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PCBTok is a Leading Multilayer PCB Manufacturer in China
Are you looking for a dependable PCB manufacturer in China to help you with your Multilayer PCB needs? There is exciting news. PCBTok is your ideal service supplier!
- We can provide you with any type of Multilayer PCB
- We’ll collaborate with you to come up with a customized design.
- We can provide you a free sample before you place a large order
- We provide items that are defect-free
- Our PCB manufacturing is environmentally friendly
Multilayer PCB - PCBTok is Your Best Choice
A Multilayer PCB is a circuit board with more than two layers that are extremely functional. In Multilayer PCBs, there are usually even layers. When compared to single-sided or double-sided PCBs, this item has more connections.
The substrate layer of this circuit board helps to promote functional qualities in electronic applications. On both sides of this substrate are conductive metals. Multilayer circuit boards are often made with conductive core materials and epoxy-enforced fiberglass. As a result, electrical devices with these boards are long-lasting and functional.
PCBTok can give the most competitive price for high-quality Multilayer PCBs, which we create according to the criteria described in this full-length article, thanks to its broad production capabilities.
Multilayer PCB By Feature
There are 4 Layer PCBs available, made with good prepregs. Megtron 6 and Rogers are two of the materials that are included. They can be used in a variety of mid-range electronics applications.
Customers who require standard Copper PCBs but have a limited budget can benefit from the 6 Layer PCB. The copper layer is completely protected from lead or tin corrosion with Hot Air Soldering.
The 8 Layer PCB is very cost-effective. Motherboards, Graphic Cards, SSDs, and laptops have them as essential components. It is used in many digital industries.
The 10 Layer PCBs, some rigid, others rigid-flex, are assigned to mobile device sizes. These also work with gadgets that have a regular shape. The product has a strong PCB core that ensures optimal performance.
Circuit board makers must be trusted by electronic designers and PCB engineers. They must correctly put transistors, inductors, ICs, and other critical pieces on a 12 Layer PCB during assembly.
Our 14 Layer PCB is made of FR4 and sturdy fiberglass. We make this versatile item last longer, just like the finest firms. In addition to various USB PCBs, we also mass produce CPU PCBs.
Multilayer PCB By Board Thickness (6)
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It is designed for purposes that are commonly associated with ordinary FR4 and has a board thickness of 0.8mm. Customers that need a medium TG board may additionally want a High TG 150 or High TG 170 PCB.
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After 0.8mm, the 1.0mm High TG PCB is the next step forward. In terms of tolerance, a thick PCB will perform better. This PCB is also wet and chemically resistant to a degree.
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As an alternative to standard PCB thickness, the 1.2mm Multilayer PCB is a thinner one. These Multilayer PCB are more cost-effective if it suits you. These are used in motherboards, CPU, and other related digital applications.
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The rigid versions of the 1.2mm Multilayer PCB can be used in medical devices and other applications. This type of space efficiency due to thickness is really beneficial for commercial applications.
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PCBTok’s 2.4mm Multilayer PCB is a versatile product with many applications thanks to its excellent stability. It is also quite long-lasting. Because multilayer PCBs like these are in high demand, mass manufacture is normal.
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Immersion Gold is a popular surface treatment for the 3.2mm Multilayer PCB. In terms of advantages, the ability to etch surfaces into various designs would be one of its most appealing features.
Multilayer PCB By Material (6)
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Flexible PCB can be built with Isola Multilayer PCB. Its versatility in limited environments sets it apart. When selecting a polyimide material grade, the end-product design is considered.
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Arlon PCBs are versatile products we offer. High-frequency Arlon PCB and High-voltage options are also available. Arlon, a business that specializes in high-performance laminate and prepreg materials, manufactures this Arlon Multilayer PCB in the United States.
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One of the most essential advantages of Multilayer Rogers PCB is its versatility. Core packaging, wireless body area networks, and ATE/chip testing can all benefit from Rogers laminates and prepregs.
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PCBTok uses UL-certified flame-retardant FR4 PCB material in their PCB manufacturing process. Shengyi Multilayer PCB can withstand the extreme conditions that semiconductors experience and is reasonably long-lasting.
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Customers buy the NanYa Multilayer PCB in huge quantities because of its long lifespan and great functionality. The capacity to withstand harsh environments is a fundamental characteristic of this PCB.
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Advanced dielectric goods are possible with Nelco Multilayer PCB. We carry a variety of PCBs for High Tg applications, not just Nelco, due to our experience. Rogers and Panasonic resources are included.
Multilayer PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
PCBTok Multilayer PCB Properties
A variety of PCBS are covered under the Multilayer PCB. For this sort of PCB, the following general information is usually given.
Base Material: Fiberglass Epoxy Resin and/or Polyimide Resin
Minimum Thickness: 0.1mm
Minimum Dieletric Layer: 2mil thick
Minimum Line Width: 2.5mil
PCB Aspect ratio (Laser): 1:12
If you require any other specifications not listed here, please contact us regarding your Multilayer PCB order.
PCBTok Multilayer PCB Production
In China, we are a world-class quick-turn PCB manufacturer, and we are well-equipped to construct your Multilayer PCB.
We specialize in producing multi-layer PCB boards. We manufacture a wide range of PCBs utilizing modern manufacturing techniques.
We offer a wide selection of products as well as PCBA services. Prototype development, low- to medium-volume pre-production, and high-volume mass manufacturing are all included in our services.
Please contact us for further details, and we will willingly assist you.
Your Dependable Multilayer PCB Supplier
At PCBTok, we understand why consumers need bespoke Multilayer PCBs.
They are used in prototypes, mass production, and other gadget applications.
In order for the electronic components to function properly, this vital component must function flawlessly.
This is why we exclusively work with standardized PCB materials. Our raw material providers follow international guidelines.
We give you peace of mind as well. If you have a problem, we can perform a full 8D analysis to figure out what’s wrong.
PCBTok is a dependable brand.
Multilayer PCB High Standards
PCBTok does not take shortcuts when it comes to quality. We want to retain our good name, hence, we will make you happy with the quality of our delivery.
This is a higher-level board material for your Multilayer PCB. The construction of the multilayer board should be examined carefully. To achieve this ultimately, we have a team of dedicated employees.
If you’ve got any questions about this material, call now. We’ll gladly assist in any way we can.
PCBTok Multilayer PCB Fabrication
With our extensive manufacturing capabilities, we can produce any form of Multilayer PCB. In our PCB assembly, we use Filled Via, VIPPO, Buried Via, and Blind Via.
We at PCBTok recognize the importance of product design for this advanced type of PCB. Our in-house expert engineers are one of our benefits.
You’ll get your PCB schematic and drawings, and we’ll go through the information with you and offer you any help you need.
As a result, you may put your Multilayer PCB orders in our hands. Please contact us for more details.
PCBTok is a good Multilayer PCB manufacturer with a wide selection of circuit board-related items.
We’ve been making these kinds of PCBs since 2008, and we’re a dependable Chinese company.
You can trust us because our brand is well-known among customers all over the world.
We have refined the production of a variety of Semiconductor PCBs using sophisticated manufacturing knowledge.
Please contact us right away to take advantage of our Multilayer PCB knowledge!
OEM & ODM Multilayer PCB Applications
We can create new wireless multilayer PCB prototypes as well as radio frequency circuits and WiFi technology PCB prototypes.
There are very common in Multilayer Bluetooth applications for PCB. They can be extremely small, like in Bluetooth earbuds.
PCBTok’s Multilayer PCB has a wide range of automotive applications. These are available in both electric and hybrid automobiles.
Multilayer PCBs made of advanced materials like Rogers, Arlon, and Taconic are frequently employed in aircraft applications.
There have been many changes in the medical industry as a result of recent events. Multilayer PCB for Medical Applications is required for all types of medical equipment.
Multilayer PCB Production and Capabilities
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Product
Multilayer PCB: The Ultimate FAQ Guide
In our daily life, multilayer PCBs are used more and more popular. As the name suggests, the multilayer PCB is an electrical board made of multiple conductive layers. These layers are separated by insulating layers, with the inner ones being double-sided and the outer ones single-sided. The most important characteristic of this type of board is signal integrity. Copper traces can vary in impedance, making it critical to control the temperature of the board. Listed below are some of the key questions to look for in a multilayer PCB.
It is a frequently asked question. This question will discuss the various layers that go into the process of making these circuit boards. While they can be made using traditional hand-made techniques, mass production houses are increasingly turning to automated robotic machines that produce multilayer PCB boards.
The process begins with prepreg, which is a “B stage” fiberglass. Once this material is heated, it bonds to the copper layers. The copper foil is then applied to the top layer. Once this is complete, the multilayer PCB is assembled in a hydraulic press.
It is important to note that the process of multilayer PCB production can take up to two weeks, so it’s essential to plan ahead. A multilayer PCB can have several types of vias. Through-holes can be drilled into the surface of the PCB, allowing components to be placed close to the surface.
This helps reduce the trace distance while enhancing the signal integrity. Blind vias are drilled using lasers and can be as small as 0.1 mm in diameter. They can be plated with solder or a special type of metal to make them more durable.
Single and double-layer PCBs are a good choice if your circuit requires minimal complexity. But if your product has complex components, it’s not possible to use a single-layer PCB. The first constraint is space on the board. Single-layer PCBs will take up too much space, while double-layers will make the product bulky. However, multilayer PCBs are great for compact products.
You will have a look at this video:
There are several important differences between single-layer PCBs and multilayer PCBs. Multilayer PCBs are generally more durable and expensive, while single-layer PCBs are lightweight and can be manufactured in a shorter period of time. Listed below are the main differences between single-layer and multilayer PCBs. Read on to find out which type is right for your next project!
Single-layer PCBs consist of one lone layer of conductive metal and a protective solder mask. Copper is the conductive metal used in most manufacturing processes, and single-sided PCBs contain only one side of the device. The other side houses the conductor patterns and wiring. Single-layer PCBs are cheaper to manufacture than multi-layer PCBs, but they have fewer connections and lower operating capacities.
Multilayer PCB Vs Single-Sided PCB
While single-layer PCBs are more cost-effective and easier to produce, they don’t provide the same level of performance. They are best suited for simple devices, low-cost projects, or devices with a short production time. Single-layer PCBs are less durable than multi-layer PCBs, and they often contain weaker materials and less space for the wire.
Multi-layer PCBs have many advantages. They are more durable and thin than single-sided PCBs, and they can support higher-density electronic circuits. Adding layers will make it easier to mount electronic components, but will also create more space for connections. Multilayer PCBs are more expensive than single-layer PCBs, but they offer high performance and durability.
You will be faced with many options when choosing a multilayer PCB manufacturer in China. While there are plenty of large manufacturers who have worked with some of the most recognized brands, smaller Chinese companies may not be as well known.
You must receive many emails or calls every day and you’re frustrated with how to choose one good PCB supplier. There are some tips that help you to find a reliable PCB manufacturer.
First, you will email them whether they have existing customers in your customer or not, and ask them to provide their contact information, then you will contact the existing customers to get some useful information. Therefore, you will decide whether use this PCB supplier or not.
Second, consider the qualification of the PCB manufacturer. Its qualification can be evaluated from various aspects, including ISO9001 quality management system certification, UL certification, relevant production requirements of the EU ROHS, and past cooperation cases.
Third, you will send the NDA(Non-Disclosure Agreement) to sign if you have this document. After that, you will send RFQ to qualify their price level. If their price is much higher than your current supplier, you will pass them. In fact, you can send different RFQs from single-sided, double-sided, and multilayer, you will price and delivery time with the current manufacturer.
Lastly, make sure the company has a factory in China that produces your particular components. This will ensure that they are able to meet quality standards and understand the complicated logistics associated with international shipping.
If possible, choose a factory that has experience in manufacturing your particular product and has sufficient technical expertise. If possible, choose a manufacturer with multiple locations. If possible, visit several factories to see how they work before selecting one.
There’re several layers in a multilayer, so it’s easy to happen the delamination. You will see several main reasons as follow:
- When you choose the substrates, such as the core and prepreg. You need to choose qualified materials with reputable guarantees;
- The lamination process is well controlled, especially the multi-layer board with inner thick copper foil. Under thermal shock, the delamination of the circuit board appears in the inner layer of the multilayer board, resulting in the scrapping of the entire batch.
- The quality of plating copper. The better the density of the copper layer on the inner wall of the hole, the thicker the copper layer, and the stronger the thermal shock resistance of the circuit board. The circuit board has high reliability and low production cost, and every step of the electroplating process control needs fine control.