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Precisely Constructed PCB Stiffener by PCBTok
In essence, the role of a stiffener on your board is to reinforce areas wherein the electronic components will be integrated. However, it will not be extended to the flexible area.
Thus, we only utilize top-tier raw resources to ensure they will perform as expected. Also, we guarantee IPC Class 2 or 3 boards on it.
Moreover, we offer various payment options depending on your purchases and provide weekly updates on your order’s progress.
Kindly message PCBTok to avail our best offers for a PCB Stiffener.
PCBTok is Specialized to Producing Premium PCB Stiffener
PCBTok’s high-class PCB Stiffener has gained numerous commendations across the globe because of its top-notch quality and performance during its application.
We are one of China’s leading, well-respected, and trusted PCB Stiffener Manufacturers. We are capable of fulfilling your demands that can support your purpose.
Additionally, we have adequate facilities that cover 8,000 m2, and we only deploy highly experienced designers and engineers to manufacture your PCB Stiffener.
Our primary goal is not only to provide quality items but also to make them affordable.
In addition, we conduct a thorough CAM analysis before production, have 24/7 accessible sales and technical support, and are UL-certified in the US and Canada.
PCB Stiffener By Feature
The Flexible PCB is the board material that frequently utilizes a stiffener since some parts of the board necessitate mechanical support for incorporating heavy components. Therefore, they require a stiffener that can adequately support it.
The Rigid-Flex PCB sometimes requires the need of a stiffener in some portion of its board, wherein it requires a significant amount of support to components and connectors. Moreover, they are usually utilized for better handling.
The FR4 Stiffener PCB is the most popular material used in a stiffener since it has a variety of thickness options that can be easily integrated into standard board sizes. Additionally, they are frequently deployed for stabilizing board connectors.
The Aluminum Stiffener PCB is considered as a metal stiffener; it requires customization. Thus, it can be expensive to produce, but we can reduce its cost. Additionally, they are commonly utilized to assist in better heat dissipation.
The Polyimide Stiffener PCB can be easily integrated into the ZIF connector. Moreover, it is commonly attached locally to finger areas. Additionally, only this stiffener material is capable of maintaining all tolerances set by the connector.
The Stainless-Steel Stiffener PCB is in the same category as the aluminum stiffener; they are a metal stiffener. However, they are usually deployed whenever the device’s space is limited for a stiffener to be incorporated since they are capable of it.
What is PCB Stiffener?
In simple terms, a PCB Stiffener provides additional mechanical support to a circuit board during an assembly. Moreover, they are commonly used in Flexible PCBs.
A stiffener is not commonly part of the PCB design’s integral component. Basically, they are only utilized to achieve stability in certain board parts.
However, these are not just the purpose of a stiffener; it offers a wide array of functions. Some of it includes reinforcing specific board areas for quicker and easier operation. It is one way of studying a flexible board to tolerate heavy components attached to it.
The quality of a PCB Stiffener can significantly impact the board’s performance and reliability; thus, choosing the proper manufacturer can be beneficial. Contact us today!
What are the Uses of PCB Stiffener?
We tend to utilize a PCB Stiffener whenever there’s a need to solidify and stabilize a particular part of a flexible board. Here are some of its following uses of it:
- If you wish to keep and increase the thickness of your flexible circuit board, we recommend applying a stiffener.
- If you plan on reducing component stress and increasing the bond strength of a particular board, we advise deploying a stiffener.
- If you’re having trouble with heat dissipation, we suggest using metal stiffeners.
- If you want better handling on your flimsy circuit board, go for a stiffener.
- If you’re having trouble achieving a flat surface for the SMT components, apply a stiffener.
How does PCB Stiffener Work?
As mentioned previously, the stiffener is responsible for providing mechanical stability to a flexible board type. Hence, a stiffener is necessary whenever you need:
- Increased thickness in some portions of your flex circuitry.
- To limit bending areas to a few predetermined regions.
- To fulfill the requirements for ZIF (Zero Insertion Force) connectors.
- To make particular board sections stronger.
- As a means of supporting additional parts or connectors.
We suggest attaching a stiffener if you wish to safeguard your components in a flexible circuit board. In addition, it can prevent and protect the solder joint on the device.
Select PCBTok's Highly Reliable PCB Stiffener
PCBTok has built its reputation for over twelve (12) years; we have satisfied over a thousand customers across the globe and fulfilled numerous applications of it.
Additionally, we have a strict quality inspection system to ensure that the products work flawlessly and can meet their optimum performance without any concerns.
Our facility is comprised of highly-skilled individuals that have extensive experience in the industry. Moreover, we only utilize top-tier raw materials and sophisticated technologies to produce your PCB Stiffeners.
We at PCBTok offer an affordable rate since we have an in-house procurement method while keeping its quality high. Immediately contact us today to avail our best offers!
PCB Stiffener Fabrication
In this section, we’d like to share with you the process we conduct in integrating a stiffener to your particular circuit board, flexible or rigid-flex.
Firstly, we ensure that we place the stiffener on the same side of the board whenever we are attaching PTH components to have access to solder pads.
Secondly, we will provide an option to apply the stiffener on both sides of the board if necessary. However, it requires configuration review to avoid errors.
Finally, we will heat and pressure to thermally bond the stiffener to the circuit board. Also, we can apply it using a pressure-sensitive adhesive.
Feel free to call us for any inquiries you may have; we’ll be glad to assist you!
There are various advantages you can enjoy if you decide to apply a stiffener to your desired circuit board; we’ll share some of them with you.
First, they can reinforce solder connections. Second, they are capable of greatly enhancing abrasion resistance. Third, it is helpful for strain relief.
Fourth, they enable enhanced handling of a particular circuit board. Fifth, it allows automated soldering processes and component positioning on the board.
Sixth, it can offer a strong bond force and improved solder resistance. Finally, it can make the connector fingers inserted easily and quickly.
Kindly message us for any inquiries and concerns you may have concerning this.
PCB Stiffener Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
There is a variety of reasons you’ll need a stiffener for your flexible circuit board; some of the reasons are as follows:
- The components are located in a flexible portion of the board.
- It could be that the weight of the components is bending and stresses the elastic area of the board.
- If the component attachment chosen requires a flat and rigid surface, such as for SMT pad technologies.
- In order to reduce the stress of the pads in boards that require multiple connector insertions, we suggest applying a stiffener.
As for the application of stiffener in a Flex PCB, there are two ways of applying it; Thermal Bonding and Pressure Sensitive Adhesives (PSA).
The following are the distinction between a Rigid-Flex and Rigid PCB:
- In order to increase stiffness during fabrication, Rigidized Flex, a Flex PCB, is coupled with an FR4 stiffener. All types of circuits with both rigid and flexible substrates are referred to as rigid-flex circuits; it is also termed hybrid flex. Moreover, we are capable of laminating them into a single framework.
- Even on pads, a Rigid component of Rigid-Flex has no traces. Each rigid piece only makes this location’s rigidity stronger. In other words, it just supports the flex mechanically. Nevertheless, we design traces into rigid and flexible portions for the Rigid-Flex PCB and then use apertures to interconnect them. In other terms, it serves as an electrical link rather than structural support for the Rigid-Flex PCB.
In summary, Rigid PCBs are for mechanical support. In contrast, electrical connections are for the Rigid-Flex PCB.
Generally, you need to consider their material if you intend to use PCB stiffeners in your project. Similar to other Flex PCBs, stiffeners are often comprised of FR4, and their thickness could range from .008 inches up to .059 inches.
Ideally, while creating your flex board and employing stiffeners, we recommend going for a thicker stiffener. Since the more comprehensive it will be, the more it can provide additional support to your board; however, it doesn’t have to be similar thickness across the design. The thin polyimide coating is commonly added at the connection fingers when thickness needs to be increased. We can create a thicker PCB to avoid utilizing a ZIF stiffener, but this will likely make the board more robust than you would like.
In some circumstances, you might be able to stiffen your PCB with different materials, including stainless steel or aluminum. As you might expect, these materials are relatively costly but have higher stiffness and heat-sinking qualities. Even if there are a few very particular circumstances in which using one of those more expensive components will be advantageous, several manufacturers believe the advantages of flex PCBs do not outweigh the additional expense.