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MEGTRON 7 PCB Expert Provider | PCBTok
PCBTok is a leading provider of MEGTRON 7 PCB Expert Provider services around the world. We offer our clients quality, efficiency and reliability at all times. Our team of professionals is highly skilled and experienced in the industry. We can work with any type of MEGTRON 7 PCB Expert Provider order you may have, whether it’s urgent or not, and we guarantee that your specifications will be met.
- Certified with UL in US and Canada
- 100% E-test and AOI inspection
- Sufficient raw material in stock to support your orders
- No minimum order quantity for your new order
Highly Heat Resistant MEGTRON 7 from PCBTok
PCBTok is proud to introduce MEGTRON 7, a heat-resistant material that’s sure to make your next project stand out.
MEGTRON 7 from PCBTok is a highly heat resistant material that has been used in various fields. The material is mainly used in the semiconductor industry, where it is used to make chips and other components. However, it can also be used in the construction industry and in the manufacture of electronic goods.
MEGTRON 7 is a highly durable, flame-retardant material that can withstand temperatures up to 1,000 degrees Celsius. With this high heat resistance, you can be confident that your printed circuit board (PCB) will last through wear and tear and even extreme temperatures—all while looking great!
With Highly Heat Resistant MEGTRON 7 from PCBTok, you can have it all—a heat-resistant coating that won’t leave your circuit boards vulnerable to damage from high temperatures. With MEGTRON 7 on your side, there’s no need to worry about heat ever again.
MEGTRON 7 By Test Method
DSC MEGTRON 7 test of printed circuit board for glass transition temperature testing of electronic components, packages and materials in electronic assemblies.
To test printed circuit boards’ thermal decomposition temp. Its control system is based on modern computer software, and its data acquisition is USB compatible.
Test to measure the time taken by the soldering during the rework process and to supply data for statistical analysis of results.
For printed circuit board’s volume resistivity test according to the requirements for verification of resistive coatings on electronic assemblies.
For printed circuit board’s dielectric constant test is made of low-loss non-metallic materials. Meets the requirement of most PCB applications.
For PCB’s water absorption test used to simulate a moisture absorption test at different conditions of relative humidity and temperature.
MEGTRON 7 By Laminate and Prepreg (7)
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A laminate consisting of E glass, polyester, and polyimide resin. It provides dimensional stability for printed circuit boards and is used for high temperature applications.
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Maximizing your prepregs cost efficiency, premium-grade epoxy resin for PCBs. High functionality and enhanced performance with excellent flow and part release.
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A low-Dk glass developed by Megatron for laminate applications. Suitable for laminate that require the stiffness and strength properties of the cured laminate.
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A low-Dk prepreg rheology tester, especially for PCB’s prepreg. Excellent reactivity and rheological properties for coatings and composites.
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R-5785(GE) MEGTRON 7 for printed circuit board laminate with normal glass cloth/ improved processability, Recommended for the most demanding applications.
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Prepreg for PCB manufacturing to improve processability. Superior corrosion resistance and mechanical properties in high temperature environments.
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R-5785(R) MEGTRON 7 is an epoxy resin system designed to make a highly conductive adhesive matrix for printed circuit board prepreg with buried resistor copper foil.
MEGTRON 7 by Frequency (6)
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MEGTRON 7 PCB with 1GHz frequency, support for wireless technologies which allow it to work with virtually all major digital information display devices.
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The MEGTRON 7 with 6 GHz. Feature extensive bandwidths, excellent linearity and high output power capabilities. For applications requiring high-performance RF transceivers.
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This MEGTRON 7 PCB is designed to work with both the MEGTRON 6 and MEGTRON 5 as well as other compatible with a 12GHz cables and printed circuit board.
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18GHz MEGTRON 7 is a PCB with 18GHz bandwidth and featuring integrated RF front end. Suitable for high data rate applications low noise and RF performance.
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The 23 GHz MEGTRON is a printed circuit board with a frequency of 23 GHz, which can be used in the development of electronic applications such as digital radio receivers.
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The MEGTRON 7 is a 29GHz printed circuit board that is specially designed for wireless communication research and development applications.
MEGTRON 7 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Characteristics of PCBTok’s MEGTRON 7
MEGTRON 7 is a high-performance, double sided, customizable solder mask and silkscreen PCB. It has customizable thickness and can be manufactured up to customer standard. The PCB is fully RoHS compliant and has been approved by UL for both the USA, Canada and Mexico.
The board is compatible with many different types of copper layers, including: ENIG (Immersion Gold), HASL (Hot Air Solder Level) and HASL Lead Free. You can choose between white or black solder masks depending on your project’s needs.
MEGTRON 7 is made from advance material which makes it incredibly durable while also providing excellent thermal stability so that it doesn’t warp or crack when exposed to high temperatures like some other types of materials do over time!
Advance Materials Used MEGTRON 7 from PCBTok
PCBTok’s MEGTRON 7 printed circuit board is manufactured using a combination of advanced materials.
The core of the PCB is made from polyimide. Polyimide is a synthetic resin that can be used as a protective layer for electrical components, and also has excellent heat resistance and a low coefficient of thermal expansion. The polyimide core allows for high-speed transmission of data through the circuit board and provides a solid foundation for the circuit to rest upon.
Advance materials are also used in the copper foil conductive metals available, but it has poor mechanical strength, making it unsuitable for use in many applications.
PCBTok | Ultra-low Loss Material of MEGTRON 7 PCB
MEGTRON 7 PCB is a type of ultra-low loss material with an attenuation loss of less than 0.07dB/m at 1 GHz, which is equivalent to the loss in a single mode optical fiber.
The ultra-low loss is caused by the high dielectric constant of the glass fiber and its excellent insulation performance. It can be used for industries such as communications, data transmission, and wireless communication.
MEGTRON 7 is a high quality, high reliability and high-speed copper foil boards with ultra low loss material. It features excellent electrical performance and a wide range of applications. The series is used in the design of power supply, high frequency circuits and other fields.
Top Notch MEGTRON 7 PCB from PCBTok
As a leading PCB manufacturer in China, PCBTok has rich experiences of supplying high quality, low price and fast delivery products to all over the world for many years.
MEGTRON 7 PCB is a premier manufacturer of printed circuit boards and electronic component boards. We have been serving our customers since 2012. Our company has been successful in providing the best services to our clients.
We offer MEGTRON 7 PCB fabrication and assembly services at the most competitive prices in the industry. Our MEGTRON 7 PCB are designed to meet the needs of our clients, and we are always ready to customize any product that is needed by our customers. We also offer comprehensive technical support for all projects that we undertake.
MEGTRON 7 PCB Fabrication
PCBTok MEGTRON 7 is a customizable gigahertz speed for printed circuit boards which is capable of producing high quality and high performance PCBs.
PCBTok MEGTRON 7 is a high quality and high performance PCB. The new model comes with an upgraded firmware that allows users to customize their PCBs according to their needs. Also allows users to control the speed of the machine in order to produce different types of PCBs such as low frequency, mid frequency, high frequency etc.
As a leading manufacturer of PCBs, PCBTok has been providing quality products to customers for over 20 years. Our customers can expect the highest level of service and support from our experienced staff. As a matter of fact, we have an experienced team of engineers who are dedicated to helping you with your needs during any phase of the project.
On top of that, we only use high-quality components in our manufacturing process. This ensures that you’re getting the best possible product when you order with us!
OEM & ODM MEGTRON 7 Applications
Delivers advanced system monitoring and management at the network layer, providing complete visibility into the behavior of ICT infrastructure devices such as web servers, routers.
MEGTRON 7 for Supercomputer is a computer program used to connect supercomputer systems around the world, allowing large-scale data processing and fast communication.
For measuring instrument which is small and lightweight lithium battery-powered device for measuring the resistance, capacitance and inductance of various objects and materials.
The ultra-fast velocity measurement makes it suitable for automotive applications requiring high precision and fast response time with complete millimeter-wave radar system.
High quality and efficient MEGTRON 7 printed circuit board for Antenna, which is designed and developed by our seasoned team of professionals. In compliance with international standards.
MEGTRON 7 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
