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Nanya PCB Technology by High-Performance PCBTok
PCBTok have options of single-sided, double-sided, and multi-layered Nanya PCBs. We manufacture Nanya PCBs that are cost-effective and also competitive with other wiring systems. Nanya PCBs deliver outstanding reliability, with a proven reliability of 20 years.
- PCBTok’s Nanya PCB is has good product certification and service life.
- We manufacture these PCBs compliant with EU laws.
- Nanya PCBs are available in large quantities here at PCBTok.
- Only manufactures PCBs that are ideal for use in high-frequency devices.
Nanya PCB Solutions Manufactured by PCBTok
Nanya PCBs we build are dependable, reducing rework and ensuring superior performance. Featuring typical FR4 material with HDI and high-frequency capabilities, they are simple to utilize in production.
It offers lower board temperatures and improved warpage. It also has through-hole reliability and environmental friendliness.
Nanya PCBs are high layer count, with diverse electrical characteristics and good durability, making them an ideal choice for advanced applications. We at PCBTok make sure we have top-notch manufacturing for lasting reliability of Nanya PCBs.
Nanya PCB company is based in Taiwan Region of China, with strong operations in Taiwan region and mainland China. PCBTok, a reliable Chinese PCB manufacturer company, ensures a good partnership.
Nanya PCB By Feature
Free from halogenic materials for eco-friendly performance without compromising quality. Common materials include NPG-170DR, NPG-199, NPG-188H, NPG-170N, NPG-200R, and NPGH-150LKHD. Eco-friendly materials.
PCBs from NPG-182H and NPG-186 are designed for high-temperature applications. A material that will be suitable for the application that requires heat resistant materials. These can withstand high working temperatures.
These PCB has materials like CEM-3-01HC, CEM-3-98, CEM-3-09, NPG-180BH, and NPG-175FR. Has excellent electrical conductivity. For high-speed and power-intensive applications, efficienct in critical operations.
Made using materials such as CEM-1-97 and CEM-1-97PM. Lightweight yet durable. Commonly found in single-sided designs. It is usually found in cost-effective solutions for consumer electronics.
PCBs that are crafted with materials like CEM-3-09HT, CEM-3-01PY, and CEM-3-92PY. Usually ideal for double-sided applications. These materials has improved insulation and mechanical properties over CEM-1.
These utilizes materials such as NPG-1800INBK, NP-140TL, NPG-150DR, and NPG-150N. These flame-retardant boards which are for durability and electrical performance for broad range of applications.
Nanya PCB by FR4 Laminates (9)
Lead-free material has a decomposition temperature of 350°C and is UL certified. It offers a thickness range from 0.002 to 0.047mm.
Has a dielectric constant of 2.20 and a dissipation factor of 0.0009, this material has a decomposition temperature of 540°C. Its thickness ranges from 0.010 to 0.125mm.
A halogen-free, high-temperature material for demanding applications. It offers outstanding thermal stability and reliability and is the most common material used.
Halogen-free material has a glass transition temperature between 170°C and 175°C. With a decomposition temperature of 360°C. Thicknesses from 0.002 to 0.047mm.
A halogen-free material with a glass transition temperature between 205°C and 215°C and a decomposition temperature of 383°C. Thickness range of 0.002 to 0.047mm.
Copper-based material with a glass transition temperature of 170°C to 180°C and a decomposition temperature between 340°C and 351°C. Ranges from 0.002 to 0.047mm.
A halogen-free material with a dielectric constant of 3.60 to 3.52 and a dissipation factor of 0.011 to 0.014. TG is between 150°C and 155°C, thickness of 0.002 to 0.039mm.
A copper-based material with a glass transition temperature of 170°C to 175°C and a decomposition temperature of 351°C. Thicknesses from 0.002 to 0.047mm.
Halogen-free material has a glass transition temperature of 170°C and is available in thicknesses ranging from 0.0012 to 0.047mm for applications that needs ecofriendliness.
PCBTok’s Nanya PCB Compliant with Global Standards
PCBTok’s Nanya PCBs materials are manufactured by the Taiwan-based Nanya PCB facility, which has earned ISO-9001, ISO-14001, and OHSAS-18001 certifications.
Nanya has current patent which are US-10798828-B2, JP-2020109836-A, US-20200214145-A1, and US-20190350084-A1. This proves that it has ongoing innovation in PCB and IC substrate technology.
Nanya PCBs are also compliant with EU laws. These PCB materials went a thorough certification process. It’s service life and performance are evaluated using a comprehensive research methodology. It has test standards using advanced testing equipment.
Characteristics of Nanya PCB from PCBTok
PCBTok’s Nanya PCBs exceed industry standards with low fiber content and exceptional CAF tolerance. Commonly used in IC substrates, HDI, and MLB PWB styles. Mostly applied in complex electronic systems.
The physical design of Nanya PCBs supports and attaches electrical parts through conducting paths, patches, and other elements, utilizing layers of embossed copper on a non-conducting substrate.
These PCBs has significant mechanical strength and bending resistance. The components attached to this PCB remain in a flat condition during use. You can stack up to 40 layers and adjust copper thickness on Nanya PCBs.
Nanya PCBs on PCBTok Electronics Assembly
Nanya PCBs from PCBTok serve as a critical interface for both active and passive components or IC substrates. These versatile PCBs are classified into “Conventional PCB,” “High Density Interconnection (HDI),” and “Rigid-Flex” structures.
Nanya manufactures advanced microprocessor flip-chip polymers, graphical microcontroller ball grids, and chip-size substances, providing innovative solutions widely used in digital equipment.
These PCBs also possess thermal properties comparable to FR-4. It has excellent performance. Its just that they are less suitable for double-sided PCB assembly due to their structural properties.
PCBTok Manufacturing Capability of Top Quality Nanya PCB
PCBTok provides customers with the highest quality Nanya PCBs that are suitable for wide-ranging demanding applications because of the outstanding manufacturing processes involved in the production of these boards.
Nanya PCBs are easy to make and don’t need any special environmental situation which makes them cheap to make. These PCBs have high thermal transfer capability, which low-Z-axis-thermal-expansion coefficients to ensure device stability under high heat. Nanya also provide the halogen-free and low CTE PCB.
With a loss tangent closely related to frequency, multilayer Nanya PCBs enable higher module mass while maintaining excellent thermal and mechanical properties for diverse industrial uses.
Nanya PCB Fabrication
Consequently, the surface finish for Nanya PCBs in PCBTok is highly dependable with low moisture absorption characteristics, and best of all, better anti-oxidative performance than FR-4.
PCBTok’s surface finish process is absolutely suitable for lead-free processes and is RoHS compliant.
Nanya PCBs are not fit for high temperature applications in PCBs but they serve a highest degree of through hole reliability in many devices. Great choice for environmentally friendly, long-lasting performance in many applications.
PCBTok offers a variety of Copper Clad Laminate (CCL) options for Nanya PCBs. These includes Epoxide Cellulose Paper Core and Epoxide Cellulose MAT Core with Glass Cloth Surfaces.
These CCLs are ideal for different applications, such as Firing Resistance Rigid CCL used in conventional PCBs for motherboards in desktops, notebooks, and home electrical appliances.
Additionally, HDI is perfect for smart phones, game consoles, GPS, PDAs, automobiles, and MP3 players, while Rigid-Flex is designed for high-end portable devices, notebooks, computers, game consoles, and handsets.
OEM & ODM Nanya PCB Applications
Nanya’s CEM-3-98 laminate balances performance and cost, providing lightweight, durable PCBs that meet the demands of electronics like smartphones, home appliances, and other everyday devices.
Nanya’s CEM-3-09HT can withstand high temperatures on automotive applications. A reliable PCB performance in the high-heat environments found in vehicles and industrial equipment.
Nanya’s NPGN-150 laminate offers flexibility and durability for wearable tech applications. Is lightweight, flexible, and reliable PCBs for modern wearable devices.
Nanya’s FR-4-86 is widely used in telecommunications due to its high electrical insulation properties and strength. A reliable, high-performance PCBs used in smart home devices and telecommunications.
Nanya’s NPGN-170R laminate is perfect for medical devices due to its superior mechanical strength. For portable diagnostic devices and other medical-grade applications that needs high resistance to stress.
Nanya PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) | 0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) | 7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W | 1mil Deviation of Master A/W | ||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) | 0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area | ||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
