Change Language
PCBTok’s Long-Lasting MEGTRON 6 PCB
The MEGTRON 6 PCB by PCBTok is a high-quality PCB that is built to last. It can be used in a variety of applications, including the construction and maintenance of machines and other industrial equipment.
- Engineering questions(EQ) will be sending within 1-2hours
- Provide WIP (work in process) report to you each week
- Provide 8D quality report for each quality complaint
- Attending the trade shows such as Electronica Munich and PCBWest
Low DK and Low DF MEGTRON 6 from PCBTok
MEGTRON 6 from PCBTok is a high quality and low-cost product for your PCB manufacturing.
MEGTRON 6 is a high quality and low-cost product for your PCB manufacturing. It has a good thermal conductivity, a good dielectric constant, and a high breakdown voltage. MEGTRON 6 is also used in the manufacturing of semiconductor devices and other electronic components.
MEGTRON 6 is a low-k dielectric that offers the lowest dielectric constant and dissipation factor of any available product. It is also extremely thermally stable, allowing it to withstand high temperatures without breaking down.
The MEGTRON 6 from PCBTok is a low dielectric constant (low DK) and low density foam (low DF) that helps you keep your electronics operating at their peak performance. It also provides an excellent thermal interface to help manage heat.
MEGTRON 6 By Laminate and Prepreg
A laminate with Low Dk glass cloth is a flammability-rated, halogen-free alternative to traditional PCBs. High dielectric strength and low dielectric loss with excellent thermal conductivity.
A prepreg with Low Dk glass cloth for printed circuit boards is a polyimide substrate reinforced by carbon fiber cloth and unidirectional reinforcing fibers for better performance.
Laminate with normal glass cloth for printed circuit boards – is made of a unique resin and fiberglass with a plaited structure. Ensures an effective heat dissipation for the devices’ better and longer performance.
R-5775(S) MEGTRON 6 laminate with Buried Resistor Copper Foil for printed circuit boards with FR4 glass epoxy resin laminate with high thermal and electrical insulation and strength.
The high strength, low creep and stress relaxation properties make this preform suitable for parts requiring high strength, high temperature resistance and high performance.
A prepreg with normal glass cloth for PCB is a high heat resistant, easy to process epoxy resin which has a high modulus, low creep and excellent electrical properties.
MEGTRON 6 By Test Method (7)
-
PCB with Glass transition temperature test. It provides reliable and reproducible results on glass transition temperatures of thermosets, thermosetting resins and their mixtures, paints, fillers and mineral components.
-
With CTE z-axis test refers to the type of base material and the method of processing, provides heat treatment and chemical cleaning operation before testing.
-
IPC-TM-650 2.4.24.1 MEGTRON 6 provides the certainty of acceptable dielectric toughness for the level of detail and accuracy required in electronic circuit board reconstruction.
-
The scope of the metal film thickness test method is high frequency cases where a critical metal film thickness has to be defined by means of high-precision testing methods.
-
Used to measure the peel force between stainless steel and copper foil, with a test speed of 15mm/min. It is designed to comply with IPC requirements for peel strength of printed circuit boards.
-
For PCB with water absorption test is designed for customers to measure the water absorption of conductive tracks and other parts in PCBs using a contactless test method.
-
IPC TM-650 2.5.17.1 MEGTRON 6 measures the surface resistivity of printed circuit boards by measuring the ohmic resistance between two electrodes on both sides of the test sample.
MEGTRON 6 by Frequency (5)
-
Low saturation voltage and improved ruggedness are achieved by the use of innovative construction features, which combine the fastest reactance velocity of any transistor with low capacitance.
-
The 4 GHz MEGTRON 6 provides power, performance and reliability for printed circuit boards. The low-noise amplifier delivers excellent DC accuracy, high output power and low noise.
-
6 GHz MEGTRON 6 is a high performance microwave PCB for both production and R&D applications. It offers very low noise, high input dynamic range and speed, excellent sensitivity and fast settling time.
-
The 8 GHz MEGTRON 6 is a one of a kind tool with a design that sets it apart from other sources. With an output power greater than 100 watts, you’ll be able to heat your boards quickly and effectively.
-
10 GHz MEGTRON 6 for printed circuit boards is a high-quality, surface mount RF connector designed for use in 10 GHz applications. Compatible with various types of SMD cable assemblies.
MEGTRON 6 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Advantage of PCBTok’s MEGTRON 6
The MEGTRON 6 PCB is a perfect choice of a printed circuit board for high-performance and high-reliability applications. With its Glass Resin, the MEGTRON 6 has the following unique characteristics: good dimensional stability in high temperature environment; good mechanical strength; excellent thermal performance at high operating temperature; and excellent oxidation resistance at high temperature
MEGTRON 6 printed circuit boards are designed for high-density applications, such as aviation and aerospace, military, retail and machine building. The MEGTRON 6 is a highly reliable and safe circuit board used in heavy machines with non-repetitive load requirements
The Properties of MEGTRON 6 from PCBTok
This material from PCBTok is designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. Due to its advanced material properties, MEGTRON 6 has excellent thermal stability, low loss, high Q value and a wide temperature range -all of which are key characteristics for these types of applications.
Most advanced materials available in PCB industry. Its thermal performance stands out from others, giving you a better solution for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments.
PCBTok | PTFE–based Material MEGTRON 6 PCB
MEGTRON 6 PCB is a PTFE–based material printed circuit board, which is designed for indoor lighting electrical installation and outdoor lighting electrical installation. It adopts high-quality PTFE as the main base material and has good chemical resistance, reduced stress cracking and excellent heat insulation and performance insulation.
Best for heat dissipation and superior operation in high temperature environment. The polymer glass fiber based on PTFE is one of the best thermal dissipating materials, it has a very low thermal resistance, good adhesion and corrosion resistance to the substrate, which is ideal for use in computers, military electronics and other applications.
Highest Standard of Quality with PCBTok’s MEGTRON 6
The MEGTRON 6 continues PCBTok’s legacy of world-class, high quality manufacturing and engineering capabilities. This machine is the most advanced and flexible CNC router available today, offering the highest standard of quality and reliability, producing excellent performance on any materials.
At PCBTok, we’re passionate about our engineering and we take that passion out to the market. All of our MEGTRON 6 PCBs have a high standard of quality and we give our customers the best value on the market.
The MEGTRON 6 boards have been designed with a specific purpose in mind: to provide you with the highest standard of quality possible for your product. This means that you can be confident that your final product will be as good as you want it to be.
MEGTRON 6 Fabrication
PCBTok MEGTRON 6 is a customizable gigahertz speed for PCB which is capable of producing high quality and high performance devices.
This is an upgrade of the previous models, which has a powerful feature to create high quality and high performance PCBs. Comes with an upgraded firmware that allows users to customize their PCBs according to their needs. The new firmware also allows users to control the speed of the machine in order to produce different types of PCBs such as low frequency, mid frequency, high frequency etc.
It is important to take into account the processability of MEGTRON 6 . When it comes to the trace width, it is a critical factor in determining how well a PCB is able to withstand thermal and mechanical stresses.
MEGTRON 6 has low resistance to moisture absorption, so parts made from this material must be protected from humidity or they will corrode quickly. Resistance to chemical attack is not as good as many other thermoplastics; should not be used where there are harsh chemicals or corrosion could occur.
OEM & ODM MEGTRON 6 Applications
Embedded routing technology, provides a much larger address space, faster access times and higher bandwidths. This makes it the ideal partner system to ICT applications of any kind.
This technology improves the performance and power consumption, reduces the complexity of management and maintenance, and increases flexibility for standard applications.
This PCB can process high-speed full-featured waveform signals analysis, includes the functions of voltage and current transformer, frequency meter, capacitance meter and etc.
MEGTRON 6 for Automotive Millimeter-wave Radar is a multi-band, multi-mode radar featuring integrated volume holography and high-resolution microDoppler processing.
A PCB used features accurate, high-tech digital sensors for measuring power, frequency to increase the signal transmission power of your mobile data device.
MEGTRON 6 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
