects.
Immediately call us to avail our best deals!
Kapton PCB Fabrication
One of the significant purposes of establishing a Kapton polyimide circuitry was to minimize the circuit’s size and form while strengthening its efficiency and longevity.
That leads us to why we should integrate it into standard circuitry. First, it is because of its thermal power consistency.
Secondly, it is because of its enhanced adaptability. It has outstanding mobility and resiliency that typical boards don’t possess.
Finally, it is because of its extreme durability. It can still manage and function despite being exposed to high temperatures and other substances.
Kindly contact us if you have any questions relating to this.
Due to their unique thermal resistance property, Kapton PCBs are beneficial in various manufacturing applications. Now, let’s go over some of its other explanations.
It starts by creating flexible circuits that function exceptionally well electrically. Thus, they provide a smooth circulation of electrical impulses.
Secondly, they are essential through both high- and low-density mountain layouts. Consequently, this increases their usage versatility.
Ultimately, the electrical assembly procedure is comparatively more straightforward because of its polyimide material.
Feel free to write us with any PCB concerns you may have.
OEM & ODM Kapton PCB Applications
Since almost all equipment in the medical industry has the potential to get exposed to radiation, they utilize this kind of board that’s tolerant to such.
Due to this board’s exceptional resistive nature and good quality insulators, they are widely deployed in aircraft and aerospace electronics.
One of the advantages of this particular board is its flexibility, which is crucial in almost all digital devices; thus, they widely prefer this sort of board.
In the military industry, it is essential to have a good flow of signals that is hard to interrupt; hence, they utilize this kind of board for such purposes.
Another device that requires a versatile board in their operations is the laptop; therefore, it necessitates this particular board that can suffice this demand.
Kapton PCB Production Details As Following Up
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NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
In this article, we’d like to provide insight and distinctions between an FR-4 PCB and a Kapton PCB. At the end of the article, you’ll recognize the ideal option for you.
- Tensile Strength – Compared to FR4 PCB, Kapton PCB has a tensile strength of roughly 231 MPa. Kapton, which produces a firmer PCB than FR4, is therefore suited for most optoelectronic devices.
- Functionality and Durability – Due to Kapton’s robust nature, they are preferred in a wide array of operations.
- Heat Resistance – Although both boards are flame resistant, the Kapton has more of an edge. Despite the FR4 being resistant to flame, its heat dissipation isn’t remarkable. Also, in terms of thermal cycling, Kapton wins.
- Integration Efficiency – If incorporation is desired, the FR-4 boards won’t work. The ideal option is the versatile Kapton board; it can be altered into any appropriate shape.
Kapton PCBs come in various varieties, each with unique benefits. The principal ones are as follows:
- Pure Polyimides – Innumerable chemicals and halogenated flame retardants are absent from second-generation polyimides. As a result, they are significantly more thermally stable than the majority of polyimides used nowadays.
- Third (3rd) Generation Polyimides – They have flammability resistance-boosting compounds that make them helpful in dampening out electrical fires.
- Filled Polyimides – They contain a polyimide and a filler. The filler guarantees low epoxy contraction, preventing gaps from forming during drilling and setting.
- Low-Flow Polyimides – They are less flexible because they contain a range of fillers, including circulation dampers and resins.