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PCBTok Outranks Chinese Manufacturers in PCB Etching
Outranking other Chinese Manufacturers in terms of PCB etching was never been a smooth sail. However, thanks to our dedicated people and experts, we have built a process that can fulfill all of the customer’s satisfaction.
- Serving truthfully to customers for more than 12 years.
- Fully approved and recognized in Canada and US (UL).
- All day and night; experts are on standby to support you.
- Composed of hundreds of experts to fulfill your purchases.
- AOI and E-Test Evaluations are thoroughly performed.
PCBTok’s PCB Etching Produces Quality Products
PCB Etching is considered to be one of the important phases in producing good quality PCBs. Fortunately; we at PCBTok are fully trained in fulfilling the mission of PCB Etching.
We are equipped with experience and knowledge in PCB Etching; thus, we are fully prepared in delivering you a superb product.
Does this sound fair to you? Give our PCB a shot, and see it for yourself!
As a manufacturer that has a proven long track record in this industry, we at PCBTok only produce PCB Etching that passed the international guidelines and standards.
PCB Etching By Feature
The Aluminum PCB Etching when compared with other PCBs, is the most popular one in the category of metal PCBs. It is comprised of three layers on it, which are the circuit layer, the thermal insulation layer, and the base layer.
The FR4 PCB Etching is comprised of a foundation substance that is flame retardant; that’s what the FR stands for in its name. Some of the advantages of an FR4 are that it doesn’t absorb water, and is relatively inexpensive.
The Ceramic PCB Etching has gained popularity in modern times since it possesses amazing pros compared to the other traditional PCBs. It has the capability to cater to high-component density on a single board.
The Prototype PCB Etching, as its name indicates, it is a customized board made to develop according to its operational ability, and scope of applications. Its pros are evident; to provide you with a specific PCB that has ideal functionality for your purpose.
Heavy Copper PCB Etching is frequently deployed in automotive applications and industrial applications. They are frequently utilized in these industries because they can withstand high power transmission compared to the others.
The Multilayer PCB Etching is comprised of layers that are more than two. In addition, it possesses three layers of conductive layers instead of the two conductive layers that a double-sided have. It is also considered to be more powerful.
PCB Etching By Fluid Solvents (5)
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The Ferric Chloride PCB Etching has a curing time of 30 minutes; recognized to perform its role efficiently. However, the only downside of it is its curing time; it is considerably slow compared to other solvents.
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The Cupric Chloride PCB Etching is the most popular fluid solvent for the etching process since it gives off accurate etches. Cupric Chloride is relatively inexpensive and offers continuous regeneration.
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The Alkaline Ammonia PCB Etching is utilized as a fluid solvent because of ammonia’s boiling point; it is relatively high compared to others. Hence, it creates a hydrogen bonding that is considerably strong.
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The Sulfuric Acid & Hydrogen Peroxide PCB Etching is considered to be under the Acidic Method. It is considered to be a successful move in all phases of manufacturing.
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The Ammonium Persulfate PCB Etching can be a possible alternative for the Ferric Chloride fluid solvent. It doesn’t stain, and it is suitable for tin-etch resist situations.
PCB Etching By Process (6)
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The Wet Etching process is the most popular and common process method. Additionally, it is recognized to have notable versatility and adaptability, and it has outstanding selectivity. Furthermore, this is termed plasma etching.
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The Dry Etching process, specifically the dry physical etching has a fast etching rate, utilizes anisotropy for its side wall profile, and is easy to maneuver. Furthermore, in its etch thin films, it commonly deploys a plasma.
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The Plasma Etching process is considered to be under the dry etching method, however in a most convenient way since it utilizes both physical and chemical etching. Instead of using a liquid etchant, it deploys plasma instead.
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The Laser Etching process is referred to as plasma etch. This is recognized to utilize an immediate imaging method that transfers the layer picture instantly to the surface; the procedure also gets rid of film error.
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The Acidic Etching and the Alkaline come from the same family of the etching processes. However, they have a variety of pros and cons. This is recognized to be time-consuming to perform, unlike the alkaline one.
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Alkaline Etching, just like the Acidic Etching Process, this process is categorized as part of the wet etching process; they have their own unique characteristics. It has a fast and easy process, however, it is known to be costly.
Pros of PCBTok’s PCB Etching
There are varieties of advantages that our PCB Etching possesses depending on what type of process it deploys. In this section, it will be a mixture of its pros regardless of the type of process it undergoes.
- Photo Resist Shedding – It is considered to be of minimal value.
- Etching Uniformity – It’s recognized to be exceptional.
- Affordable Cost – Regardless of your purpose and process utilized, they are relatively inexpensive.
The PCB Etching advantages may vary; however, if you want to be thorough with what you want to see in your PCB Etching, just message us!
PCB Etching Chemicals for Wet Etching
There are two types of PCB Etching chemicals for the wet etching process, namely acidic and alkaline chemicals. In this section, you’ll know the difference between them.
- Acidic Chemicals – This type of chemical utilizes ferric chloride and/or cupric chloride; depending on your application.
- Alkaline Chemicals – Alkaline is known to have water on it, so the following are what comprise it; chloride copper, hydrochloride, hydrogen peroxide, and water are the chemicals deployed in an Alkaline Etching process.
If you’re interested to know more about these types of chemicals, we are available 24/7 to provide you with answers to your inquiries. Just send us a message!
PCB Etching Technique
It is vital to know how PCB etching works and the methods that must be considered when performing this. PCB Etching is one of the most crucial steps in manufacturing a circuit board; it is a process where copper traces is engraved into the circuit board.
Now, there are varieties of a method to perfect your circuit board that was mentioned under the processes section.
In general, the PCB Etching technique is divided into two categories: Dry Etching which utilizes plasma, and Wet Etching which uses chemicals.
If you’re confused about how this works, hit us a message straight away!
Opt for PCBTok’s Thorough and Detailed PCB Etching
PCBTok is praised worldwide because of our capability to produce premium PCBs. This is because our PCB Etching service is unique and perfected.
We possess several certifications that will help us to produce a high-grade type of PCBs through our constant PCB Etching processes. We have established our reputation in providing quality PCB Etching.
We guarantee you that all of our PCB Etching undergoes several quality control tests, and your final product will be error-free.
Should you have any questions concerning PCBTok’s PCB Etching process, just reach us and we have our professionals on standby to assist you.
PCB Etching Fabrication
To put your worries away, we’ll share with you the procedure of PCB Etching.
In this section, we’ll summarize the process of etching into five (5) phases to easily understand how we perform the etching through your PCBs.
The procedure goes from sketching the schematic, transferring the sketch to designing software, printing and transferring the layout to the board, engraving, and testing.
Our PCB Etching is customizable; meaning, you can just send us your schematic diagram or a software file for us to engrave in your PCB.
Message us today for further information on this procedure!
We at PCBTok always make sure that all of your PCBs are etched with perfection.
After the PCB Etching process, it will undergo certain testing to check whether it will be able to perform its goal without any issues along the way.
Here at PCBTok, we have all the advanced testing equipment to check the utmost capability of your etched PCB. We have the most modern ATG testing machinery.
The primary function of this machinery is to perform flying probe tests and fixtureless testers. It also encompasses universal grid testing.
To know more about our quality control tests, inquire with us!
PCB Etching Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
PCB Etching – The Completed FAQ Guide
A comprehensive guide to all aspects of PCB etching. If you’re not sure where to begin, consult this PCB etching FAQ. We’ve compiled a list of the most frequently asked questions by new etching enthusiasts and answered them all in one place. Continue reading to learn about the best techniques, tips, and resources. We’ll also go over some common rookie etcher mistakes and how to avoid them.
The process of removing alignments and other features from a printed circuit board is called PCB etching. This process is called wet etching and can be performed in a normal atmospheric environment. Wet etching can be a difficult process because there are many variables that can go wrong. However, before starting the process, you must ensure that your PCB is free of defects.
You must first clean the copper. It should be clean and shiny red because dirt and grime can interfere with the etching process. Dirty copper can leave unsightly marks on the PCB or shorting traces. You can use an abrasive sponge and detergent to clean the copper. The copper should also be dry and shiny. If you do not want to get your fingers dirty, wear gloves and goggles.
PCB Etching Sample
Toner-based laser printers are another option for cleaning PCBs. This can be done with laser printers, but not with inkjet printers. Toner is a fine plastic powder that is used in laser printers. Afterward, the powder melts and is transferred from the glossy paper to the copper. Text and images last longer on a high-quality surface. If the PCB is made of aluminum, you should etch the copper before applying the paint.
After the PCB is etched, the finished product must be tested. This can be done for any type of PCB as long as it is completely immersed in the solution. This is the most difficult step, but if you follow these suggestions, you will have no trouble getting the job done! It is vital to have the proper equipment, take precautions and practice some techniques before starting your project.
If you want to know how a PCB etching machine works, then you have come to the right place. First, you need a chemical solution consisting of ferric chloride. It can etch any PCB while submerged and should be diluted with about 70 ml of water. The hardest part may be cutting the strips of wood to the correct size. You will also need a motor and some kind of support, but if you know what you are doing, you can easily build a simple one yourself.
After mounting the board, it’s time to transfer the CAD model to the copper-clad PCB. You can do this by using a laser or toner printer to print on glossy paper. Using an inkjet printer for this task is not recommended because the toner used on the paper is too small. Heated toner, which is a fine plastic powder, transfers the model from the paper to the copper-clad PCB.
PCB Etching Machine
The acidic method is usually used to etch the inner layers of the PCB. Because the acidic method does not react with the photoresist layer, undercutting is reduced. However, the process is time-consuming and much slower than alkaline etching. Therefore, alkaline etching is used for PCBTok. In addition, you can choose a different etchant for each layer of the PCB.
Depending on the complexity of the board and the design requirements, the etching process can take a long time. Prepare the layout with the appropriate materials and tools before starting. If the PCB is to be printed on single-sided paper, a high-quality laser printer with a translucent surface is required. It is also important to thoroughly clean the copper surface before starting the etching process.
Water is used to dissolve the etching solution. After immersing the board in the solution, it must be left for at least 30 minutes. The copper on the board will react with the etching solution and cause it to be removed. After the etching process is complete, remove the PCB to ensure that the entire unmasked area has been etched. If this is the case, you can leave the board in solution for longer.
The process is similar to circuit board printing. On the other hand, the circuit board will have two layers. The first layer is made of plastic and the second layer is made of copper and photoresist. After the copper layer is applied to the board, the photoresist, which is a thin layer of paint, is applied. During the etching process, this layer of paint becomes brittle and comes off.
PCB Etching Layer
Acid etching is another method of etching PCBs. This method removes the copper from the base of the PCB, leaving only the circuitry protected by tin plating. This method is preferred because it is more accurate and produces less undercutting than acid etching. Both etching methods are very effective at removing unwanted copper from PCBs. Although acidic solutions are more aggressive than alkaline solutions, both methods are effective and can be used with a wide range of metals.
To achieve a perfect PCB etch, it is important to first understand how to prepare the copper surface. Before starting the etching process, the surface must be clean and shiny. Dirty copper can lead to short circuits and unwanted copper spots on the PCB. You can clean the copper with a sponge soaked in detergent. The copper should be bright red and shiny. Wear protective gloves and avoid touching the copper with your fingers.
Before starting the etching process, you must prepare the board with all the necessary materials. First, prepare the board by printing it twice or three times. Printing the board twice or three times is critical because one ink may not adequately cover the conductor tracks, causing them to wear out during the etching process. In addition, the circuit board is printed on a plastic plate with a copper coating and a paint called photoresist. The paint becomes brittle when exposed to light, so if you don’t want the pattern to smudge, make sure the layout is at least 5 mm from the board.
Prepare the etching board before starting the etching process. You must prepare the board with the appropriate etchant and water solution. During this process, the copper will start to disappear and the alignment will become thin and transparent. To avoid splashing, you must remove your gloves and glasses afterward. After the etching is complete, you must remove the etchant before touching the PCB.