Your Authoritative PCB Stack-up Provider

At PCBtok, we only produce stack-ups for your circuit boards using the highest quality raw materials.

Layers that are strong and durable are laminated for performance that meets industry standards.

Due to our company’s ISO 9001 certification, there won’t be any deformity or delamination.

You can choose from a large variety of surface finishes and TGs.

We also adhere to class 2 and 3 of the IPC standards.

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What to Look for in PCB Stack-ups

The proper sequential lamination is what you need when thinking about stack-ups.

This guarantees that the copper layers are arranged properly.

However, you can use more than just copper layers in a stack-up. There are also layers of insulation that alternate.

So, how these insulation materials are arranged is something else to be on the lookout for.

Impedance control, radiation reduction, and noise interference reduction for devices are all made possible by effective layering.

To guarantee the performance caliber of your PCBs,

Only put your trust in an experienced fabricator like PBCTok.

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PCB Stack-up By Layer

4 Layer PCB Stack-up

Tech advances has accelerated the use of the 4 Layer PCB, which is found in WiFi equipment, necessitating the stack-up.

6 Layer PCB Stack-up

Led lighting, power modules, and high-speed telecom equipment primarily require 6 layer PCB, compelling this stack-up count.

8 Layer PCB Stack-up

Customers of Mos 8 Layer PCB can use them with Bluetooth-enabled devices for music streaming and video tracking.

10 Layer PCB Stack-up

A 10 Layer PCB is the first step toward stack-ups that enable numerous connections, like those in demonstrated in 6G satellites.

12 Layer PCB Stack-up

When heat resistance and reliable performance are what you need in a device, 12 Layer PCB is a good stack-up count.

20 Layer PCB Stack-up

For equipment that carry high currents, 20 Layer PCB is a stack-up count option; the features can fit SIS systems.

What is a PCB Stack-up?

Because of the following, PCB layer stacking-up products are popular with consumers:

  • Reduce EMI, or providing EMI shielding in devices
  • Reduce radiation, which destroys the functionality of the end-device
  • The stack-up facilitates high-speed signals e.g. broadband & telecom
  • In addition, focus on HDI equipment effectiveness is established

Meanwhile, PCB designer needs to factor in the overall thickness of the board, not just the inner layers. For your reference, heavy ones can be up to 6 oz.

What is a PCB Stack-up
Why You Need the PCB Stack-up

Why You Need the PCB Stack-up

The quantity of multilayer PCBs you require depends on the needs of your equipment.

You are referring to the specifics you need for multilayer boards when you discuss PCB stack-up.

You can use this for HDI, high power, high speed, and impedance control devices starting with a four-layer board.

If you work with RF applications, Microstripline, or the semiconductor industry, you’ll also need a PCB stack-up.

Lastly, PCB stack-ups save you a lot of money because it is energy efficient.

PCB Stack-up Design Basics

To determine how many layers are necessary for a PCB stack-up, it is most effective to have a method.

You can do this by using an equaltion to determine your pin density. Then, you must take into account the following extra factors:

  • Do you prefer low or high (below 1 GHz) digital signal processing?
  • How does the grounding system work? Do you need one that is high power rated?
  • Do you require the ability to process mixed-signal, digital, or analog signals?
PCB Stack-up Design Basics

Where to Find a PCB Stack-up Supplier

Where to Find a PCB Stack-up Supplier
Where to Find a PCB Stack-up Supplier 2

We will do what it takes to provide you with a suitable PCB design or solution.

Our sales representatives are trained to interact with you communicatively.

In fact, before placing a large order, you can ask for a free sample.

PCBTok is sure that the proper procedures were followed when applying the solder mask, soldering, and drilling the PCB.

Our raw materials are excellent, and our manufacturing process is quality assured.

PCB Stack-up Fabrication

Rules in PCB Stack-up Procedure

Every PCB is created with a specific function in mind.

The three main guidelines must be followed when ordering a PCB stack-up, or you run the risk of jeopardy in the end-device outcome.

  • First, have a clear idea of your DFM, especially when it comes to signals, the PCB routing, the Blind Vias, Buried Vias or Microvias you will use.
  • Second, you need to study what materials are used for the prepregs and laminates. Some materials, for example, have normal Tg, Mid-Tg or High Tg.
  • Third, thickness of the total layer must fit physically in the device. Here, think also about the weight (0.5 oz, 1 oz, or Heavy Copper PCB)
Components Used in PCB Stack-up

The ultimate goal of including the following components is to create a stack-up of circuit boards:

The layers are described follows:

  • Top layer – this is also called the prepreg, which can be FR4 or any other material like Rogers’ products
  • PCB Core – this is made of multiple layers, considering the final layer count
  • PCB Bottom – this is composed of another set of prepregs
  • Note that each of the layers described are sometimes not just one single layer, but a composite.
PCB Stack-up banner 2
PCBTok: Timely Fabricator of All PCBs

You can expect prompt service with us.

Your PCB Stack-up will be ready as promised.

PCB Stack-up Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “They have consistently done a good job. So, now, I only want PCBTok to handle it alone, please, no other PCB company from China will do. I am at a loss for words when describing this company. The engineering team was excellent as well; they were quick to respond, punctual, diligent, and very detail-oriented. Everything could be done and was done with care and precision. The boards were made exactly to my design, which I really like.”

    Johan Salyer, Computer & PCB Professional from Herning, Denmark
  • “Do you need an accurate estimate for the work that needs to be done? Yes, give PCBTok a call; despite the fact that they are in such high demand, they accept everyone. They are qualified for any PCB-making position. I am eager to see if they can assist me with my upcoming electronic projects because of the wonderful experience I had working with them on my multilayer boards.”

    Wesley Keenon, PCB Design Engineer from Napier, New Zealand
  • “I really cared that PCBTok would complete the job correctly because I didn’t want any incompetent person to handle my PCBs. I’ve placed another order because they got it right the first time. The salespeople were also excellent; they were promptly responsive, diligent, and very detail-oriented. They are unquestionably an asset to have in the supply chain deals I am in because of their exceptional PCBA.”

    James Sturgill, Logistics & Shipping Supervisor from County Clare, UK
What's the difference between Standard Stack-up and HDI Stack-up?

Here are the differences, in detail:

  • The categories for HDI PCB are I, II, III, and IV. Common PCBs are not.
  • Pin spacing is measured in millimeters (mil) on HDI PCBs. PCBs typically require 2.54 mm.
  • Standard boards have fewer PCBs than HDI PCBs, which is why HDI boards are occasionally referred to as BGA PCBs. Single-layer and double-layer PCBs are two examples.
  • In contrast to HDI, which uses Rogers, Taconic, High Tg, Ceramic, and PTFE materials, standard PCB typically uses FR4 laminates.
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