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Know Everything about PCB Prepreg
PCB prepreg is the application of a pre-impregnated resin to the surface of a printed circuit board panel. PCB Prepreg has good mechanical properties and can be used directly as a reinforcement material in the manufacture of PCBs.
PCBTok is one of the best PCB Prepreg provider in the world! Call PCBTok now and inquire about your PCB Prepreg needs!
Provided Insulation of PCB Prepreg
Prepregs are typically used in products that require long-term protection against heat, moisture or chemical damage. They can be found in automobiles where they protect electrical components from high temperatures; in airplanes where they insulate electronics from shocks due to turbulence; and in spacecraft where they keep electronic components safe from radiation exposure during spaceflight missions.
The purpose of using a prepreg is to improve the quality and consistency of the printed circuit board by insulating it from environmental factors such as temperature changes or vibrations. Prepregs also help to protect against moisture damage that may occur during storage or shipping.
As one of the leading providers of PCB Prepreg, PCBTok provides a wide range of products that are tailored to meet your needs and requirements. Our company has been in business since 2010, and we offer high-quality products at competitive prices.
PCB Prepreg By Style
This prepreg style is used when you need a surface material for your bare PCB that has the ability to flex and bend, such as printed circuit boards. It has a warp & fill count of 56 x 56 inches and thickness of 0.0015” / 0.038 mm
This prepreg style is specially manufactured to meet the requirements of an electronic assembly process. It has a high-quality carbon fiber cloth woven into the fabric in precisely controlled warp and fill configurations.
This prepreg style is a high quality and durable material for your board. The prepreg has warp & fill count of 60 x 47 inches and thickness of 0.0029” / 0.074 mm. Light weight and strong, but flexible as well.
A PCB prepreg style with quality composite material considered to be the best option for PCBs. It has warp & fill count of 60 x 58 inches and thickness of 0.0038” / 0.097 mm
PCB prepreg style with warp & fill count of 52 x 52 inches and thickness of 0.0045” / 0.114 mm. Consists of fabric reinforcement with resin binder system and is supplied as a roll up sheet.
PCB Prepreg style with warp & fill count of 44 x 32 inches and thickness of 0.0068” / 0.173 mm for use in the manufacture of reliable printed circuit boards.
What You Need to Know About PCB Prepreg
Prepreg is an acronym for pre-impregnated composite which means it is already impregnated with resin before it is laid down on the board. It’s usually supplied in sheets of different thicknesses, ranging from 0.2mm to 1mm thick. The thickness depends on the kind of material used as well as its purpose. For example, if you’re making an RF shield then you’d need a thicker sheet than other types of boards because RF shields need extra protection against electromagnetic interference.
Prepreg is a very important part of PCB design and manufacture. It is a dielectric material that is sandwiched between two cores or between a core and a copper foil in a PCB, to provide the required insulation. You can call it a binding material as well. It either binds two cores or a core and a copper foil. This plays a critical role in PCB design and manufacture.
PCB Prepreg Purpose and Advantages
In the field of electronics, PCBs are used for a variety of purposes. One of the most common uses for PCBs is in the creation of printed circuit boards, which are used to help connect various electronic components together. The main purpose of a PCB prepreg is to provide a stable foundation for these connections so that they can be made with minimal interference from outside forces.
The use of prepregs in this way provides several advantages to those who are working with PCBs. First and foremost, it allows them to create products that are more durable and less likely to break down over time. This is especially important when it comes to consumer goods such as computers or televisions, but it can also be beneficial if you need your product to last longer than normal wear-and-tear would warrant.
In addition, using prepregs gives you more freedom when designing your product because you don’t need as much space around each component due to their increased stability during assembly; this allows you more flexibility when working with different types of materials without having to worry about anything falling apart during production.
Variation Between PCB Prepreg and PCB Core
PCB prepreg and PCB core are two different types of materials used to create circuit boards. Both are available to be used to make multilayer boards. The main difference between these two is that prepreg is a solid material that is applied in a liquid form, while the core is a solid material that has been pre-dried.
The main reason for using a prepreg coating is to protect the fiberglass resin from moisture and other elements like sunlight. The resin is usually impregnated with ceramic, or glass fibers that are embedded in the resin.
The main purpose for using a core is to provide support for the conductive traces on a printed circuit board. Core material is typically made from epoxy resins or phenolic resins, which have high temperature resistance properties.
Why Choose PCBTok as PCB Prepreg Manufacturer?
PCBTok is a leading PCB prepreg manufacturer, providing customers with high-quality products and services. We’ve earned our reputation by building quality and integrity into every aspect of our business.
Here are just a few reasons why you should choose PCBTok as your PCB prepreg manufacturer:
- Customizable prepregs. We’ll make sure that the materials we use for your boards are exactly what you need them to be.
- Fast turnaround time. We know how important deadlines are to businesses, so we work hard to ensure that every order is completed on time, every time.
- Quality control throughout the production process. We have rigorous standard operating procedures to ensure that each product meets or exceeds industry standards for performance, reliability, and safety.
PCB Prepreg Fabrication
Prepreg is a dielectric material that is sandwiched between two cores or between a core and a copper foil in a PCB, to provide the required insulation.
It is made of epoxy resin and glass fibers, which are impregnated with either epoxy or polyimide resin in order to make them more flexible and heat resistant. The glass fibers give them strength while the epoxy resin provides them with electrical insulating properties.
Prepregs are used for high-voltage applications because they have low dielectric constant and high thermal conductivity. They can be used in both high-frequency and low-frequency applications. They are made by applying resin onto fibrous materials like fiberglass, woven glass fabrics, and carbon fiber mats etc.
The PCB prepreg manufacturing process starts with the creation of a fiberglass preform.
The preform is created by winding fiberglass strands around a mandrel, which is then baked in an oven to remove moisture. The preform is then dipped in resin and cured. The resulting product is called a “blank.”
The blank is then used to create a laminate. This process involves applying resin to the blank and curing it, followed by adding more resin and repeating the curing process until all layers have been added.
After lamination, the finished laminate is cut into sheets and sent for testing to ensure that it meets required standards for quality control purposes before being shipped to customers for use in making PCBs.
PCB Prepreg Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
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1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
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It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Prepreg is a material used in the fabrication of printed circuit boards, or PCBs. It is composed of glass cloth, epoxy resin and a curing agent. Here’s how to choose pre-preg in PCB design and fabrication.
Glass Cloth Thickness. The thickness of glass cloth determines the strength and rigidity of the pre-preg. Glass cloth with a thickness of 0.25mm can withstand bending strains up to 0.5% without failure. For high-quality applications such as automotive electronics, glass cloth with a thickness of 0.4mm or more is recommended.
Epoxy Resin Type. The epoxy resin used for pre-preg should be selected according to its specific properties such as viscosity, water absorption rate, gel content, heat resistance and chemical resistance. The viscosity can be determined by measuring the torque at two different speeds when rotating an impeller in an epoxy resin solution with a known concentration.
Resin content in prepreg and laminates is measured by taking an infrared light reading of the material. The infrared light waves penetrate the material and are reflected back out by the resin particles. The amount of reflection is determined by how much resin there is in the sample, and the intensity of that reflection gives an accurate picture of the resin content.
The most common method for measuring resin content is the gravimetric method. In this method, the prepreg or laminate sample is dried and weighed before and after being immersed in an extracting solvent for a specific time period. The difference between these two weights is the total amount of resin in the material.