PCBTok: The Go-To Source for High-Quality PCB Substrate
The best PCB substrates can be hard to find, especially when you need high-quality boards fast. PCBTok makes it easier than ever to get the boards you need with their wide selection of high-quality PCBs that work with virtually any electronic need—from professional engineers to hobbyists and everyone in between.
- 24h quick-turn service for your prototype PCB
- No minimum order quantity for your new order
- Over 500 workers in our facility
- Accept third party factory audit and inspection before starting our business
Prime PCB Substrates of PCBTok
For any electronic needs, PCB substrate is essential to make your own circuit board. PCBTok is a China-based company that has been delivering quality printed circuit boards since 2010.
Whether you’re looking for one of their customizable products or need a specific substrate to print your own circuitry on, these guys have you covered.
We offer a few different product lines depending on what kind of circuit boards you’re making and how many you need made.
High quality substrates are PCBTok’s specialty so feel free to contact us if you need help with anything! Get in touch with them if you have questions or want to get an estimate!
PCB Substrate by Feature
PCB Substrate by Material (6)
PCB Substrate by Type (5)
The PCBTok Advantage: Why Our PCB Substrate is the Best Choice for Your Electronics
For many electronics projects, the PCB is one of the most important components of the entire project. A reliable PCB substrate can mean all the difference between creating an amazing new device and having your whole project be an expensive bust!
PCBs are a crucial component of modern electronics, and good design is crucial to efficient manufacture. But sometimes a circuit can overheat or malfunction due to poor PCB substrate or materials. You may think your design will be effective, but you don’t know until you test it.
Here at PCBTok, we work hard to make sure our printed circuit boards (PCBs) have the best PCB substrates that were tested by experienced professionals with an eye toward efficiency—and our affordable pricing allows us to provide these boards at cost while still turning a profit.
The PCBTok’s PCB Substrate in Manufacturing your PCBs
With so many PCB manufacturers to choose from, it’s difficult to find one that’s reliable, dependable and that can provide you with high-quality printed circuit boards.
But don’t worry! With PCBTok, you can be sure that your electronic needs will be met.
PCBTok’s proprietary technology and process provide superior performance in a variety of applications. PCBTok also provides electronic design services to help customers get their product ideas off the ground and into production quickly and efficiently – regardless of whether they are looking to build just one or millions of units.
PCBTok's PCB Substrates Characteristics
PCBTok’s PCB Substrates feature a variety of benefits that make them ideal for any project, including tough insulating properties and perfect consistency.
This means that PCBs remain consistently rigid over time, no matter how many times they’re handled or moved.
Additionally, each PCB substrate is hermetically sealed to prevent oxidation, which ultimately increases their lifespan by preventing corrosion at connections and other points of weakness.
With these traits in mind, it’s easy to see why PCBTok’s quality boards are preferred across so many industries!
Choose the Right PCB Substrate in Creating your PCBs
One of their most important aspect of your PCB is their substrate. Only a few companies in China produce these kinds of substrate and very few users know that it has these kinds of quality and applicability.
PCBTok have already produced one million square meters, which can be used in various industries such as Smart Home, IoT, Wearable Devices, Consumer Electronics etc.
These are just some examples of what we can provide to our customers because they are not limited by one material; they provide a wide variety!
This really allows them to expand into new industries. If you’re looking for quality boards, there’s no better place than PCBTok!
PCB Substrate Fabrication
PCBTok offer not only the basic substrate, which is the standard FR4 PCB. You can choose plastic, glass and even rubber!
Just don’t overlook your choice of substrate—it could have a drastic effect on the quality of your end product.
For example, in electronics such as loudspeakers, choosing plastic over glass has its benefits and drawbacks.
Plastic, being flexible and lightweight, is an ideal solution for products like solar panels or other products that need to withstand external pressure or vibrations.
However, if design doesn’t call for flexibility then glass would be better.
PCBTok uses three different methods to ensure that all PCB substrates can be used effectively and safely in any electronics project.
- Each batch of substrate is tested and passed before shipping out to customers to make sure that it’s reliable
- A variety of tests must be passed before sending a batch off from PCBTok’s suppliers, including checks for specific radiation values, thickness, emissions and more
- Final tests that are performed when packaging every order to ensure quality consistency.
Our Quality Control department ensures only highest quality PCB by inspecting each batch with inspections throughout all stages of production for the consumers to get quality PCBs.
PCB Substrate Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“Our company been doing business with PCBTok for more than eight months, and we’re very satisfied with the exceptional quality of the PCBs they manufacture for us. PCBTok demonstrated excellent value as a partner throughout our collaboration, and the engineering team at PCBTok wowed us significantly with their knowledge and supportiveness. The partner PCBTok is persistent and attentive; they commit to delivery schedule and deliver completely and on deadline. There are no disappointments for us. I have no qualms in recommending this business as a wonderful PCB supplier.”Simon Helbreg, Staff of Electronics Company, Washington D.C
“I’m speaking on behalf of UK Tech Solutions and others to recommend the PCBTok service. Essentially, we are very pleased with PCBTok’s quality of service, precision, and versatility in fulfilling our evolving requirements. From PCBTok, we have consistently gotten PCBs of the finest quality. Apart from their expertise, the PCBTok engineering team’s attitude and kindness have indeed amazed us. We can without a question recommend this company as a solid business partner to work with.”Amy Cooper, Tech Solutions Engineer from United Kingdom
“Our collaboration with PCBTok has been highly successful for us. We ordered PCBs in PCBTok by us for both production orders and client product prototyping. It is quite complicated to accurately plan client product prototyping due to our build requirements and market segments. PCBTok has continuously been effective at adjusting schedules. Additionally, PCBTok’s staff has been very supportive in our prototype builds, revising our PCBs as well as providing our technical personnel with recommendations for fabrication. We are delighted with PCBTok’s performance overall.”Rachel Green, Electronics Maker Staff, Canada
PCB Substrate – The Completed FAQ Guide
PCB substrate: The substrate of a printed circuit board determines its strength and flexibility. In addition, the substrate is coated with a layer of copper, which is a good conductor of electricity. The soldermask layer is another component of the PCB. By isolating the PCB components from other conductive materials, this layer prevents solder bridges. Various PCB manufacturers offer a variety of heat-resistant substrates for various applications.
This is an important question and the answer will be specific to your project. Keep reading to learn more! After all, it is vital to choose the best material for your PCB. After all, if your boards don’t last, they’ll never be finished.
Glass fiber reinforced epoxy resin is the most commonly used PCB substrate material (GRE). This material is widely used in consumer electronics as well as various aerospace and military applications. It is also the least expensive type of PCB, and it has several advantages, including high flexibility and excellent insulation properties. Mylar is another common substrate material. This material is an excellent insulator, but it is more expensive than other types of PCB substrates. It is also utilized for high-frequency applications.
The material used determines the dielectric constant of the PCB substrate. Usually, the value depends on the frequency. This can lead to phase distortion in broadband applications because the transmission line has a low impedance. The material’s dielectric breakdown voltage measures its ability to resist high-voltage discharges, while resistance to leakage initiation measures its ability to resist high-voltage discharges across the board surface.
There are many reasons why different types of PCB substrates can produce different results. Although they are all made from the same materials, they have slightly different properties. In particular, the substrate used in the manufacturing process can have an impact on the performance of the circuit. The copper layer of a PCB has a lower CTE than the substrate. this increases the likelihood of interconnect failure. On the other hand, the woven glass surrounding the PCB material limits the CTE to 10 to 20 ppm.
The material of the PCB board must be able to withstand high temperatures. High temperatures cause the PCB substrate to decompose, resulting in a loss of about 5% of its mass. This temperature is measured in degrees Celsius, and when the material is removed from this temperature, it returns to its original state. This is referred to as the glass transition. Therefore, it is critical to select a substrate with a temperature range that is compatible with the operating environment.
High-density circuits require the use of high-density laminated dielectric materials with specific properties. These properties include dielectric properties, insulation, thermal capacity resistance, adhesion, and HDI PCB compatibility. At the same time, the pitch of FC package substrates in microelectronics is shrinking and becoming more organic. In addition, high-density fine circuits require the use of substrates with specific properties.
PCB substrate materials come in many forms. Metal is the most common, as copper is widely used in PCBs. all metals support surface mount technology, which involves soldering components to the board using solder resist layers. This technology also allows for quick quality checks and testing of assembled PCBs. In addition, because copper is a highly conductive material, PCBs manufactured using this technology will be able to conduct electricity.
The thickness of copper is measured in ounces per square foot, which is a simpler method of measurement. One ounce per square foot is approximately 1.344 mils or 34 micrometers. Heavy copper is defined as a layer of copper thicker than 3 ounces or 4.2 mils per square foot. When using high-frequency signals, thick copper layers are used to dissipate heat.
PCB Substrate Stack-up
Laminate is an alias for laminated circuit boards. These consist of two layers of paper or cloth over a thermosetting resin. These can meet specific specifications, such as dielectric constant, tensile strength, and coefficient of thermal expansion. FR-4 and copper laminates are two of the most common materials used today.
There are many substrate materials other than copper. You can find one that meets your needs and fits your budget. Keep in mind that the temperature of the PCB substrate is important because it affects the interconnects and the resulting PCB. if the substrate is not compatible with the copper layers, these layers may separate and cause failures. Check the maximum operating temperature of the material before purchasing.
You may be wondering why high speed and/or higher frequency are so important for your PCB. This article will explain why these factors are critical for your PCB design. The definition of High Speed and High-Frequency PCB is based on signal speed, circuit impedance, and the effect of signal radiation and ionization loss.
Higher dielectric and absorptive losses will result from operating frequencies above 20 GHz. The skin effect, which concentrates currently around the edges, makes copper roughness critical at high frequencies. The fiber weave effect, which occurs when resonances in fiber cavities cause skew and radiation, also affects high-frequency PCBs. These effects can jeopardize signal integrity, which is one of the reasons why high-speed PCBs should be designed with proper bend radius and ground plan.
Furthermore, high-frequency signals can cause crosstalk issues, reducing PCB reliability. High-speed PCBs must reduce crosstalk and eliminate the resulting interference. This necessitates changes to the layout procedure. If you do not have the time to change the circuit layout process, you may want to hire a design firm.
Substrate to PCB
Your High-Speed PCB design should be properly designed and assembled to ensure the highest possible frequency performance. A high-frequency PCB necessitates sound design decisions in almost every area, including component placement, spacing, clearances, and routing. Different signals, controlling impedance, and routing must all be accommodated in the design. If you do not take these factors into account, your PCB design will fall short of your expectations.
The best choice of PCB material for a given application depends on a number of factors. High-frequency PCBs should be made of materials with low dielectric constants. Flame retardant PCBs should be heat and moisture resistant. They should also be able to resist high temperatures and currents. The right choice will contribute to the safety and functionality of the board.
When selecting a PCB substrate material, keep in mind the desired properties. The glass transition temperature or the point at which the material softens or deforms at high temperatures is one of these properties. Polytetrafluoroethylene (PTFE), aluminum oxide, and polyimide are examples of substrates. There are also available flexible PCB substrates such as Pyralux or Kapton. using insulated metal substrates helps to dissipate heat, which is a key issue in many modern PCB designs.
There are several types of PCB materials to choose from, each with its own advantages. You should select materials based on the function of the board, the desired outcome, and any environmental factors that may affect the process. Also, research the cost and environmental impact of PCB materials. If you are not familiar with PCB materials, seek the help of a PCB prototype assembly service.
The decomposition temperature of the PCB substrate is critical for soldering. This process can be reversed once the PCB material is out of the glass transition temperature. To avoid this problem, choose a material that can withstand temperatures of 200 to 250 degrees Celsius. Soldering PCBs requires a temperature above the glass transition temperature. However, the material should not decompose at high temperatures.
The process of selecting a PCB material begins with its UL (Underwriters Laboratories) rating. UL ratings are required for many electronic devices because they indicate whether the board will self-extinguish in the event of a fire. FR4 epoxy, PTFE, aluminum oxide, and polyimide are some of the available PCB material substrates. The most suitable PCB material for your application depends on its thermal properties, which are often associated with interconnection problems.
PCBs have different characteristics, depending on the material used. The material you use for your PCB depends on the requirements of your application. For example, high-speed applications require materials with a low dissipation factor. High-power military equipment requires high thermal conductivity and low thermal resistance. PCB material selection is an important part of ensuring the quality of your product.
Always choose high-quality copper foil. Poor quality PCBs can be caused by poor quality copper foil. Choosing a good copper foil is critical to minimizing signal loss. Copper foil is an excellent material for high-frequency circuits, but it must be used in conjunction with a dielectric material of equal value. Using a copper foil with a low dielectric constant will result in significant losses in the circuit.
If you are not familiar with the term, silkscreen is an ink-based trace layer that is etched onto the surface of the PCB. It acts as a conductor between different components. A liquid polymer solder resist is a protective layer that prevents solder bridges and is often applied to the copper foil. Copper foil on PCBs is usually green in color because it provides good contrast and helps in component identification.