Change Language
PCBTok’s Peelable Solder Mask PCB is Constructed Competently
Our primary goal is to provide our customers with the best product they deserve; thus, we always ensure that our Peelable Solder Mask PCB is constructed using high-grade resources.
- In the US and Canada, we have earned full UL approval.
- Various payment conditions apply depending on the purchase.
- Our site employs about 500 professionals.
- If you need support with your specialized PCBs, we are always available.
- We offer a free sample product prior to making a substantial purchase.
Top-Tier Quality of Peelable Solder Mask PCB from PCBTok
PCBTok’s Peelable Solder Mask PCB has been genuinely crafted using advanced materials and technologies; we’re doing this to attain its optimum performance.
We are continuously improving our personnel’s skills to make sure they will only produce products that are at par and will function flawlessly.
Our products are specially made with care and perfection; we do not serve our customers’ mediocre output; we want them to experience only the best items.
Our goal is to satisfy all of your PCB specifications accordingly.
We are more than capable of putting into action all of your PCB product specifications by only using high-grade materials and technologies at an affordable rate.
Peelable Solder Mask PCB By Feature
The Multilayer PCB into which we apply this protection can integrate numerous components in a compact design. Additionally, they are commonly deployed in multiple industries, such as automotive, aerospace, and medical fields.
The HDI PCB into which we apply this protection is ideal for applications requiring exceptional thermal management. Additionally, it offers fast signal transmission with enhanced signal quality. However, it can be expensive to produce.
The Metal Core PCB that we apply this protection into is capable of controlling heat faster than the FR4 board. Therefore, they are the perfect option for applications that are exposed and requires tolerance to extreme temperature.
The FR4 PCB that we apply this protection to offers numerous advantages, including an excellent resistance-weight ratio, doesn’t absorb moisture, exceptional insulating capacity in a dry and humid place, and high mechanical strength.
The Motherboard PCB that we apply this protection into are commonly deployed in computer systems; however, its application isn’t just restrained to this particular industry. In addition, it can be located in consumer electronics as well.
The Aluminum PCB that we apply this protection into offers exceptional stability and enhanced thermal management. Thus, they are frequently deployed in LED devices, all applications that require excellent heat dissipation.
Peelable Solder Mask PCB By Layer (5)
-
The 4-Layer PCB into which we apply this protection has enhanced signal integrity with reduced noise occurrences compared to the lower-layered count board. In addition, it can support designs that operate at higher speeds.
-
The 6-Layer PCB into which we apply this protection is ideal for applications requiring multiple high-speed interfaces and power rails. Moreover, it has exceptional electrical properties, and a quality driven design.
-
The 8-Layer PCB that we apply this protection to can be found in various applications, including the aerospace, aviation, automotive, industrial, and medical industries. Additionally, it possesses enhanced functionality.
-
The 10-Layer PCB to which we apply this protection is widely deployed in various applications such as military and defense, aerospace and aviation, and industrial equipment because of its improved power.
-
The 12-Layer PCB we apply for this protection has almost the same characteristics as the 10-Layer one; however, it has more advanced features. They are more compact, robust, highly durable, and high-quality boards.
Peelable Solder Mask PCB By Solder Color (6)
-
The Green PCB that we apply this protection to is the most famous colored board because of its numerous advantages, including its contribution to releasing visual fatigue when observed and easy component identification.
-
The Yellow PCB that we apply this protection to features exceptional design capability, easiness to maintain, enhanced wiring, and less failure rate. They can be used in applications, such as in the industrial and medical sectors.
-
The Red PCB that we apply this protection to offers reduced noises such as sound disturbances and interference. It can be easily maintained and repaired, has convenient portability, and is relatively affordable.
-
The Blue PCB that we apply this protection into is among the most utilized colored-board in the industry because of its reduced wirings, easy repairing and locating metal components on the board, and high reliability.
-
The Black PCB that we apply this protection to is categorized as one of the most advanced board types in the industry due to its unique characteristics, including an anti-plagiarism feature that makes its demand higher.
-
The White PCB that we apply for this protection has gained popularity in the industry because of its capability to distribute heat throughout the entire board evenly and other numerous benefits. But, it can be expensive.
Perks of Peelable Solder Mask
There are various benefits you can get from a Peelable Solder Mask; we have some of the following:
- Ecological – It is RoHS compliant, and it works well with any surface finish. In addition, it has no toxic substances on it.
- Temperature – It is capable of tolerating up to 288°
- Convenience – It is durable and reliable, time-saving compared to the taping method. Moreover, it provides protection against oxidation, and its residues can be easily removed.
- Cost – It is fairly affordable than other options for protective layers.
Difference Between Peelable Solder Mask and High-Temperature Taping
Apart from the Peelable Solder Mask, we can perform High-Temperature Taping to protect a bare PCB. The following are the difference between them:
- Efficiency – In terms of mass manufacturing, high-temperature taping is less efficient; we suggest going for peelable solder masking in such situations.
- Costs – Similar to efficiency, taping is lost in this criterion since it is way more expensive than a peelable one.
- Automation – If you’re seeking a manual application, we suggest going for taping. However, if you prefer an automated application, go for otherwise.
- Size – If your board’s dimension exceeds 6 mm, we advise going for taping.
Considerations to Take in Choosing Peelable Solder Mask
If you’re considering this protection method, we highly recommend looking for this different criterion to select the right option. We have the following:
- Removability – It should have a removable feature after you dry it. We suggest choosing the peelable mask during the solvent clearing.
- Compatibility – The chosen mask should withstand extreme temperature conditions to prevent the board’s failure.
These criteria are crucial in selecting the appropriate mask for your board. In addition, we strongly recommend choosing the proper manufacturer. Kindly write us a message to avail our best and most affordable deals.
PCBTok's Strength is Producing Extraordinary Peelable Solder Mask
PCBTok has been in the industry for over a decade; we have satisfied numerous customers worldwide because of our exemplary Peelable Solder Mask. In addition, we are an IPC and ISO-certified company; thus, you can depend on our products.
Our extensive experience in the industry has brought us tremendous respect across the globe. Moreover, we possess all the latest technologies in the market.
All of the phases your product undergoes have been accompanied by our experienced and skilled staff to ensure they will be error-free. Additionally, we have adequate facilities to provide you with quality and high-class PCB outputs.
We can fulfill any of your demands and specifications by using the most advanced materials and machinery to produce your products.
Peelable Solder Mask Fabrication
You can select three (3) options to apply your Peelable Solder Mask. All of them have pros and cons of choosing each of them.
First, we have the Manual Application. This is conducted by hand; however, its accuracy depends on the manufacturer’s experience.
Second, we have a Pneumatic Application. This method uses compressed air or nitrogen as the primary applicator by dispensing it on a bare board through a needle.
Third, we have Stencil Printing. This can be an ideal method for the SMT Assembly process. However, it should be applied and performed on a flat surface.
If you have any questions regarding this, kindly write us.
One of the essential parts of completing the production process of a PCB is the application of surface finish since it coats the exposed coppers.
Fortunately, a Peelable Solder Mask goes very well with all types of surface treatment. However, we suggest sticking to ecological coatings.
PCBTok offers the following finishes; HASL, Lead-Free HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, and many other surface treatment options.
Any of these mentioned surface treatments is feasible in this protection method. But, we suggest asking the manufacturer first for the most suitable one.
Just mail us if you wish to know the ideal finish for your operations.
OEM & ODM Peelable Solder Mask Applications
Due to the capability of this protection method to save time during bulk production and ecological feature, they are widely preferred in the communication industry.
Since most aerospace devices are prone to heating and exposed to extreme temperature conditions; they require protection that can tolerate it such as a peelable mask.
It is regarded that a peelable mask possesses no toxicity that is harmful to the environment, they have been widely deployed in consumer electronics.
Most medical instruments utilize rigid-flex and flex types of boards; a peelable mask possesses no issues if integrated and applied on such boards.
Since almost all computer peripherals have a complex structure and layout, it requires protection that is capable of filling it; a peelable mask has the ability to do it.
Peelable Solder Mask Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
