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PCBTok’s Professionally Manufactured Radar PCB
The production process for PCBTok’s Radar PCB is meticulous and in accordance with accepted international standards to produce high-quality results.
- For new purchases, there’s no minimum order amount is required.
- Before construction, all files are thoroughly reviewed by CAM.
- Provide a diverse range of PCB Layers; from 1 to 40.
- Our payment terms are highly versatile.
- We supply sample pieces prior to your bulk purchases.
First-Rate Radar PCB Products from PCBTok
The Radar PCB from PCBTok has been put through a number of production steps to provide a premium product with no flaws.
We are continuously looking for ways by researching to improve the overall performance of the Radar PCB to ensure that you receive the best product.
Since we persistently want you to have the best possible experience, all of these are actually carried out by our team of highly knowledgeable engineers and technicians.
PCBTok always aims to deliver you a Radar PCB that is top-notch and worth it.
In order to give you a superior Radar PCB product and a meaningful experience with us, we at PCBTok will always strive to improve our skills and technologies.
Radar PCB By Feature
The Radar Sensor PCB is becoming popular among consumers with the rise of many technologies. It has been helpful in most devices and applications because of its capability to sense motion through wireless technologies.
The Radar Detector PCB has been widely used in the automotive industry. Especially in the most advanced and latest models of automobiles. In addition, it is capable of assisting the drivers in being mindful of their speed.
The Automobile Reversing Radar PCB has also become popular in the automotive industry since it can aid drivers in parking their cars; this can minimize the occurrence of car collisions when parking.
The Millimeter Wave Radar PCB is a special kind of radar technology because it utilizes short electromagnetic waves. It has been widely used by companies who are planning to push autopilot vehicles into the market.
The Antenna Radar PCB has been extensively used by the communications industry since it aids in transmitting signal data flawlessly. They can also be found in aerospace applications since they use satellites in delivering data.
The Customized Radar PCB is suitable if you’re seeking freedom with your board’s design and purpose. We are more than capable of producing your desired Radar PCB that will perfectly suit your desired application.
Radar PCB By Type (6)
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The HDI Radar PCB is considered to be the most advanced and popular type of board in the industry. It is capable of integrating various components in a compact design without sacrificing the board’s performance and weight.
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The Rigid-Flex Radar PCB is perfectly suited for applications that require versatility. If you’re planning to integrate your Radar PCB in a constrained and limited space, we suggest going for the Rigid-Flex board.
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The Microwave Radar PCB has gained popularity in the industry because of its outstanding stability, and high-speed performance. They are commonly deployed in military and automotive applications.
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The High-Frequency Radar PCB provides a quick signal flow rate at a frequency that is up to 100 GHz. It is frequently utilized in the automotive industry, specifically in LIDAR interacts with the surroundings of a vehicle.
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The Prototype Radar PCB is ideal if you’re planning to try out the performance of the board prior to manufacturing bulk orders. This will aid you in determining the lacking points of the board; hence, you can easily correct them.
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The RF Radar PCB is recognized for its capability to tolerate the power of thermal stress. It has an exceptional working capacity due to its ability to quickly supply signals to the entire board within a short period of time.
Radar PCB By Base Material (6)
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The Copper Radar PCB base material has been widely used in the industry because of its advanced electrical properties, and efficient thermal conductivity. Thus, it can prevent the occurrences of stress and damage to the board.
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The FR-4 Radar PCB is considered to be one of the most popular materials used in the PCB industry because it’s cost-efficient with a wide array of benefits such as superior thermal, mechanical, and electrical properties.
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The Rogers Radar PCB is recognized for its exceptional dielectric constant, and reliability in certain temperature conditions. It is extensively used in most high-operating frequency applications.
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The Fiberglass Epoxy Radar PCB has become popular in the industry because of its relatively inexpensive cost, and its capability to be re-used and re-work. In addition, this material is often referred to as FR-4 laminate.
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The CEM-3 is recognized to have quite similarities with the FR-4 base material. It is known that this material is suitable for lead-free flow technology since it doesn’t use any toxic substances on it; it is free from halogens.
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The Ceramic Radar PCB is known for its high thermally conductive materials used on it. In addition, they have exceptional high-frequency performance, and they can safely operate at a temperature of up to 662° Fahrenheit.
Radar PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
PCBTok's Radar PCB Advantages
PCBTok’s Radar PCB can offer your applications the following advantages:
- Signal – Easy data collection since it can penetrate rubbers and some clouds.
- Detection – It can easily identify the distance, velocity, and position of moving objects.
- Operation – It is capable of operating in high-frequency situations since it can tolerate and accommodate a large volume of data.
- Cost – Due to its capability to cover a wide area of signal, it makes it cost-efficient.
These are some of the perks you can enjoy when you decided to utilize PCBTok’s Radar PCB for your applications. Simply connect with us for any additional inquiries you may have.
Fundamental Parts of PCBTok's Radar PCB
The following parts are what comprise PCBTok’s Radar PCB:
- Transmitter – It generates and transmits electromagnetic waves that carry signals.
- Waveguides – It is responsible for transmitting the signals generated by radar.
- Antenna – This is responsible for converting RF fields into AC and vice-versa.
- Duplexer – It enables the use of a single antenna by transmitters and receivers functioning at various frequencies.
- Receiver – It picks up transmitted signals from various sources.
- Threshold Decision – It can identify the presence of nearby objects.
You can contact us if you want more specific information about these.
Radar PCB's Classification
The Radar PCB is classified into five (5) types; here are all of them:
- Doppler – It can detect the data velocity of an object at a certain distance using the technique called the Doppler Effect.
- Monopulse– This uses radar pulse to contrast the current signal to previous data.
- Passive – It is a sensing tool that analyzes data on ambient lighting.
- Weather – It determines the climate and wind direction through polarization.
- Pulsed – It has quite similarities with Monopulse; however, it uses Doppler Shift Technique to detect moving objects through the echoed signal.
Send us a mail if you’d like a more comprehensive explanation of each.
Fabricating Remarkable Radar PCB is PCBTok's Strength
Radar PCB from PCBTok has undergone a number of testing and evaluations to determine its capabilities. These are done to make sure that all of your radar PCBs can operate smoothly and to their full capability.
PCBTok has acquired all of the accredited certifications and always complies with the standard regulations in order to serve you a worthy and quality Radar PCB.
To give you a Radar PCB that you can use for a long period, we are continually developing our knowledge in this field. Even though we have been in the business for more than twelve years, we are constantly honing our abilities to give you the best.
Our success comes from your satisfaction; hence, we always strive to fulfill all of your demands in your Radar PCB applications.
Radar PCB Fabrication
We at PCBTok value our consumers; hence, we want to share with you the phases in designing your Radar PCB.
Designing a Radar PCB is simple. Some of it can be performed by you depending on your preference; but, we can also perform it.
The process goes through Conceptualization, schematic diagram, creating block diagram, manufacturing process, component placement, and circuit routing.
After all of the mentioned phases, it will be subjected to various testing and inspections to assure that they are capable of fulfilling its designated duty and they are of high quality.
Simply shoot us a message and we’ll get back to you with more information about this.
It was mentioned in the designing phase of the Radar PCB that we conduct various inspections to determine the capability of your board.
Due to our passion to deliver you a high-quality exceptional experience with us, we want to share with you the failure analysis we conduct.
PCBTok conducts cross-sectioning, solderability examination, contamination testing, scanning electron microscopy, and x-ray examination.
All of these are crucial in determining the success of your Radar PCB when applied to various devices. As a result, we thoroughly conduct this to your board to assure they are quality products.
Just message us if you want more information on the purpose of each test mentioned.
OEM & ODM Radar PCB Applications
Radar PCBs detect specific objects in the air with enhanced accuracy, they are commonly used in military identification devices such as for missile detection.
One classification of a Radar PCB is the weather; it can determine the weather condition through polarization, they are widely used in maintaining air traffic.
With Radar PCB’s capability to navigate accurately, and enhanced accuracy of tracking and monitoring space devices, they are deployed in many space applications.
The utilization of Radar PCB has become popular in industrial applications including automatic door openers, fire detection devices, and industrial control systems.
One of the perks of using Radar PCB is its capability to accommodate a large volume of data at high frequency; thus, they are frequently used in radio communications.
Radar PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Radar PCB: The Ultimate FAQ Guide
Solderability testing is one of the most important ways to test the quality of components in a radar PCB. The entire radar PCB manufacturing process takes place in a clean environment, but contamination can still be present. In fact, contamination is the most common cause of performance failures. Scanning electron microscopy is one of the most accurate testing methods, and many consumers prefer it over other types of microscopes.
Radar PCBs are commonly used for distance measurement, velocity detection, and object identification. The antenna structure sends and receives these signals. The antenna is made of RF-based material and is used to transmit radar flaps and receive reflected signals from the object. The circuit analyzes the reflected signals to determine the distance, speed, and direction of the object. This is accomplished by using two antennas: one as a transmitter and one as a receiver.
Radar PCB design is fraught with difficulties. Because the radar PCB contains embedded RF circuitry, it is difficult to simulate the entire PCB. Therefore, PCB designers must use their own design tools to solve these problems. Fortunately, radar PCB simulation tools can make RF design easier. The Ultimate FAQ Guide explains the nuances of radar PCB simulation and how to assess the RF build quality of PCB manufacturers.