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Low-Cost and Sustainable PCBTok's OSP PCB
If you’re looking for the most reliable OSP PCB, PCBTok have what you need. You can count on our professional team to help you with everything from design to manufacturing and delivery. We offer a wide range of services including:
- Offer COC report, micro-section, and soldering sample for your order
- Payment term is very flexible depending on your order
- Files receive full CAM review prior to manufacturing
- Attending the trade shows such as Electronica Munich and PCBWest
Resource Efficient PCBTok’s OSP PCB
If you’re looking for a low-cost and sustainable PCB, our OSP PCB is a great option. Our OSP PCBs are more cost-effective than other finishes because they do not require a coating layer when manufactured.
When designing your board, it’s important to keep in mind that the components will be exposed to moisture and other elements during the manufacturing process. With our OSP finish, no additional materials need to be added on top of the bare copper surface—just solder! This allows us to offer you an extremely cost effective solution without compromising quality or sustainability.
Our OSP finish also reduces waste by up to 90% compared with traditional techniques such as ENIG (electroless nickel immersion gold) or HASL (hot air solder leveling). In addition to being more environmentally friendly than other finishes, OSP boards are more durable than other methods because they don’t require any extra coatings or plating processes after they’re manufactured.
When you choose PCBTok for your OSP PCB, you are choosing a company that has been around for over 12 years, and is one of the most trusted names in the industry. In addition to our outstanding reliability, you can be assured of receiving prompt service and delivery. Our customers love us because we deliver on our promises.
OSP PCB by Type
Rigid PCB is suitable for high-frequency applications. It is developed to be the ideal solution for industrial signaling and control applications.
The ideal solution for high-end design that requires flexibility. Beyond a bendable, foldable piece of plastic, it carries the same performance as its rigid counterparts.
The Rigid-Flex PCB range is a family of innovative flexible circuit boards that can be used in nearly any for high-reliability PCB applications.
Known for their ability to offer high-density placement of surface mount components, while having the structural integrity required by today’s high-speed packed PCBs.
It is widely used in electronic products such as high frequency wireless communication, medical device, video surveillance system and wireless earphone.
Single-sided PCBs have applications in a variety of settings. The lack of plated holes and pads reduces the cost, weight and assembly time by half.
OSP PCB by Layer (6)
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High quality OSP printed circuit board available in small quantities. 2-Layer OSP PCBs are ideal for people new to PCB manufacturing and prototyping.
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This is a 4 Layer OSP PCB which is compatible with all the prototyping boards. It has enough layer to connect any components and has a wide variety of features.
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Used in high performance electronic products, such as: RFID tags, smart card reader. Improve the connection environment between the electrical components
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Our 8-Layer OSP PCB provides excellent electrical and thermal conductivity, excellent dimensional control and low interlayer cracking for better functionality.
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Long distance transmission and high impedance matching, multi-channel double shielding can achieve impedance matching without splitting transmission lines.
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30-Layer PCB is extremely fast and stable PCB for advanced users. Excellent ESD protection, high layer counts and good thermal performance.
OSP PCB by Features (6)
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Wearable OSP PCB for electronic products, such as smart watches and activity trackers. It can directly replace the wristband of existing wearable devices to provide a more secure, durable and flexible solution
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Power Supply OSP PCB is a power supply that provides power to your device. This part contains an IC chip, an electrolytic capacitor and a fuse. It’s high efficiency conversion circuit will help you save more energy dollars.
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Bluetooth OSP PCB is designed for the IOT application, it’s a communication test product specially for Bluetooth. It uses an open-source protocol stack and comes with a built-in battery.
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OEM OSP PCB from PCBTok is a new type of high-performance, high efficient and high reliability flexible circuit board. It has features of low cost, easy installation, quick respond and high productivity.
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Our OSP PCB is a low power LED PCB that can be used to create your own customized LED lighting. Each PCB contains the IC driver and LED driver circuits on a single board for better device performance.
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The Microwave OSP PCB is a high-density, high-performance device that can be used for signal processing applications requiring large bandwidths and improved dynamic range for applications of microwave PCBs.
PCBTok’s Mastery in OSP PCB Fabrication
In the PCB fabrication process, we carefully consider every step. From a precise understanding of the customer’s needs to an exact design of the product, from high-quality materials as well as strict quality control procedures to assembly and packaging—all for your peace of mind.
With regard to ecological capabilities, we take advantage of our advanced equipment and strictly follow UL certification standards after careful evaluation by independent third parties.
While on the topic of cost-effectiveness, our customers can always count on us to deliver high-quality services at competitive prices due in part because we have a large selection of qualified suppliers available for various parts in addition to our own factory facilities.
Finally, shelf life is another major concern when it comes to electronics manufacturing process.
PCBTok’s OSP PCB Manufacturing Process
OSP PCBs are made with non-toxic and non-hazardous materials. The solder used to bind components to the board is lead free, making it safe for even the most sensitive electronics. The manufacturing process we use uses a low temperature curing process that doesn’t involve any harmful chemicals or solvents.
At PCBTok, we have a unique approach to the manufacturing process. We start by designing your board in our design tool and then we send that data over to the factory. The factory uses that information to make your custom circuit boards according to your specifications.
Once the boards are made, they’re shipped back to us for assembly and testing. We take the time to test each board before it leaves our facility so you can be sure that it will work for you when you receive it.
Why Choose PCBTok’s OSP PCB?
By choosing PCBTok’s OSP PCBs, you can be sure to get the following benefits:
- Environmental protection. OSP PCBs are made from wood pulp and chemical compounds, which means that they are 100% recyclable and environmentally friendly. Additionally, you don’t have to worry about disposal costs because these products can easily be disposed of in a chemical way.
- Cost savings. Compared with other traditional materials like FR4 (polyimide epoxy glass) or glass epoxy laminates (GEL), OSP is cheaper because it uses less material while still maintaining similar mechanical properties. You’ll also save money on manufacturing costs due to its high thermal conductivity and low dielectric loss factor (0.5-2%). This means that less heat will be generated when using this material compared with most conventional insulators like FR4 or GEL; therefore, you can save money on cooling costs as well!
PCBTok’s OSP PCB Ecological Capabilities
At PCBTok, we are committed to providing high-quality products and services while being environmentally responsible. In order to meet this goal, we have been working on our ecologically capabilities for years. With the implementation of these capabilities, our customers can be confident that their orders will be completed with the least amount of impact on the environment possible.
PCBTok has a strong commitment to the environment. We are an ISO 9001:2008 certified company, and we use only environmentally friendly materials. Our manufacturing process is also very eco-friendly.
PCBTok is an environmentally responsible PCB manufacturer, and we are committed to reducing the amount of waste that goes into landfills. We are always looking for ways to improve our processes and reduce waste, so we can better serve our customers.
OSP PCB Fabrication
The cost of a printed circuit board is only one piece of the puzzle. You also need to consider how much it will cost you to get your product developed, manufactured and shipped—and that’s where we come in.
We’re able to provide you with high-quality printed circuit boards at an affordable price point by taking advantage of our own in-house manufacturing capabilities and using only high-grade materials. That means that we can pass on those savings to you!
Additionally, our services have been designed around reducing waste and optimizing efficiency. The result? You get a beautiful product without having to worry about spending more money than necessary.
PCBTOK’s shelf life is determined by a number of factors, including environmental conditions and the materials used in manufacturing.
As you might imagine, humidity can have a big impact on the shelf life of your PCBs. High humidity levels can affect your boards’ performance and cause them to warp or even become damaged over time. That’s why we recommend storing your OSP boards in a low-humidity environment like our warehouse, which has a humidity level of less than 50%.
The UV rays in sunlight can degrade the plastic resin that covers your board, causing discoloration and weakening the board’s structural integrity. Keep your OSP boards out of direct sunlight whenever possible.
OEM & ODM OSP PCB Applications
For medical devices and other industries. Our state of the art fab can handle all types of boards, both small and large quantity orders, with fast turn around and quality.
Used for the conducting and controlling of lights via a specific way. It consists of a circuit board with tiny pins that you can use to connect LED strip and power source.
Easy-to-use and low cost, these boards are ideal for OEMs and small volume manufacturers. Protected against overheating, overcharging and short circuiting of devices.
Engineered to meet quality requirements of the automobile industry. It provides excellent thermal and fluids resistance, high mechanical strength and excellent flexibility.
OSP PCB for Aviation Industry is designed to provide reliable, high performance and cost-effective products and we are well known as a dependable source for aviation for years.
OSP PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
OSP PCB: The Ultimate FAQ Guide
If you’ve never heard of OSP PCB, you may be wondering what it is and how it works. OSP (Organic Solderability Preservative) is a water-based organic surface treatment that is applied to copper solder pads prior to soldering. OSP is lead-free and environmentally friendly, and it also produces a coplanar surface. It is also environmentally friendly and can be used on any type of board.
When preparing OSP PCBs for use, remember that the surface finish is delicate. Because OSP is prone to oxidation, it should not be stored in hot or humid environments. The best conditions for storing OSP PCBs are 30% to 70% relative humidity and 15 to 30 degrees Celsius. The ideal storage period is less than 12 months. In addition, you should protect the board from heat, humidity, and direct sunlight.
The OSP PCB Ultimate FAQ Guide is a comprehensive guide to using OSP on PCBs. It contains information on material types, manufacturing processes, and surface treatment options. It also discusses storage requirements and drawbacks. The process is relatively simple and inexpensive. If you are concerned about oxidation and scratches on your PCBs, you should try OSP. therefore, producing high-quality OSP PCBs that are both affordable and durable.
If you’re wondering “What is OSP for PCB?” you’re not alone. In the PCB manufacturing industry, leaded components are increasingly being replaced by lead-free materials. On the other hand, lead-free materials are more expensive and can increase the cost of PCB manufacturing. To solve this problem, manufacturers have developed an “OSP” process to make their PCBs more environmentally friendly.
OSP coatings prevent corrosion and oxidation on PCBs. It is applied to the copper board before soldering and acts as a shield for the board. Organic stabilizers help prevent oxidation of the copper board during the soldering process. Immersion Silver finishes are another popular technique. They are composed of metallic and organic components. It protects the PCB before soldering and extends its shelf life.
OSP PCB Sample
OSP on PCBs is applied using a variety of processes. The thickness of the OSP coating can be very thin or very thick. In either case, thickness control is required. pH is one of the parameters used to control the thickness of OSP. In order for the coating to form uniformly, the pH value must be precisely controlled. An incorrect pH will result in uneven and thin coatings, while too high a pH will result in too thick coatings.
OSP is environmentally friendly. It is the ideal method for environmentally friendly electronics. It is a green electronics product because it is environmentally friendly and contains no chemical solvents. It is also easy to assemble and does not require solder resist ink, making it ideal for PCB prototyping. It is suitable for double-sided SMT assembly. So, if you are wondering, “What is OSP for PCB?” Please read carefully to find out the answer.
If you’re wondering, “What exactly is the OSP process?” you’ve come to the right place. Here are some key considerations. OSP is an imidazole-based coating that provides a quality coating for your electronics. The key to OSP formation is maintaining a pH range of 1.0um to 1.5um. The pH can be too high or too low, causing the coating to become too thick or too thin.
The relative humidity should be between 40-60% and the temperature should be between 18 and 27°C. To prevent the coating from sweating, avoid contact with OSP during production. Complete the second side SMT component placement assembly and DIP insert assembly within 24 hours. If you do not follow these instructions, your OSP PCB may degrade and lose solderability.
Fortunately, OSP has many advantages over other finishes. The only drawbacks are that it cannot be used for through-hole PCB plating and has a limited shelf life. In addition, OSP is transparent and colorless, which can affect solderability and reliability. In addition, it is prone to cracking. Therefore, OSP may not be suitable for SMT mounting. Micro-etching is used to prevent copper film oxidation.
When the OSP unit type is Resource, the planned resource usage is propagated. There are three different statuses: Incomplete, Approved and Needs Reapproval. The last one indicates that the line has not been canceled, but is marked as “Incomplete”.
The OSP Process
“What is the material of OSP?” You probably want to know. This article should have answered your question. This article will discuss OSP construction materials and why they are needed for certain applications. Once you have determined your needs, you can begin the process of determining the best OSP cable for your application. Fortunately, there are several ways to select the best cable for your needs. Here are some examples of OSP construction materials.
Water-based organic solderable preservatives (OSP) are used on circuit boards. These substances are safe for the environment and reduce the risk of contamination. They are RoHS compliant and can be easily removed from the PCB assembly process. Due to their transparency, experts can detect them by refraction. They are the best choice for many applications because they are environmentally friendly. Fortunately, these materials are also cheaper than most other surface treatments. This means lower board costs.
the Materials of OSP
Organic Solderable Preservatives, in addition to being environmentally friendly, protect copper surfaces by preventing oxidation and loss of gloss. They must be easily removed with flux because they protect the copper surface. Then, using the melted solder, clean copper can be bonded together. The generated solder joint will cure in seconds. These problems can be avoided by using an OSP-compatible flux.
Copper with an organic coating is an excellent way to protect it from oxidation, thermal shock, and moisture. The method uses a thin, water-based layer of azole organic compounds that adheres to the surface of the copper. The material must be stored under ideal conditions, including high relative humidity (30-70%), moderate temperature (15-30%), and absence of direct sunlight. OSP finishes can be applied to all types of copper products and will last for decades.
There are several advantages to using OSP over other PCB finishes. Its drawbacks include a shelf life of fewer than six months and the need for additional finishing processes such as deionization rinses and form enhancement. Despite these benefits, OSP is not recommended for plating through holes and has low-resolution color. OSP is also difficult to inspect and must be handled with gloves.
Advantages of OSP PCB
For copper solder pans, OSP surface treatment is a good choice. It has the same quality of metal finish as less expensive alternatives. Its thin, uniform film is self-limiting and can be controlled by operating parameters. Compared to other submerged finishes, OSP can be applied to copper solder pans in large quantities. The only drawback is that it cannot be visually inspected. Gloves must be worn to prevent the top coat from dissolving.
The OSP finish is also environmentally friendly, making it a popular choice for PCB production. It is RoHS compliant and widely used. It is suitable for electrical testing and optical inspection, but not for lead bonding. Despite these drawbacks, OSP will remain the preferred choice for PCB manufacturers.
When selecting an OSP PCB manufacturer, look for one with the expertise needed to deliver a quality product. In addition to having extensive experience in your field, the manufacturer should follow certain rules to protect the board during the manufacturing process. These rules include maintaining a clean environment, adhering to modern technical standards, and utilizing international certifications. When selecting a manufacturer, check their history and certifications.
Organic Solderability Preservative (OSP) is a process that prevents copper foil from oxidizing and forming solid dots. In most cases, this process requires the use of a water-based organic compound that will rust. On the other hand, this compound can be applied to the copper surface to keep it clean. Within minutes, the OSP can form a thin layer that prevents the molten solder from forming a solid spot. The transfer technique is essential to achieve the desired results.
OSP surface finish, also known as surface treatment, is an important part of the final product. Some manufacturers use organic water-based compounds to apply RoHS-compliant surface finishes to the copper foil. This chemical treatment reduces soldering time and prevents copper oxidation. Another important factor is topography enhancement. Another important factor to consider when selecting an OSP PCB manufacturer is the micro-etching speed. This process typically moves at a rate of one to two microns per second.
OSP PCB manufacturers can offer several advantages. One advantage is that the process is environmentally friendly. OSP PCBs require less maintenance because organic solvents can be used for copper pads. They can also be lead-free and environmentally friendly. Because of these advantages, they have become a popular choice for a wide range of applications. OSP PCB manufacturers will do their best to help you achieve your goals.