PCBTok is Your Extraordinary PCB Plating Provider
PCBTok’s PCB Plating process is thoroughly planned. This is to ensure that it will be from any errors and issues that may hinder the overall circuit board to perform its primary goal.
- A decade and two in the PCB construction industry.
- We offer return services within the 24-hour purchase.
- We are comprised of 500 and more personnel.
- Technical and sales experts are available 24/7.
- Provide constant updates with regards to your quote.
PCBTok’s PCB Plating is Designed to Last
PCBTok has been consistent in offering our consumers a quality-tested PCB Plating process. It is one of our missions to only provide quality PCB Plating because we want our customers to utilize their PCB at a maximum level.
We have our highly-skilled and experienced experts on standby to assist you with any inquiries you have with our PCB Plating and other PCB Types of products.
If you think we are capable of providing your needs, hit the inquiry button immediately!
PCBTok will not want to deliver you a PCB Plating that is low-grade, this might affect the overall performance of your board. Thus, we constantly run our PCB Plating through various tests.
PCB Plating By Feature
The HASL PCB is the most popular finish both in the industry and the engineering consumers. One of the advantages of a HASL is its ability to accommodate reworks easily without any issues, and it is considerably adjustable.
The Immersion Tin PCB deploys chemicals in its process. One of the benefits of utilizing an Immersion Tin in your PCB Plating is that there’s no lead needed in operation, making this follow the standard guidelines and RoHS compliant.
The ENIG PCB process is fairly simple. It is comprised of two metallic layers; gold and nickel, in which the gold layer is on top of the thin nickel. The soldered components are implanted on the nickel layer, and the gold secures it.
The Immersion Silver PCB is famous for engineers because it stops the conductors of copper from deteriorating and oxidation. Also, it offers an excellent finish on its surface. Furthermore, this sort of surface finish can be reworked; it’ll save you from future costs.
The Carbon Ink PCB is the ideal alternative for a Hard Gold one due to its affordability compared to Hard Gold. This is known to be highly sturdy, hence, making it a very reliable one considering its inexpensive cost.
The Hard Gold PCB is considered reliable because of its extreme robustness; this makes this popular with engineering consumers. The only downside of the Hard Gold is its costly price and its poor solderability feature.
PCB Plating By Materials (5)
PCB Plating By Copper Thickness (6)
Pros of Utilizing PCB Plating
Since PCB plating is considered to be the most significant step in creating a high-quality PCB, it is crucial to talk about the benefits that it may provide.
- Issues – The primary aim of PCB Plating is to prevent moisture, contamination, and oxidation through the board.
- Surface Texture – Through plating, it produces a surface that is perfect for soldering; attractive, smooth, aesthetics, and clean.
- Defects and Errors – Plating helps minimize downtime of the PCB, hence making it relatively inexpensive in the long run.
With the PCB Plating method, you will guarantee that all of your PCBs will run in a smooth and perfect condition. Inquire straight away!

Different PCB Plating Styles
PCB Plating can be easily understood with the following two styles.
- Via Plating – This deploys a metallic alloy, specifically copper. The primary purpose of this plating is to provide an ideal trail for current; this is commonly known as plating Through-Hole in the vias.
- Surface Plating/Finishing – It utilizes the following metallic alloy: Gold, nickel, tin, and silver. This process involves covering the PCB surface to avoid corrosion, oxidation, and contamination.
These two plating styles have only one goal, and that is to assist in ensuring the smooth flow of current over board wiring connections. Give us a message to know more!
Ways of PCB Plating
There are four ways of PCB Plating; however, all of them still have the same mission.
- Finger Plating – Using this approach, rare metals like gold can have stronger resistance to abrasion and reduced contact impedance.
- Through-Hole Plating – This is very significant in PCB drilling; since there’s no etchback in this approach.
- Reel Linkage Selective Plating – Since it prints particular copper sheet pieces, this is somewhat comparable to the brush plating approach.
- Brush Plating – This approach is ideal for fixing waste boards.
If you have any confusion and queries regarding this or if you want to know more about these four; reach us out and we’ll be glad to answer you!

Go for PCBTok’s Outstanding PCB Plating Process


PCBTok has been offering high-grade services in the PCB Plating process for more than a decade already; we are fully compliant in terms of the standard guidelines.
For us to produce a quality PCB for you, we have made sure that our PCB Plating is functional. This means that we have tested various ways to determine if it really does its job as plating.
We are hungry for providing you with a PCB that is worth having; hence, we have our highly-skilled professionals to answer all of your concerns regarding our PCB Plating.
If you’re curious as to how we make all of our customers satisfied with our services and products, feel free to contact us; we’ll respond to your concerns in less than an hour or so.
PCB Plating Fabrication
The primary purpose of PCB Plating is to protect the PCBs from oxidation and damage.
Another significant purpose of PCB Plating is to provide the consumers with a surface finish that is clean and smooth; making it perfect for soldering and assembly.
There are varieties of PCB Plating processes, and all of them have their own way to reach their goals as a plating approach.
Regardless of what plating approach you opt for, we at PCBTok will make sure that your PCB will perform the way it should be with zero errors and defect in plating.
Kindly send us a message to know more about this!
PCBTok is fully compliant with RoHS, UL, IPC, and ISO to ensure smooth PCB Plating.
Apart from the certifications and accreditations we have gathered, a series of evaluations and inspections is thoroughly conducted each time we conduct this approach.
We have made sure that we are satisfied with all of these certifications and accreditation to perform the PCB Plating in the highest quality possible.
PCBTok always considers your views as a consumer and user of our PCB Plated PCBs. Hence, we are fully drawn to providing a perfect PCB Plating output.
If this puts you at ease, contact us immediately for quick assistance!
PCB Plating Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
PCB Plating – The Complete FAQ Guide
If you’re considering adding a conductive layer to your board, you’ve come to the right place. There are several types of PCB plating, and we’ve compiled a list of the most common questions and answers. Read on to learn how to get the best results. PCB Plating: The Completed FAQ Guide
PCB plating is a common method for producing electronic circuit boards. It requires the application of ion-conducting metals to the surface of the circuit board. The ion-conducting metal is used as the substrate for subsequent steps of the process, such as chemical copper plating. Various chemicals are used in this process to form a uniform layer of copper on the board. The finished product is ready for use in electronic circuits where high-quality cache specifications are essential.
PCB plating is a key step in PCB manufacturing, as it ensures a perfect surface and the reliability of alignments and vias. Plating is the process of covering a PCB with a layer of material, such as copper, to protect it from the environment and daily wear and tear. PCB plating is also an important part of the final product, so it is vital to understand how it works.
The plating of circuit boards begins with annealed copper that has been softened by rollers. The copper will form a smooth outer surface that serves as the main component of the alignment. The copper is then plated with an ionic dispersion solution to improve the overall board performance. This is the first step in the process, which is critical because copper has the greatest weight and therefore has the greatest impact on the board.
PCB Plating Line
Immersion silver is a common material used for PCB plating. Its benefits include electrical test compatibility and a beautiful finish. However, it is not the best choice for soldering, as it does not bond well to the gold wire, resulting in weak solder joints. It can also lose its luster under certain conditions. Therefore, it is essential to have skilled platers.
When looking for a plater, you must first determine what you need. IPC-2221A is the PCB plating thickness standard, which specifies minimum thicknesses for various product categories. Specialized fabs can be used to meet more specific requirements. Manufacturing instructions typically include plating thickness. Thickness decreases as the substrate become thinner. In general, the thicker the board, the better.
Copper thickness has a significant effect on the overall PCB thickness. The copper thickness will vary depending on the amount of current that must flow through the board. Copper thicknesses range from 1.4 mm to 2.8 mm for the inner layer and 2 ounces or more for the outer layer. However, customers can specify a specific thickness and the manufacturer will adjust the copper to fit it. Increasing copper thickness increases cost and requires more complex processing.
Plating of PCBs The thickness of copper applied to the surface of the board is called the thickness. Chemical solutions, temperatures, and timelines vary depending on the PCB manufacturing process. They also require different surface finishes. IPC Class III is recommended for those who need thicker layers. However, you can choose between plated and unplated PCBs. Make sure you understand the difference! Remember, you can always choose the best option for your project.
The thickness of the board is an important consideration when designing a PCB. While thicker PCBs are more flexible, they are also heavier. The thickness of the board depends on the size and flexibility of the board connectors and components. Listed below are some of the factors that affect PCB thickness. When deciding on the thickness of a board, keep in mind that thinner boards save space and are more flexible, while thicker boards take up more space.
The thickness of a PCB varies greatly. Typically, depending on the size of your PCB, you can choose between 0.008 inches and 0.240 inches. Select the thickness that is appropriate for the application and area of use. The thickness will be determined by the insulation layer and material content. The layers on early PCBs were made of Bakelite and were approximately 0.0065 inches thick.
The thickness of the PCB varies depending on the manufacturing process used. Standard PCB thickness allows for faster and cheaper manufacturing, while custom PCBs ensure proper functionality. Early in the design process, you should discuss PCB thickness requirements with the manufacturer. If your application requires advanced design techniques, you should also seek the advice of a specialized manufacturer. However, this process will be more expensive.
PCB PlatingThickness
Copper thickness has a significant effect on PCB thickness. The thickness of copper depends on the type of current flowing through the PCB. Standard copper thicknesses range from 1.4 mm to 2.8 mm, while external copper thicknesses range from 2-3 ounces. Thicker copper means thicker PCBs and higher manufacturing costs. The choice of copper thickness is critical to the board.
PCB plating is accomplished by a variety of techniques. Brush plating, in-line plating, and direct plating are examples of these. Brush plating requires a special anode (e.g. graphite) encased in an absorbent material to deliver the plating solution to a specific area of the board. For example, a transistor can be plated on one side and an integrated circuit on the other.
In the case of acid copper plating, organic additives called carriers, brighteners, and leveling agents are required. By adjusting the current, these additives improve the physical and chemical properties of the coating. They also improve the grain structure of the board by increasing the effective thickness of the diffusion layer. This method produces high-quality PCBs.
PCB Plating Process
Surface plating is also used on printed circuit boards. In this process, copper is plated onto a copper plate. The metal layers are deposited on the board, one layer on top of the other. A thin layer of tin is applied to the surface traces and through-holes. This metal can also be used to shield sensitive circuits. To produce the highest quality boards, a good contract manufacturer should understand the PCB plating process.
Surface plating, on the other hand, is a much more costly process. Surface plating protects the copper from corrosion and makes it easier to solder components. Through-hole plating, on the other hand, fills the drilled holes with copper, thus providing a current path. Copper is one of the most common metals plated in PCB manufacturing. It also thickens the surface pads and conductors, ensuring a strong connection between the layers.
Surface plating is a method of protecting the PCB’s exposed circuitry. The plating process also creates a solderable surface on the PCB, thus preventing the board from being damaged during assembly. The advantages and disadvantages of this method are discussed further below. Therefore, weigh the advantages and disadvantages of both methods to determine which method is best for your PCB. it is critical to know what you are working with before choosing a PCB plating process.
After cleaning the protruding contact tip, it must be immersed in 10% sulfuric acid. Another common material is nickel. Another process for covering protruding contacts is gold plating. Afterward, the protruding contact tip is placed in a cool environment for drying. If you are curious about how it is done, you can get a PCB quote online.
Copper is used in this process to form a conductive layer on the board. Plating can be applied to any part of the PCB, including the hole walls. When the copper layer is thick, a “pattern” plating process is used. The pattern is created by placing a copper layer on the copper surface of the board. As a result of the copper layer, a conductive carbon layer is formed.
FR-4, FR-12, and copper-clad laminates are commonly used in PCB plating. The thickness of FR-4 glass-reinforced epoxy laminates is measured in millimeters (mm). Typically, four or more layers are thicker, with a minimum thickness of 1.6 mm. Planar layers have a copper thickness of 35 microns. Boards with multiple applications are typically thicker, with copper thicknesses ranging from 5 to 35 microns.
A variety of other metals are used in PCB plating. For example, copper is the most commonly used material because it helps to connect the circuits. In addition to copper, surface traces are used to conduct electrical currents. These types of surfaces are often found between components and connectors. At the same time, copper helps to connect the circuits. Surface traces are flat rectangular surfaces made of copper that help to connect circuits.
PCB Plating Sample
PCBs may contain a large number of vias, which are holes through which signals pass. Through-holes are often tents. There is usually no path underneath the vias. A “through-hole” is another type of hole (a hole through a plated PCB).
The thickness of copper on a PCB is measured in pounds per square foot. This facilitates measurement. 1.344 mils is one ounce of copper per square foot (35 microns). By comparison, a heavy copper layer contains three or more ounces of copper per square foot. This material is used when the current on the board is very high because thick copper is best for heat dissipation.
There are four types of plating used in PCB manufacturing. The type of plating you use is critical to the reliability and surface finish of your board. Learn about the four plating types so you can choose the method that best suits your design. Once you have determined the type of plating, you can begin the construction process. Here are some examples of plating methods to help you through the process. There are two general types of plating: surface alignment and through-hole.
Surface plating is the process of applying a protective layer of tin to the copper traces. The coating protects against moisture, oxidation, and contamination. Edge plating is an excellent choice for PCBs with through-hole and surface traces. In this process, a thin layer of metal is applied to the copper on the PCB. This protects the copper traces while also improving board connectivity.
Copper is the primary material used in PCB plating. Copper was traditionally plated with lead-based tin, but nickel and gold have since replaced it to comply with RoHS standards. Plating also requires component solderability. Copper is not always a viable option. Copper-plated boards are usually more durable than unplated boards.
Brushing concentrates on specific areas of the printed circuit board. To bring the plating solution to the desired area, anodes wrapped in absorbent material are used. Copper plating is often used for surface traces because it protects the pads while also providing a current path. Copper plating is also widely used in electronics assembly shops. It is an excellent choice for assembling electronics and reworking scrap boards.
Copper plating