What is a Microvia PCB?

The via is integral to a PCB. A Microvia is a type of via.

This type of via accomplishes tasks that other vias cannot.

The most significant of all is its aptness for HDI applications and fine pitch use.

When using a Microvia PCB, certain details must be ensured.

To further explain the information about the subject,

We’ll discuss about it in this article.

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Microvia PCB Made Accurately

At PCBTok, we only produce and offer PCBs that are dependable and long-lasting.

The final products’ dependability and quality are then positively impacted.

With this kind of PCB, signal integrity of devices will be taken care of.

Use a PCB manufacturer that can pursue Microvia-specific design processes like PCBTok.

By doing this, redesign problems may not happen in the future.

We show you information so that guidelines cover all relevant aspects.

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Microvia PCB By Feature

HDI Microvia PCB

Microvia designs are primarily used in HDI PCBs. We can also use Rogers laminates at your request, such as Rogers ceramic laminate.

Impedance Control PCB

Microvia is the choice for Impedance Control PCB, because RF transceiver/receivers require matching impedance.

SMT PCB Assembly

PTH is used with standard boards, but SMT PCB Assembly is required for microvia types in multilayer PCBs to enable interconnects.

BGA Microvia PCB

The more BGAs there are on the PCB, the more you should be using Microvia. BGA, especially those measuring.4mm, require breakout.

Fine Pitch PCB

When microvia is used, producing fine pitch PCBs is simpler. Additionally, 10 oz or 20 oz of copper thickness are attuned with microvias.

Multilayer Microvia PCB

Microvia multilayer PCBs begin with four layers. We produce this useful item, which lasts longer when using gold (ENIG) treatment.

Microvia Versus Through Hole, Buried and Blind Vias

This kind of PCB offers dependability and reliability that will last for many years. But how is the microvia different from the typical via hole used in PCB manufacture?

Typical PCBs use buried, blind, and through-hole vias.

Microvias can be differed because:

  • Compared to a regular Buried Via, microvia eliminates extra layers
  • Compared to a regular Blind Via, microvia results in routing that has better breakout gain.
  • Microvia is drilled using a laset, while through hole vias use mechanical drills.
Microvia Versus Through Hole buried and blind vias
The Microvia PCB Design

The Microvia PCB Design

The technical specification for the design of a microvia is a 1:1 aspect ratio.

Another way of thinking about it is incorporating Microvias in your PCB.

Consider the PCB with Microvias included in your design if:

  • If your HDI PCB needs only a few layers
  • If you need thermal regulation efficiency, use stacked microvia design
  • You are considering BGA breakout in your PCB (reduces layers needed)
  • Avoid overpopulation in a Fine Pitch BGA

What are the Advantages of a Microvia PCB?

The non-disputable advantages of using this type of circuit board are as follows:

  • It is more thermally reliable.
  • It is mechanically hardier than other boards
  • Because there may be more holes per board, the size of the board may be reduced
  • The capacity for EMI is improved
  • This is suitable for RF applications.

We don’t use CNC machines to mill or drill holes in this type of PCB. Doing this will reduce residue on the finished item.

What are the Advantages of a Microvia PCB

Finding a Reputable Microvia PCB Manufacturer

Finding a Reputable Microvia PCB Manufacturer
Finding a Mobile PCB Manufacturer 2

We at PCBTok make sure to offer top-notch PCBs that can accommodate almost any electronic requirement. If you are an engineer, business owner, purchaser, or buyer, consider us your partner in Microvia and other Via PCB types (Buried Via, Blind Via)

  • No minimum quantity is required for your new order
  • 24-hour rapid response service for your needs
  • 500+ people work at our facility.
  • If you require a third-party factory audit and inspection, we oblige

Contact us now!

Microvia PCB Fabrication

Types of Microvias

All kinds of microvias must ultimately finish the three steps. These are via formation, via metallization, and the last, alignment. Microvia types are:

  • Stacked Microvia – the position of one via is on top of another via. It is recommended for two layers of PCB only
  • Staggered Microvia – the vias are on top of each other, but in an offset way. This type is less prone to result in errors.

Whatever type of microvia you design, you need to ensure that the alignment is accurate.

Fabrication of Microvias

There are important objectives to be met when fabricating the microvia PCB. The following should be taken into account:

  • The 1:1 PCB aspect ratio must be used.
  • it must achieve a diameter of 100 mm or less.
  • It must only cause a slight misalignment of the X and Y axes.
  • Layer-to-layer alignment is crucial for ceramic PCBs.
  • A manufacturer with a stack-and-tack machine is required.

That’s why you need a qualified PCB expert to handle the job.

OEM & ODM Microvia PCB Applications

Aviation Industry

This type of PCB is used in products like satellites and spacecraft because its high quality is guaranteed.

Automotive Applications

One of the best markets for OEMs of this type of board is the automotive industry. Consider Rigid-Flex PCB for the automotive application too.

Medical tools

The growth of IoT and smart devices in the healthcare sector has led to an increase in the popularity of new types of PCBs that use microvia.

Consumer items

Even though using this type of board is more expensive, consumer goods do well with microvia because you can always sell them to wealthier clients.

microvia pcb banner 2
Be One of the Many Microvia PCB Users

You will be satisfied when utilizing this PCB

Especially if it comes from the PCB Professional, PCBTok.

Microvia PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

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When do you choose stacked or staggered microvia construction?

For stacked microvias versus staggered microvias consider the following factors:

  • What is the PCB aspect ratio?
  • Cost – staggered is cheaper
  • Complexity of design – staggered is more complex to design
  • How many layers of via are used?
  • If there are more than 2 layers, use staggered, as this proves to have fewer failures.
  • If there are buried via holes, stacking microvias on top can lead to failures.
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