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Precise Inductance of PCBTok’s PCB Inductor
PCBTok’s PCB Inductors are made of high-quality materials and components. The precision inductance of our PCB inductor is well controlled, and the tolerances are very small. Our PCB inductors are tested before they leave our factory, so you can be sure that you’re getting a product that performs as expected.
- Provide a prototype before completing a large purchase.
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Accurate Equilibrium Reaction of PCBTok’s PCB Inductor
The equilibrium reaction of PCBTok’s printed circuit board inductors is a direct result of their design and the way in which they are manufactured. While there are many different types of PCB inductors, PCBTok’s inductors have been designed to be as efficient as possible. This means that they have a high amount of surface area for current flow, leading to lower resistance and higher efficiency.
Additionally, because PCBTok’s inductors are made from copper-clad laminate, they have a larger amount of copper than other types of inductors. This means that there is more surface area for current flow and less resistance overall—leading to higher efficiency as well
PCBTok is a China-based PCB circuit board manufacturer that has been operating since 2012. PCBTok’s printed circuit board inductors are used in the electronics industry, aerospace industry, and other applications where high-frequency electromagnetic waves are present.
PCB Inductor by Core Type
Air core inductors are a type of magnetically active component that works without a magnetic core. The coil is unsupported, and there is only air inside the coil.
Iron core inductors are used for high-frequency applications such as switching devices. Have high saturation levels and can handle more current than other types of inductors.
It uses ferrite as a main core material which has high magnetic permeability and high electrical resistivity. Normally used with power supplier and power management applications.
The magnetic properties of iron powder make it a good choice for many inductor applications. Iron powder cores are produced from very fine particles of iron powder.
Inductors that have laminated thin steel sheets, such as stacks, as the core materials. If the loop area is increased for the current to travel, the energy losses will be more.
A toroidal core is a ring-shaped form made on which an insulated coil is wire wound. It is used at low frequencies where large inductances are required.
PCB Inductor By Components (6)
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A coupled inductor is an inductor with two or more windings on the same core, which takes advantage of magnetic coupling to influence the behavior of each winding on the other.
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Wireless charging coils are a type of wireless power transfer. It uses electromagnetic induction to provide electricity to portable devices without plugging in.
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Shielded surface mount inductors are a type of inductor which contain the magnetic field inside its enclosure, so that other nearby components are not affected.
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A type of electromagnetic component that uses a ferrite core and a wire coil to create an inductor. The coil is wrapped around the ferrite core, which is shaped like a dumbbell.
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Multilayer chip inductors are used in mobile communication systems and applications that require noise suppression at high frequency and impedance matching.
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A type of inductor that uses electromagnetic shielding to fully encapsulate the coil in a form of magnetic shielding, minimizing losses and increasing efficiency.
PCB Inductor by Usage (5)
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Together with a capacitor, the color ring inductance coil frequently creates a resonant and filter circuit in the circuit. The color ring inductor’s main operating principle is charging and discharging.
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Molded inductors are made by pressing or molding a magnetic material around a pre-wound coil and lead-frame to form the inductor. Used in office machines, household appliances and automotive application.
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Radio-frequency inductors are typically made from interwound coils of wire, or by winding a single length of wire into a coil with multiple turns. Available in many different forms, including toroidal cores and ferrite cores.
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Composed of a wire wound around a ferromagnetic core. This magnetic field attracts the electrons in the wire, creating a voltage difference between the end of the coil and its center.
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Adjustable inductors use a movable core to modify the electric field and thereby increase or decrease their inductance by blocking lines of flux. You can modify the strength of this magnetic field.
PCB Inductor Inductance and Impedance
The inductance of a PCB Inductor is a measure of how much energy it takes to change the current in the wire that makes up the coil. The higher the inductance, the more energy it takes to change the current.
The amount of inductance a PCB inductor has depends on its construction and design. Generally speaking, the larger the number of turns in a PCB inductor coil, the higher the inductance will be. For example, if you increase the number of turns in your PCB inductor from 10 to 20, you will increase its inductance by half.
Impedance is another important property when considering how much current can pass through an object. The impedance of a PCB inductor depends on its construction and design as well as its physical dimensions.
What are PCB Inductors?
PCB Inductors are devices that use magnetic induction to create a magnetic field. This is done by passing current through a wire wound around an iron core (or other material). The result is a coil that can be used for many applications, including electrical filtering, timing circuits, and radio wave reception.
PCB Inductors can be made from a variety of materials, but the most common type is made using metal alloy wire wrapped around a core material. The core material is usually made of ferrite or powdered iron, which has high permeability and magnetic resistance.
Guidelines for Placing the Inductor on the PCB
The inductor is an important component in many electronic circuits. However, it is also one of the most challenging components to place on a printed circuit board. The inductor’s size, shape and location directly affect its performance.
Before placing an inductor on a PCB, consider these guidelines:
- Place it close to ground planes. Ground planes provide a low-impedance path for current flow and help reduce electromagnetic interference from other devices on the PCB.
- Place it away from power and signal traces. Power and signal traces generate high currents that can generate undesired magnetic fields around them that can disrupt the operation of nearby components such as inductors.
- Place it near power supply lines so that they can provide adequate current to operate correctly under load conditions when operating at high frequencies
PCB Inductor Solution for the Digital Generation | PCBTok
The Inductor is a component that generates electromagnetic fields, and it’s used in many different types of electronics, such as radios and televisions. The Inductor is made up of a set of coils, which are connected to each other. The coils are usually made out of copper wire wrapped around a core material, such as iron or ferrite. When electricity passes through the coils, it creates an electromagnetic field.
The Inductor is an important component in digital circuits because it helps to control the flow of current through electronic devices. It also helps to filter out unwanted frequencies from signals that pass through devices like radios and televisions. This filtering process is called impedance matching; it makes sure that only certain frequencies can pass through a circuit while others are blocked out by being absorbed by the inductor’s magnetic field instead!
PCB Inductor Fabrication
The varying copper weight of PCB inductors can be used to reduce the cost of a PCB inductor. The performance of the PCB inductor depends on the weight of the copper that is used in its construction.
The weight of each unit area in a PCB inductor is directly proportional to its performance. As the weight increases, so does the performance but at some point, there will be no improvement in performance due to factors such as increased losses or reduced quality factor.
In order for a PCB inductor to be manufactured economically, it must have an acceptable level of performance while still being cost-effective. This can be done by using different weights of copper to manufacture them depending on their application.
PCB inductors are a great way to reduce the size of your electronic circuit and increase its efficiency. But if you’re using them in a high-frequency circuit, you’ll want to make sure that they have the right layer thickness.
The thickness of the copper traces on your PCB will affect the inductance of your inductor and thus its performance.
For example, a thicker layer can result in more resistance and thus lower inductance.
You’ll also want to consider the number of layers used in making your PCB inductors, as well as how many turns are on each layer. The more turns there are per layer, the higher an inductor’s Q factor will be.
OEM & ODM PCB Inductor Applications
PCB inductors are a vital component of any electric vehicle. They are used to help regulate current and voltage, which is essential for the proper functioning of electric motors. Without this regulation, an electric motor would overheat and fail.
PCB inductors for wireless charger are used to control the power flow and to protect the system from high voltage. They are also used for frequency conversion. In some cases, they may be used for matching impedance.
Flyback converters are often used in high-power applications such as power supplies and variable-frequency drives. They use an inductor with a ferrite core to store energy that is then released when the current needs to be reduced.
The inductor is a passive component that is used in many electronic circuits. It can be used as an antenna, or it can help to amplify signals. Inductors are also often used in wireless LANs because they can help to reduce interference from other devices.
PCB inductors are a critical component in small wearable devices, because they help to minimize the amount of power that is wasted on heating. They also allow for more compact designs, which is vital in these applications.
PCB Inductor Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
